Abstract: A battery cell includes a housing having an opening, an end cap assembly for closing the opening and including an end cap body and an electrode terminal connected to the end cap body in an insulating manner, and an electrode assembly arranged in the housing and being of a wound structure and including: a wound main body, a first tab and a second tab, the first tab and the second tab having opposite polarities and being connected to the same side of the wound main body along a winding axis of the wound structure. The first tab is electrically connected to the electrode terminal, and the second tab is electrically connected to the end cap body.

Abstract: A photoelectric transceiver assembly includes: an electronic integrated circuit, including a first surface, a second surface opposite to the first surface, and a first sidewall located between the first surface and the second surface; a molding compound, performing molding on the electronic integrated circuit around the first sidewall, where the molding compound includes a third surface close to the first surface and a fourth surface close to the second surface, and the molding compound is provided with one or more through mold vias extending from the third surface to the fourth surface; a first redistribution layer, disposed on the first surface and the third surface and including a plurality of first bumps electrically coupled to the first surface and the one or more through mold vias; a second redistribution layer, disposed on the second surface and the fourth surface.

Abstract: A semiconductor die is provided. The semiconductor die includes a D2D transceiver composed of a single die or dual dies. The D2D transceiver includes a first D2D transmitter and a first D2D receiver. The D2D transmitter is configured to send data to a second D2D receiver in a second D2D transceiver of another semiconductor die using a first reference clock signal. The D2D receiver is configured to receive data from a second D2D transmitter in the second D2D transceiver using a second reference clock signal. Through using the embodiments of the disclosure, a transmission solution may be flexibly configured for a multi-application scenario including D2D.

Abstract: A packaging structure includes: a first redistribution structure, where a distribution layer is disposed in the first redistribution structure; a plastic packaging structure, where the plastic packaging structure wraps a surface of the first redistribution structure other than an upper surface, and each of the at least one through via penetrates an upper surface and a lower surface of the plastic packaging structure; and a first chip and a second chip, where the first chip and the second chip are disposed above the first redistribution structure and the plastic packaging structure, the first chip is connected to the second chip by using the distribution layer, and at least a part of lead-out ends of the first chip and at least a part of lead-out ends of the second chip are led from the upper surface of the plastic packaging structure to the lower surface.

Abstract: A domestic waste incineration fly ash treatment system is provided, suitable for clean and efficient treatment of municipal solid waste incineration fly ash, and includes a three-stage water washing subsystem, a filtrate post-treatment subsystem, an MVR evaporation salt production subsystem, a pressure filtration subsystem, and a filter cake post-treatment subsystem.

Abstract: An assembled subway station and a construction method thereof are provided. The assembled subway station includes a plurality of components combined in a ring shape, comprising a bottom plate component, two bottom corner components, two side wall components, a middle plate component, two top corner components, and a top plate component. Connection surfaces of each component are each provided with a concave-convex structure being matched with another concave-convex structure on a relevant connection surface of an adjacent component. Butt joint positions of two adjacent components are filled with sealing structures. The embedded grooves of two adjacent components are oppositely arranged, and connecting members for exerting opposite fastening forces on the two adjacent components are installed in the oppositely arranged embedded grooves.

Abstract: A domestic waste incineration fly ash treatment system is provided, suitable for clean and efficient treatment of municipal solid waste incineration fly ash, and includes a three-stage water washing subsystem, a filtrate post-treatment subsystem, an MVR evaporation salt production subsystem, a pressure filtration subsystem, and a filter cake post-treatment subsystem.

Abstract: A connection assembly for prefabricated components provided herein includes two C-shaped groove members and an H-shaped connection member. The C-shaped groove members are each provided with a component connecting part for fixedly connecting with a component, the H-shaped connection member includes a middle web and two side flanges, notches of the C-shaped groove members are in clearance fit with the web, and the side flanges are in stop fit with inverted edges of the C-shaped groove members when the H-shaped connection member is inserted between the C-shaped groove members. The C-shaped groove members and/or the H-shaped connection member are each provided with wedge members, and the wedge members have wedge surfaces for guiding the two C-shaped groove members to be fastened oppositely.

Abstract: A nano scale robotic system for single cell DNA sequencing of a strand of DNA positioned on a slide utilizes an atomic force microscope (AFM) having an end effector in the form of a cantilever with a tip. The AFM causes its cantilever tip to scan over the base pairs of the DNA strand. A pair of spaced-apart electrodes at the tip makes contact with opposite sides of the DNA strand and the current between bases of the DNA strand is measured by a current measurement system connected to the electrodes. An artificial intelligence-based data analytic system determines the DNA sequence based on the current from the current measuring system. The AFM tip is guided over the DNA strand by comparing compressed desired intensity local scan images and compressed actual intensity local scan images and using the difference to control the location of the tip.

Abstract: The present invention provides a method for preparing an intermediate of florfenicol, comprising: reacting p-methylthiobenzaldehyde with isocyanoacetate under catalysis of a chiral catalyst. In the reaction, the chiral product is oxidized to form a methylsulfone-substituted product which is subsequently deformylized to obtain the intermediate. In the method of the present invention, the chiral center of the intermediate is directly generated in the first step of reaction, and the yield of the first step reaches 75%-80%, which is significantly higher than the conventional chiral resolution methods (about 40% yield), and the product has high chiral purity. The method of the present invention does not use anhydrous copper sulfate that pollutes the environment, which reduces the environmental pressure. The compound of p-methylthiobenzaldehyde and the compound of isocyanoacetate are used to react to form a chiral intermediate, which has higher material availability and efficiency than linear synthesis methods.

Abstract: A liquid crystal composition contains: at least one compound of general formula I and at least one polymerizable compound of general formula II. Such a liquid crystal composition has a suitable optical anisotropy, a suitable dielectric anisotropy, and a better pretilt angle consistency while maintaining a relatively high clearing point, and the drop mura is good. When the liquid crystal composition is applied to a PSA liquid crystal display, the liquid crystal composition has an excellent display effect.

Abstract: A connection assembly for prefabricated components provided herein includes two C-shaped groove members and an H-shaped connection member. The C-shaped groove members are each provided with a component connecting part for fixedly connecting with a component, the H-shaped connection member includes a middle web and two side flanges, notches of the C-shaped groove members are in clearance fit with the web, and the side flanges are in stop fit with inverted edges of the C-shaped groove members when the H-shaped connection member is inserted between the C-shaped groove members. The C-shaped groove members and/or the H-shaped connection member are each provided with wedge members, and the wedge members have wedge surfaces for guiding the two C-shaped groove members to be fastened oppositely. The integrated H-shaped connection member replaces multiple bolts to meet the requirements of high-strength connection, which simplifies the operation and improves the construction efficiency.

Abstract: The present invention relates to a millimeter wave radar component package, comprising: a box cover, having a metal layer arranged on inner surface of the box cover, the metal layer facing a channel of a box body, wherein a cavity is formed between the box cover and the box body; and the box body, comprising: a first insulator, connected with the box cover, wherein in the first insulator a channel is opened, and one end of the channel corresponds with the position of antenna and the other end is connected with the cavity; one or more chips, arranged on a second insulator in a flip manner and covered by the first insulator; the second insulator, arranged between the first insulator and a third insulator; the third insulator; and the antenna and conductive lines, arranged in the third insulator and connected with pads of the one or more chips through the second insulator, wherein the conductive lines are exposed from the third insulator for electrical contact.

Abstract: An assembled subway station and a construction method thereof are provided. The assembled subway station includes a plurality of components combined in a ring shape, comprising a bottom plate component, two bottom corner components, two side wall components, a middle plate component, two top corner components, and a top plate component. Connection surfaces of each component are each provided with a concave-convex structure being matched with another concave-convex structure on a relevant connection surface of an adjacent component. Butt joint positions of two adjacent components are filled with sealing structures. The embedded grooves of two adjacent components are oppositely arranged, and connecting members for exerting opposite fastening forces on the two adjacent components are installed in the oppositely arranged embedded grooves.

Abstract: A compound having the structure of general formula I is useful as a liquid crystal composition and as a photoelectric display device including the liquid crystal composition. The compound having the structure of general formula I is chemically and physically stable, and has higher clearing point, and both large dielectric anisotropy and large optical anisotropy at the same time. The compound having the structure of general formula I is well compatible with other liquid crystal compounds when applied in a liquid crystal composition, the composition has good stability especially in a low-temperature environment, the characteristic of fast response and a wide range of applicabilities, especially applicable to the IPS-type and TN-TFT-type liquid crystal display devices.

Abstract: The present invention discloses a stress sensor structure and a manufacturing method thereof, wherein the stress sensor structure comprises: a substrate; a blind-hole, provided on a first surface of the substrate; a first piezoresistive layer and a second piezoresistive layer, formed by material with piezoresistive effect, provided on a lateral wall of the blind-hole and interconnected at bottom portions of the layers; a second insulating layer, provided between the first piezoresistive layer and the second piezoresistive layer; a first electrode, provided on the first surface of the substrate and connected to the first piezoresistive layer; a second electrode, provided on the first surface of the substrate and connected to the second piezoresistive layer.