Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

Abstract: The embodiments of the present disclosure provide a wearable device including a wearable body and at least one inductive sensor. The at least one inductive sensor includes an inductive structure wound by a conductive wire. The at least one inductive sensor may be attached to the wearable body at a position corresponding to the joint position of the user, and the inductive structure may generate a varying inductance in response to a deformation at the joint position.

Abstract: The embodiments of the present disclosure disclose a wearable apparatus, comprising: a wearable body. A plurality of inductive sensors may be distributed on the wearable body. The plurality of inductive sensors include a plurality of inductive sensors crossing a joint contour. Each of the plurality of inductive sensors includes an inductive structure that is enclosed by a conductive wire. Each of the plurality of inductive sensors is attached to a position of the wearable body corresponding to a joint position and generates variable inductances with deformations of the joint position.

Abstract: One or more embodiments of the present disclosure relate to a human body posture recognition system, comprising: at least one group of ultrasonic sensors, each group of ultrasonic sensors including an ultrasonic transmitter configured to transmit ultrasonic waves and an ultrasonic receiver configured to receive the ultrasonic waves. The ultrasonic transmitter and the ultrasonic receiver are located at different parts of the body of a user, respectively; and a processor configured to, on the basis of location information of the ultrasonic transmitter and the ultrasonic receiver, information of the ultrasonic waves transmitted by the ultrasonic transmitter, and information of the ultrasonic waves received by the ultrasonic receiver, recognize the posture of the user.

Abstract: A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.

Abstract: A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.

Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

Abstract: The present disclosure provides a microphone, comprising a vibration pickup assembly configured to generate vibration; at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal; at least one sampling module configured to convert electrical signals output by different acoustoelectric conversion elements of the at least two acoustoelectric conversion elements into digital signals, wherein, each of the at least two acoustoelectric conversion element has a resonant frequency, and a difference between resonant frequencies of two of the at least two acoustoelectric conversion elements is greater than 1000 Hz.

Abstract: Embodiments of the present disclosure provide a signal acquisition circuit. The signal acquisition circuit includes a differential amplifier, a first electrode, a second electrode, a first negative capacitance circuit, and a second negative capacitance circuit. The first electrode is connected to a first input terminal of the differential amplifier through a first lead, and the second electrode is connected to a second input terminal of the differential amplifier through a second lead. The first negative capacitance circuit is electrically connected to the first lead and ground, and the second negative capacitance circuit is electrically connected to the second lead and the ground. Both the first negative capacitance circuit and the second negative capacitance circuit exhibit a negative capacitance effect.

Abstract: The present disclosure provides a microphone, comprising a shell structure, a vibration pickup assembly, a vibration pickup assembly, wherein the vibration pickup assembly is accommodated in the shell structure and generates vibration in response to an external sound signal transmitted to the shell structure, and at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal, wherein the at least two acoustoelectric conversion elements have different frequency responses to the vibration of the vibration pickup assembly.

Abstract: Vibration sensors are provided. The vibration sensor may include: a vibration assembly, the vibration assembly including a mass element and an elastic element, and the mass element being connected to the elastic element; a first acoustic cavity, the elastic element constituting one of sidewalls of the first acoustic cavity, and the vibration assembly vibrating to make a volume of the first acoustic cavity change in response to an external vibration signal; an acoustic transducer, the acoustic transducer being in communication with the first acoustic cavity and the acoustic transducer generating an electrical signal in response to a volume change of the first acoustic cavity; and a buffer, the buffer limiting a vibration amplitude of the vibration assembly, wherein the acoustic transducer has a first resonance frequency, the vibration assembly has a second resonance frequency, and the second resonance frequency of the vibration assembly is smaller than the first resonance frequency.

Abstract: The present disclosure provides a vibration component. The vibration component may include: a mass element; and an elastic element, the elastic element including a connection region and a first preprocessing region, wherein the connection region is configured to support the mass element; and a deformation quantity of the first preprocessing region is greater than a deformation quantity of a region of the elastic element other than the first preprocessing region when the mass element vibrates.

Abstract: The present disclosure discloses a sensing device, comprising a sensor configured to convert a sound signal into an electrical signal, the sensor having a first resonant frequency; and a resonant system including a vibration pickup unit and configured to generate a vibration in response to a vibration of a housing of the sensing device. The vibration pickup unit may include at least an elastic diaphragm and a mass block. The elastic diaphragm may be connected to the housing the sensing device through a peripheral side of the elastic diaphragm. The mass block may be at least made of a polymer material. A first acoustic cavity may be defined between the elastic diaphragm and the sensor. When the housing of the sensing device generates a vibration in response to an external sound signal, the elastic diaphragm and the mass block may generate a vibration in response to the vibration of the housing of the sensing device.

Abstract: The present disclosure provides a vibration sensor including a vibration assembly including a mass element and an elastic element, a first acoustic chamber, an acoustic transducer, and a buffer member. In response to an external vibration signal, the vibration assembly vibrates such that a volume of the first acoustic chamber changes. The acoustic transducer is in communication with the first acoustic chamber. In response to a volume change of the first acoustic chamber, the acoustic transducer may generate an electrical signal. The buffer member is connected to the mass element or the elastic element. The buffer member reduces an impact force of the mass element acting on the elastic element during a vibration process of the vibration assembly. The acoustic transducer has a first resonance frequency, the vibration assembly has a second resonance frequency, and the second resonance frequency is less than the first resonance frequency.

Abstract: The embodiments of the present disclosure provide a sensor device, including: a sensor assembly with a first resonant frequency and a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity may be formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly may change a sound pressure in the acoustic cavity, and the sensor assembly may convert the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly may provide the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency may be in a range of 1000 Hz-10000 Hz.

Abstract: One or more embodiments of the present disclosure provide a vibration sensor. The vibration sensor may include a housing structure, an acoustic transducer, and a vibration unit. The acoustic transducer may be physically connected to the housing structure. An acoustic cavity may be formed at least partially by the housing structure and the acoustic transducer. The vibration unit may be configured to divide the acoustic cavity into a plurality of acoustic cavities. The plurality of acoustic cavities may include a first acoustic cavity. The first acoustic cavity may be in acoustic communication with the acoustic transducer. The vibration unit may include an elastic element and a mass element. The elastic element and the mass element may be located in the acoustic cavity, and the mass element may be connected to the housing structure or the acoustic transducer through the elastic element.

Abstract: A vibration sensor is provided and includes an acoustic transducer, a vibration component, and a housing. The vibration component is connected to the acoustic transducer and configured to transmit an external vibration signal to the acoustic transducer to generate an electrical signal. The housing is configured to accommodate the acoustic transducer and the vibration component and generate vibrations based on the external vibration signal. The vibration component and the acoustic transducer form a plurality of acoustic cavities including a first acoustic cavity spatially connected to the acoustic transducer. The vibration component causes a sound pressure change of the first acoustic cavity in response to the vibrations of the housing. The acoustic transducer generates an electrical signal based on the sound pressure change of the first acoustic cavity. The vibration component includes a first hole part through which the first acoustic cavity is spatially connected to other acoustic cavities.

Abstract: The present disclosure provides a sensing device, comprising: a housing, an accommodation cavity being provided inside the housing; a transduction unit, including a vibration-pickup structure used to pick up vibration of the housing to generate an electrical signal, wherein the transduction unit divides the accommodation cavity into a front cavity and a rear cavity located on opposite sides of the vibration-pickup structure, at least one of the front cavity or the rear cavity is filled with liquid, and the liquid is in contact with the vibration-pickup structure; and one or more pipeline structures, each pipeline structure being configured to connect the accommodation cavity to an outside of the housing, the liquid being at least partially located in the one or more pipeline structures.