Patents by Inventor Wen-Ming Chen

Wen-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978526
    Abstract: A data processing circuit and a fault mitigating method are provided. The method is adapted for a memory having at least one fault bit. The memory provides a block for data storage. A difference between an output of a value of a plurality of bits input to at least one computing layer in a neural network and a correct value is determined. The bits are respectively considered the at least one fault bit. A repair condition is determined based on the difference. The repair condition includes a correspondence between a position where the fault bit is located in the block and at least one non-fault bit in the memory. A value of at least one non-fault bit of the memory replaces a value of the fault bit based on the repair condition.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: May 7, 2024
    Assignee: Skymizer Taiwan Inc.
    Inventors: Shu-Ming Liu, Kai-Chiang Wu, Chien-Fa Chen, Wen Li Tang
  • Publication number: 20240141922
    Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20240136324
    Abstract: A semiconductor manufacturing method is provided. The semiconductor manufacturing method includes the following steps. A first semiconductor element with a bonding film and a first stressing film is formed. The first bonding film and the first stressing film are formed on two opposite sides of the first semiconductor element. The first stressing film makes the first bonding film to have a first convex surface. A second semiconductor element with a second bonding film is formed. The second bonding film is formed on one side of the second semiconductor element. The first semiconductor element and the second semiconductor element are bonded by bonding the first bonding film and the second bonding film.
    Type: Application
    Filed: January 19, 2023
    Publication date: April 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Chih CHIOU, Yen-Ming CHEN, Yung-Chi LIN
  • Publication number: 20240138098
    Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
  • Patent number: 11968800
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
  • Publication number: 20240127944
    Abstract: A fatigue data generation method, comprising: obtaining, by the camera device, a target image; obtaining, by a processor, a target feature data from the target image, and inputting the target feature data to a fatigue analysis model which stored in a storage unit, wherein the fatigue analysis model comprises a plurality of reference physiological signals, a plurality of reference feature data, a plurality of reference fatigue data and a plurality of correlation parameters; and generating a target fatigue data according to the target feature data, the plurality of reference feature data and the plurality of correlation parameters.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 18, 2024
    Inventors: Wen-Chien HUANG, Hong-En CHEN, Hsiao-Chen CHANG, Jing-Ming CHIU
  • Patent number: 11943584
    Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: March 26, 2024
    Assignee: FORTEMEDIA, INC.
    Inventors: Chih-Yuan Chen, Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Nai-Hao Kuo
  • Patent number: 11942543
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
  • Patent number: 11935947
    Abstract: An enhancement mode high electron mobility transistor (HEMT) includes a group III-V semiconductor body, a group III-V barrier layer and a gate structure. The group III-V barrier layer is disposed on the group III-V semiconductor body, and the gate structure is a stacked structure disposed on the group III-V barrier layer. The gate structure includes a gate dielectric and a group III-V gate layer disposed on the gate dielectric, and the thickness of the gate dielectric is between 15 nm to 25 nm.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: March 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, Chun-Ming Chang, Bo-Rong Chen, Shin-Chuan Huang, Wen-Jung Liao, Chun-Liang Hou
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Patent number: 11920237
    Abstract: The present disclosure provides a multifunction chamber having a multifunctional shutter disk. The shutter disk includes a lamp device, a DC/RF power device, and a gas line on one surface of the shutter disk. With this configuration, simplifying the chamber type is possible as the various specific, dedicated chambers such as a degas chamber, a pre-clean chamber, a CVD/PVD chamber are not required. By using the multifunctional shutter disk, the degassing function and the pre-cleaning function are provided within a single chamber. Accordingly, a separate degas chamber and a pre-clean chamber are no longer required and the overall transfer time between chambers is reduced or eliminated.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • Patent number: D1021775
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 9, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1021776
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 9, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1021777
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 9, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1021778
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 9, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1021779
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 9, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1022882
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 16, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1022883
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 16, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1022884
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 16, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen
  • Patent number: D1022885
    Type: Grant
    Filed: November 13, 2022
    Date of Patent: April 16, 2024
    Inventors: Yu-Shuo Fan, Wen-Ming Wu, Shu-Fen Ke, Yung-Sung Chen