Patents by Inventor Wenning Wei
Wenning Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240427935Abstract: The present disclosure provides a method and an electronic apparatus for masking data on an electronic document. The method is performed by the electronic apparatus and includes: displaying the electronic document on a user interface; causing at least one analysis module to perform at least one analysis on the electronic document and a plurality of strings of the electronic document and output a first string among the plurality of strings and first position information associated with the first string according to a result of the at least one analysis; obtaining the first string and the first position information from the at least one analysis module; and generating, based on the first position information and the first string, a first masking object to mask the first string on the electronic document.Type: ApplicationFiled: June 21, 2024Publication date: December 26, 2024Inventors: KANG-HUA HE, Yu-Chi Chen, Chia-Ting Lee, Wen-Wei Lin, Ching-Yi Chiang, Hsin-Yu Huang, Chun-Chin Su, Po-Chou Su, Sin-Jie Wang, Tso-Kuan Lee, Kai-Lin Shih
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Publication number: 20240405121Abstract: The present disclosure provides a split gate MOSFET and a manufacturing method thereof. An epitaxy layer with a first conductivity type is formed on a substrate. A plurality of trenches are formed in the epitaxy layer. Impurities with a second conductive type is implanted and driven to the trenches to form a plurality of first doping areas. Since the first doping areas and none-doping areas of the epitaxy layer are alternately arranged with each other, and the first conductive type and the second conductive type are different conductivity types selected from P type or N type, the split gate MOSFET including the super junction structure is manufactured, and the advantages of simplifying manufacturing process, reducing cost and greatly reducing the on-resistance are achieved.Type: ApplicationFiled: January 25, 2024Publication date: December 5, 2024Inventors: Chia-Ming Kou, Cin-Hua Jheng, Wen-Wei Shih, Cheng-Wei Hsu, Hsien-Yi Cheng
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Patent number: 12154275Abstract: Immune context scores are calculated for tumor tissue samples using continuous scoring functions. Feature metrics for at least one immune cell marker are calculated for a region or regions of interest, the feature metrics including at least a quantitative measure of human CD3 or total lymphocyte counts. A continuous scoring function is then applied to a feature vector including the feature metric and at least one additional metric related to an immunological biomarker, the output of which is an immune context score. The immune context score may then be plotted as a function of a diagnostic or treatment metric, such as a prognostic metric (e.g. overall survival, disease-specific survival, progression-free survival) or a predictive metric (e.g. likelihood of response to a particular treatment course). The immune context score may then be incorporated into diagnostic and/or treatment decisions.Type: GrantFiled: August 29, 2023Date of Patent: November 26, 2024Assignee: Ventana Medical Systems, Inc.Inventors: Michael Barnes, Joerg Bredno, Rebecca C. Bowermaster, Srinivas Chukka, Wen-Wei Liu, Kandavel Shanmugam, Junming Zhu
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Publication number: 20240387311Abstract: Semiconductor package includes interposer, dies, encapsulant. Each die includes active surface, backside surface, side surfaces. Backside surface is opposite to active surface. Side surfaces join active surface to backside surface. Encapsulant includes first material and laterally wraps dies. Dies are electrically connected to interposer and disposed side by side on interposer with respective backside surfaces facing away from interposer. At least one die includes an outer corner. A rounded corner structure is formed at the outer corner. The rounded corner structure includes second material different from first material. The outer corner is formed by backside surface and a pair of adjacent side surfaces of the at least one die. The side surfaces of the pair have a common first edge. Each side surface of the pair does not face other dies and has a second edge in common with backside surface of the at least one die.Type: ApplicationFiled: July 26, 2024Publication date: November 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang
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Patent number: 12148678Abstract: Semiconductor package includes interposer, dies, encapsulant. Each die includes active surface, backside surface, side surfaces. Backside surface is opposite to active surface. Side surfaces join active surface to backside surface. Encapsulant includes first material and laterally wraps dies. Dies are electrically connected to interposer and disposed side by side on interposer with respective backside surfaces facing away from interposer. At least one die includes an outer corner. A rounded corner structure is formed at the outer corner. The rounded corner structure includes second material different from first material. The outer corner is formed by backside surface and a pair of adjacent side surfaces of the at least one die. The side surfaces of the pair have a common first edge. Each side surface of the pair does not face other dies and has a second edge in common with backside surface of the at least one die.Type: GrantFiled: July 26, 2022Date of Patent: November 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang
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Publication number: 20240363587Abstract: A package structure includes a circuit substrate and a semiconductor device. The semiconductor device is disposed on and electrically connected to the circuit substrate. The semiconductor device includes an interconnection structure, a semiconductor die, an insulating encapsulant, a protection layer and electrical connectors. The interconnection structure has a first surface and a second surface. The semiconductor die is disposed on the first surface and electrically connected to the interconnection structure. The insulating encapsulant is encapsulating the semiconductor die and partially covering sidewalls of the interconnection structure. The protection layer is disposed on the second surface of the interconnection structure and partially covering the sidewalls of the interconnection structure, wherein the protection layer is in contact with the insulating encapsulant.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou
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Patent number: 12099177Abstract: A lens-free microscopic imaging system (11), which is used to image microbeads (15) with pattern codes, includes an illumination system (11a) and an imaging system (11b). The illumination system (11a) includes an illumination light source (111) and an excitation light source (112). The imaging system (11b) includes an image sensor (113). The illumination light source (111) is used to emit illumination light to irradiate the microbeads (15), causing the irradiated microbeads (15) to be imaged on the image sensor. The excitation light source (112) is used to emit excitation light to excite the microbeads (15) to generate specific signals. The image sensor (113) is used to collect the images of the microbeads (15) and the specific signals to generate images. The imaging system (11) does not require a lens system. The present disclosure improves a detection efficiency of the microbeads (15).Type: GrantFiled: April 8, 2020Date of Patent: September 24, 2024Assignee: BGI SHENZHENInventors: Qing Xie, Wei-Mao Wang, Wen-Wei Zhang, Mengzhe Shen
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Publication number: 20240312967Abstract: A display panel including a substrate, a light-emitting device, a light-shielding layer, and a light-guide pillar is provided. The light-emitting device is disposed on the substrate. The light-shielding layer is disposed on the substrate and has a sidewall surrounding an opening. The light-guide pillar is disposed between the substrate and the light-emitting device and located in the opening. A gap exists between the light-guide pillar and the sidewall of the light-shielding layer.Type: ApplicationFiled: May 27, 2024Publication date: September 19, 2024Applicant: AUO CorporationInventors: Fang-Cheng Yu, Wen-Wei Yang, Cheng-Yeh Tsai
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Publication number: 20240310972Abstract: A planning method for a displaying device, comprising: read and decode a device description file with a host of a planning system; display a planning interface on a screen via the host; take an object configuration step to configure at least one graphical object to the at least one display page and set an object parameter of the at least one graphical object; generate a corresponding graphical user interface configuration file via the host. When the planning system is connected to the displaying device, the host transmits the graphical user interface configuration file to the displaying device. A microcontroller of the displaying device displays a corresponding graphical user interface on the displaying module based on the graphical user interface configuration file. In this way, the operation time for the user to plan the graphical user interface could be effectively saved.Type: ApplicationFiled: August 8, 2023Publication date: September 19, 2024Applicant: WINSTAR DISPLAY CO., LTD.Inventors: YU-PIN LIAO, CHIEN-CHOU HSU, CHIA-HSIANG NI, WEN-WEI CHUNG, SSU-TSUNG CHEN, YING-SHUN LIAO, YEN-HUA LIAO
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Publication number: 20240303432Abstract: There is provided a method for determining text blocks of a PDF text, including: acquiring information of characters of the PDF text; performing an initial division according to gap outliers of the PDF text in a transverse direction and a longitudinal direction, and adding block tags of first text blocks to the information of characters; sequentially processing inaccurate lines and inaccurate words in each first text block according to baselines of characters, character lengths, character spaces and character indexes; performing a baseline arrangement on lines of the PDF text; sequentially comparing two lines to form second text blocks; and sequentially comparing two second text blocks to identify whether to perform a secondary merging and a secondary division.Type: ApplicationFiled: December 1, 2023Publication date: September 12, 2024Inventors: SHENG-JUN LU, ZHI-PENG LUO, SHUAI WANG, PO-CHOU SU, WEN-WEI LIN
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Patent number: 12080681Abstract: A package structure includes a circuit substrate and a semiconductor device. The semiconductor device is disposed on and electrically connected to the circuit substrate. The semiconductor device includes an interconnection structure, a semiconductor die, an insulating encapsulant, a protection layer and electrical connectors. The interconnection structure has a first surface and a second surface. The semiconductor die is disposed on the first surface and electrically connected to the interconnection structure. The insulating encapsulant is encapsulating the semiconductor die and partially covering sidewalls of the interconnection structure. The protection layer is disposed on the second surface of the interconnection structure and partially covering the sidewalls of the interconnection structure, wherein the protection layer is in contact with the insulating encapsulant.Type: GrantFiled: June 30, 2022Date of Patent: September 3, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou
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Patent number: 12066491Abstract: A device and method for detecting an inter-turn electromagnetic pulse vibration wave characteristic of a turbogenerator rotor winding are provided. A signal source and a time sequence control circuit generate a high-potential abrupt electric field; circularly polarized electromagnetic waves generated by a parasitic inductive power supply and symmetrically deflecting by 180° are respectively coupled to a positive electrode and a negative electrode clockwise or counter-clockwise; a first turn on the positive electrode and a first turn on the negative electrode are mutually induced; as time goes by, energy is returned to the parasitic inductive power supply, and is sequentially conducted to a second turn; the parasitic inductive power supply and the second turn further start feeding back energy to the first turn in circular polarization; all turns sequentially perform feedback and superposition one another stage by stage; and all coupling turns show sinusoidal waves with a same time constant.Type: GrantFiled: April 15, 2022Date of Patent: August 20, 2024Assignee: HANGZHOU HENUOVA TECHNOLOGY CO., LTD.Inventors: Yuewu Zhang, Kunpeng Tian, Qianyi Zhang, Weihua Zha, Hong Liu, Xiaohui Cao, Xueliang Wang, Dongbing Liu, Jiamin Li, Chicheng Liu, Zhen Lyu, Chen Fan, Miaoye Li, Wen Wei, Zirui Wang
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Publication number: 20240255573Abstract: A device and method for detecting an inter-turn electromagnetic pulse vibration wave characteristic of a turbogenerator rotor winding are provided. A signal source and a time sequence control circuit generate a high-potential abrupt electric field; circularly polarized electromagnetic waves generated by a parasitic inductive power supply and symmetrically deflecting by 180° are respectively coupled to a positive electrode and a negative electrode clockwise or counter-clockwise; a first turn on the positive electrode and a first turn on the negative electrode are mutually induced; as time goes by, energy is returned to the parasitic inductive power supply, and is sequentially conducted to a second turn; the parasitic inductive power supply and the second turn further start feeding back energy to the first turn in circular polarization; all turns sequentially perform feedback and superposition one another stage by stage; and all coupling turns show sinusoidal waves with a same time constant.Type: ApplicationFiled: April 15, 2022Publication date: August 1, 2024Applicant: HANGZHOU HENUOVA TECHNOLOGY CO., LTD.Inventors: Yuewu ZHANG, Kunpeng TIAN, Qianyi ZHANG, Weihua ZHA, Hong LIU, Xiaohui CAO, Xueliang WANG, Dongbing LIU, Jiamin LI, Chicheng LIU, Zhen LYU, Chen FAN, Miaoye LI, Wen WEI, Zirui WANG
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Publication number: 20240260281Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a molded memory device may include multiple stacked NAND dies electrically coupled to one another via multiple wire bonds. The molded memory device may include a molded casing surrounding the multiple stacked NAND dies and encapsulating the multiple wire bonds, with the molded casing including a first mold surrounding a first portion of a first NAND die, of the multiple stacked NAND dies, and a second mold partially surrounding a second portion of the first NAND die and each additional NAND die, of the multiple NAND dies. The molded memory device may include multiple copper contacts configured to couple the molded memory device to a substrate associated with a system in package, with the plurality of copper contacts being disposed in the first mold.Type: ApplicationFiled: January 8, 2024Publication date: August 1, 2024Inventors: Wen Wei LUM, Kelvin Aik Boo TAN, Seng Kim YE
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Publication number: 20240248129Abstract: A circuit board detection device includes a base, a stage assembly, a first gantry support, and a first probe assembly. The stage assembly is arranged on the base and includes a linear drive module, a rotary motor, and a platform. The platform is configured to carry a circuit board and can be driven by the linear drive module to move along a first axial direction. The platform can also be driven by the rotary motor to rotate relative to a first rotation axis. The first gantry support is fixed on the base and includes a first beam. The first beam extends along a second axial direction perpendicular to the first axial direction to span over the linear drive module, and includes a first probe guide rail. The first probe assembly is arranged on the first probe guide rail to be movable along the second axial direction.Type: ApplicationFiled: January 8, 2024Publication date: July 25, 2024Applicant: MPI CorporationInventors: Wen-Wei Lin, Wen-Chung Lin, Chia-Nan Chou, Huang-Huang Yang, Yu-Tse Wang, Wei-Heng Hung, Ya-Hung Lo, Shou-Jen Tsai, Fuh-Chyun Tang
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Publication number: 20240202428Abstract: There is provided a method for processing tables in a PDF file, including: parsing the PDF file to obtain coordinates of start points and end points of all transverse line sections and longitudinal line sections; obtaining coordinates of crosspoints of all line sections and recording coordinates of line sections that form the crosspoints; calculating all unit grids according to the coordinates of the crosspoints and the coordinates of the line sections; and filling every character respectively into a corresponding unit grid according to character coordinates obtained in parsing the PDF file.Type: ApplicationFiled: November 9, 2023Publication date: June 20, 2024Inventors: SHENG-JUN LU, WEN-ZHONG YIN, CHAO WANG, PO-CHOU SU, WEN-WEI LIN
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Publication number: 20240202429Abstract: There is provided a device for editing a PDF file, including a display, a non-volatile storage medium, a memory and a processor. The non-volatile storage medium stores a computer program. The memory provides an environment for operations of the computer program in the non-volatile storage medium. The processor runs the computer program to parse the PDF file to obtain information of characters, generate character sets according to features of the characters, generate line sets according to heights and horizontal positions of the character sets, generate paragraph sets according to a height and a horizontal position of each line of the line sets, generate text region sets according a height and a horizontal position of each paragraph of the paragraph sets, and control the display to show the text region sets in the PDF file as editable text regions.Type: ApplicationFiled: September 27, 2023Publication date: June 20, 2024Inventors: SHENG-JUN LU, GUO-LIN JIA, CHAO WANG, YUAN TAO, WEN-WEI LIN
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Patent number: 11992322Abstract: A heart rhythm detection method and system by using radar sensor is capable of collecting an original signal using a radar sensor toward at least one subject, and converting the original signal to a two dimensional image information (i.e., spectrogram) using the concept of image vision. Then, the neural network automatically learns which heartbeat frequency should be focused on and which heartbeat frequency should be filtered out in the two dimensional image information through deep learning, so that the heartbeat frequencies can be extracted effectively.Type: GrantFiled: March 30, 2021Date of Patent: May 28, 2024Assignee: IONETWORKS INC.Inventors: Jing-Ming Guo, Ting Lin, Chia-Fen Chang, Jeffry Susanto, Yi-Hsiang Lin, Po-Cheng Huang, Yu-Wen Wei
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Publication number: 20240128523Abstract: The present invention discloses a multi-contact battery structure comprising at least one battery cell and a protection circuit module. The cell comprises a cell body and a first connection end and a second connection end disposed on different sides of the cell body. The protection circuit module is connected to the first or second connection end. Using the above-mentioned components, a plurality of battery cells are connected through the first or second connection end of each cell body according to the needs of different battery capacities, to form an electrically parallel connection and a battery assembly with different rated capacities, further to form a battery module assembly by the combination, to reduce the waste of electronic products and the carbon emission from the factory production process, to achieve the goal of global environmental protection.Type: ApplicationFiled: October 17, 2022Publication date: April 18, 2024Inventor: WEN-WEI CHANG
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Publication number: 20240112688Abstract: The present disclosure provides an audio compression device, an audio compressing system and an audio compression method. The audio compression device comprises a first transceiver and a first processor. The first transceiver is connected to the first processor. The processor obtains an audio signal and an available bandwidth, and the processor performs an audio compression encoding on the audio signal to obtain a sample audio signal, and then compares with the audio signal and the sample audio signal to generate a residual signal, and the residual signal is transmitted according to the available bandwidth. The audio signal can be completely transmitted to an audio decompression device to reduce the distortion of the audio signal.Type: ApplicationFiled: October 4, 2022Publication date: April 4, 2024Applicant: SAVITECH CORP.Inventors: Sing-Ban Robert TIEN, Wen-Wei KANG, Wu-Lin CHANG, Chi-Feng HUANG, Lee-Chang PANG