Patents by Inventor Wenjun DENG
Wenjun DENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230353932Abstract: One of the embodiments of the present disclosure provides a sensor device, including: a housing and a transducer unit, wherein the housing has an accommodating cavity inside, the transducer unit includes a vibration pickup structure configured to pick up a vibration of the housing and produce an electrical signal, and the transducer unit in the accommodating cavity separates the accommodating cavity to form a front cavity and a rear cavity on opposite sides of the vibration pickup structure. At least one cavity of the front cavity and the rear cavity is filled with liquid, the liquid is in contact with the vibration pickup structure, and an air cavity is formed between the liquid and the housing.Type: ApplicationFiled: June 30, 2023Publication date: November 2, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Wenjun DENG, Yongshuai YUAN, Yujia HUANG, Xin QI, Fengyun LIAO
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Publication number: 20230345170Abstract: The present disclosure provides a microphone comprising: an acoustoelectric transducer configured to convert an sound signal to an electrical signal; an acoustic structure, the acoustic structure comprising a sound guiding tube and an acoustic cavity, the acoustic cavity being acoustically communicated with the acoustoelectric transducer and acoustically communicated with the outside of the microphone through the sound guiding tube; wherein the acoustic structure has a first resonant frequency, the acoustoelectric transducer has a second resonant frequency, and an absolute value of the difference between the first resonant frequency and the second resonant frequency is not greater than 1000 Hz.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Yujia HUANG, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
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Publication number: 20230319458Abstract: An embodiment of the present disclosure provides a vibration sensing device, which may include a vibration sensor and at least one vibration component. The vibration sensor has a first resonant frequency, at least one vibration component may be configured to transmit the received vibration to the vibration sensor, and the at least one vibration component may include a liquid arranged in the target cavity and a plate body forming a part of the cavity wall of the target cavity. The at least one vibration component may provide at least one second resonant frequency for the vibration sensing device, and at least one second resonant frequency may be different from the first resonant frequency.Type: ApplicationFiled: June 6, 2023Publication date: October 5, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Wenjun DENG, Yongshuai YUAN, Yujia HUANG, Xin QI, Fengyun LIAO
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Publication number: 20230300536Abstract: A vibration sensor and a microphone are provided. The vibration sensor includes a piezoelectric system and a capacitive system. The piezoelectric system includes a vibration component and a piezoelectric sensing component collecting a first electrical signal generated due to deformation of the vibration component. The capacitive system uses the vibration component in the piezoelectric system as a movable capacitive plate and a fixed substrate opposite to the vibration component to form a capacitive vibration sensor. The deformation of the vibration component changes a distance between the vibration component and the fixed substrate. A capacitive sensing component collects a second electrical signal generated due to the distance change. The capacitive sensing component is disposed in a region where the first electrical signal in the piezoelectric system is low, thereby better using space of the vibration sensor, and enhancing the second electrical signal without affecting output of the first electrical signal.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Applicant: Shenzhen Shokz Co., Ltd.Inventors: Wenjun DENG, Wenbing ZHOU, Yongshuai YUAN
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Publication number: 20230300519Abstract: Embodiments of the present disclosure provide a vibration sensor. The vibration sensor may include a transducer; and a vibration component connected with the transducer, wherein the vibration component may be configured to transmit an external vibration signal to the transducer to generate an electrical signal, and include one or more plate structures and one or more mass blocks physically connected with each of the one or more plate structures; and the vibration component may be further configured to make a sensitivity of the vibration sensor greater than a sensitivity of the transducer within one or more target frequency bands.Type: ApplicationFiled: May 24, 2023Publication date: September 21, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yongshuai YUAN, Wenjun DENG, Wenbing ZHOU, Yujia HUANG, Fengyun LIAO, Xin QI
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Publication number: 20230288250Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.Type: ApplicationFiled: May 19, 2023Publication date: September 14, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yongshuai YUAN, Wenjun DENG, Wenbing ZHOU, Yujia HUANG, Fengyun LIAO, Xin QI
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Publication number: 20230288251Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.Type: ApplicationFiled: May 22, 2023Publication date: September 14, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenjun DENG, Yongshuai YUAN, Wenbing ZHOU, Yujia HUANG
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Publication number: 20230247352Abstract: The present disclosure is of a bone conduction microphone. The bone conduction microphone comprises of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, the vibration unit deforms in response to the vibration of the base structure, and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. A resonant frequency of the bone conduction microphone is within a range of 2.5 kHz-4.5 kHz.Type: ApplicationFiled: February 15, 2023Publication date: August 3, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yongshuai YUAN, Wenbing ZHOU, Wenjun DENG
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Patent number: 11698292Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.Type: GrantFiled: July 13, 2022Date of Patent: July 11, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Wenjun Deng, Yongshuai Yuan, Wenbing Zhou, Yujia Huang
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Publication number: 20230217163Abstract: The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device includes of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.Type: ApplicationFiled: March 16, 2023Publication date: July 6, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG
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Publication number: 20230217147Abstract: A vibration sensor includes a vibration receiver and an acoustic transducer. The vibration receiver includes a housing and a vibration unit. The housing forms an acoustic cavity. The vibration unit is located in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer is acoustically connected to the first acoustic cavity. The housing is configured to generate vibration based on an external vibration signal. The vibration unit vibrates in response to the vibration of the housing and transmits, through the first acoustic cavity, the vibration to the acoustic transducer to generate an electrical signal. The vibrating unit includes a mass element and an elastic element. A deviation between cross-sectional areas of the mass element and the first acoustic cavity perpendicular to a vibration direction of the mass unit is less than 25%.Type: ApplicationFiled: March 9, 2023Publication date: July 6, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenjun DENG, Yongshuai YUAN, Wenbing ZHOU, Yujia HUANG, Jinbo ZHENG, Fengyun LIAO, Xin QI
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Publication number: 20230199360Abstract: A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer.Type: ApplicationFiled: February 22, 2023Publication date: June 22, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: WenJun DENG, Yongshuai YUAN, Yujia HUANG, Wenbing ZHOU, Fengyun LIAO, Xin QI
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Publication number: 20230199370Abstract: The present disclosure provides a vibration sensor. The vibration sensor may include a vibration receiver and an acoustic transducer. The vibration receiver may include a housing, a limiter and a vibration unit. The housing and the acoustic transducer may form an acoustic cavity. The vibration unit may be located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The housing may be configured to generate a vibration based on an external vibration signal. The vibration unit may change an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal. The vibration unit may include a mass element and an elastic element. A first side of the elastic element may be connected around a side wall of the mass element.Type: ApplicationFiled: February 14, 2023Publication date: June 22, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenjun DENG, Yongshuai YUAN, Yujia HUANG, Wenbing ZHOU, Fengyun LIAO, Xin QI
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Publication number: 20230188911Abstract: The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device comprises a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. A base structure is configured to load the laminated structure, and at least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.Type: ApplicationFiled: February 9, 2023Publication date: June 15, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
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Patent number: 11662248Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.Type: GrantFiled: July 25, 2022Date of Patent: May 30, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Yongshuai Yuan, Wenjun Deng, Wenbing Zhou, Yujia Huang, Fengyun Liao, Xin Qi
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Patent number: 11585825Abstract: Disclosed is a wind speed sensor based on a flexible inductor and a silicon-based inductor, which relates to a MEMS device and belongs to the field of measurement and testing technologies. The wind speed sensor is a double-layer inductor structure composed of a flexible inductor and a silicon-based inductor. A metal layer of the flexible inductor and a metal layer of the silicon-based inductor face to each other and form, between them, an air cavity sufficient for mutual induction of electromotance. A contact block constituting a measuring port is deposited in the metal layer of the silicon-based inductor. The present invention has a light structure, and implements wind speed detection based on the Bernoulli effect and the coil mutual inductance effect.Type: GrantFiled: September 26, 2019Date of Patent: February 21, 2023Assignee: SOUTHEAST UNIVERSITYInventors: Zhenxiang Yi, Yu Wang, Wenjun Deng, Lifeng Wang, Ming Qin, Qingan Huang
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Publication number: 20230049441Abstract: The embodiments of the present disclosure disclose a system and method. The system may include at least one storage device configured to storage computer instruction; and at least one processor, in communication with the storage device. When executing the computer instructions, the at least one processor is configured to direct the system to perform operations including: obtaining a sensing signal of at least one sensing device; identifying a signal feature of the sensing signal; and determining, based on the signal feature, an operation of a target object associated with the at least one sensing device.Type: ApplicationFiled: July 21, 2022Publication date: February 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yongshuai YUAN, Wenjun DENG, Wenbing ZHOU, Yujia HUANG, Fengyun LIAO, Xin QI
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Publication number: 20230045906Abstract: The present disclosure provides a microphone including at least one acoustoelectric transducer and an acoustic structure. The acoustoelectric transducer is configured to convert a sound signal to an electrical signal. The acoustic structure includes a sound guiding tube and an acoustic cavity. The acoustic cavity is in acoustic communication with the acoustoelectric transducer, and is in acoustic communication with outside of the microphone through the sound guiding tube. The acoustic structure has a first resonance frequency, the acoustoelectric transducer has a second resonance frequency, and an absolute value of a difference between the first resonance frequency and the second resonance frequency is not less than 100 Hz. By disposing different acoustic structures, resonance peaks in different frequency ranges may be added to the microphone, which improves a sensitivity of the microphone near multiple resonance peaks, thereby improving a sensitivity of the microphone in the entire wide frequency band.Type: ApplicationFiled: July 29, 2022Publication date: February 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Yujia HUANG, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
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Publication number: 20230049593Abstract: The present disclosure provides a microphone, comprising a shell structure, a vibration pickup assembly, a vibration pickup assembly, wherein the vibration pickup assembly is accommodated in the shell structure and generates vibration in response to an external sound signal transmitted to the shell structure, and at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal, wherein the at least two acoustoelectric conversion elements have different frequency responses to the vibration of the vibration pickup assembly.Type: ApplicationFiled: July 29, 2022Publication date: February 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG, Yujia HUANG, Xin QI, Fengyun LIAO
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Publication number: 20230047687Abstract: The present disclosure may provide a microphone. The microphone may include: a shell structure and a vibration pickup portion, wherein the vibration pickup portion may generate vibration in response to vibration of the shell structure; the vibration transmission portion may be configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of vibration pickup portion may form a vacuum cavity, and the acoustic-electric conversion component may be located in the vacuum cavity.Type: ApplicationFiled: July 29, 2022Publication date: February 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Wenbing ZHOU, Yujia HUANG, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO