Abstract: The present invention discloses a stress sensor structure and a manufacturing method thereof, wherein the stress sensor structure comprises: a substrate; a blind-hole, provided on a first surface of the substrate; a first piezoresistive layer and a second piezoresistive layer, formed by material with piezoresistive effect, provided on a lateral wall of the blind-hole and interconnected at bottom portions of the layers; a second insulating layer, provided between the first piezoresistive layer and the second piezoresistive layer; a first electrode, provided on the first surface of the substrate and connected to the first piezoresistive layer; a second electrode, provided on the first surface of the substrate and connected to the second piezoresistive layer.

Abstract: A liquid crystal composition includes the compound of general formula I, and a photoelectric display device also includes the liquid crystal composition of general formula I. The compound of general formula I enables the liquid crystal composition including the same to maintain larger dielectric anisotropy, have a desired level of optical anisotropy, higher photo-thermal stability and nematic phase stability, and have a wide range of applicabilities, especially applicable to the IPS-type and TN-TFT-type liquid crystal display devices.

Abstract: The present invention discloses a stress sensor structure and a manufacturing method thereof, wherein the stress sensor structure comprises: a substrate; a blind-hole, provided on a first surface of the substrate; a first piezoresistive layer and a second piezoresistive layer, formed by material with piezoresistive effect, provided on a lateral wall of the blind-hole and interconnected at bottom portions of the layers; a second insulating layer, provided between the first piezoresistive layer and the second piezoresistive layer; a first electrode, provided on the first surface of the substrate and connected to the first piezoresistive layer; a second electrode, provided on the first surface of the substrate and connected to the second piezoresistive layer.

Abstract: The present invention discloses a method for preparing florfenicol and its intermediate (V), comprising an addition reaction, a ring closure reaction, a hydrolysis reaction, a ring opening reaction, a reduction reaction, a ring reaction, a fluorination reaction and a ring opening reaction. In the present method for preparing florfenicol, respective reaction steps can be continuously operated, therefore the methods of the present invention features simplified process and shorter synthetic route, and obtained florfenicol has high chiral purity and is of high yield. The method of the present invention for preparing florfenicol (TM) using the intermediate (V) avoids waste water pollution and reduces the cost for treating wastewater and alleviates environmental pollution. At the same time, the methods of the present invention eliminates a chiral resolution procedure, thus increasing the utilization rate of atoms in the reaction. As a result, cost is reduced and process is simplified.

Abstract: The present invention relates to a millimeter wave radar component package, comprising: a box cover, having a metal layer arranged on inner surface of the box cover, the metal layer facing a channel of a box body, wherein a cavity is formed between the box cover and the box body; and the box body, comprising: a first insulator, connected with the box cover, wherein in the first insulator a channel is opened, and one end of the channel corresponds with the position of antenna and the other end is connected with the cavity; one or more chips, arranged on a second insulator in a flip manner and covered by the first insulator; the second insulator, arranged between the first insulator and a third insulator; the third insulator; and the antenna and conductive lines, arranged in the third insulator and connected with pads of the one or more chips through the second insulator, wherein the conductive lines are exposed from the third insulator for electrical contact.

Abstract: A liquid crystal composition contains: at least one compound of general formula I and at least one polymerizable compound of general formula II. Such a liquid crystal composition has a suitable optical anisotropy, a suitable dielectric anisotropy, and a better pretilt angle consistency while maintaining a relatively high clearing point, and the drop mura is good. When the liquid crystal composition is applied to a PSA liquid crystal display, the liquid crystal composition has an excellent display effect.

Abstract: A compound having the structure of general formula I is useful as a liquid crystal composition and as a photoelectric display device including the liquid crystal composition. The compound having the structure of general formula I is chemically and physically stable, and has higher clearing point, and both large dielectric anisotropy and large optical anisotropy at the same time. The compound having the structure of general formula I is well compatible with other liquid crystal compounds when applied in a liquid crystal composition, the composition has good stability especially in a low-temperature environment, the characteristic of fast response and a wide range of applicabilities, especially applicable to the IPS-type and TN-TFT-type liquid crystal display devices.

Abstract: Provided herein is a method for producing hollow contact areas for insertion bonding, formed on a semiconductor substrate comprising a stack of one or more metallization layers on a surface of the substrate. Openings are etched in a dielectric layer by plasma etching, using a resist layer as a mask. The resist layer and plasma etch parameters are chosen to obtain openings with sloped sidewalls having a pre-defined slope, due to controlled formation of a polymer layer forming on the sidewalls of the resist hole and the hollow contact opening formed during etching. According to a preferred embodiment, metal deposited in the hollow contact areas and on top of the dielectric layer is planarized using chemical mechanical polishing, leading to mutually isolated contact areas. The disclosure is also related to components obtainable by the method and to a semiconductor package comprising such components.

Abstract: The present invention discloses a liquid crystal composition and a display device containing the same. The liquid crystal composition comprises one or more compounds of general Formula I; one or more compounds of general Formula II; and one or more compounds of general Formula III. The liquid crystal composition provided in the present invention has the properties of large optical and dielectric anisotropies, high clearing point, fast response speed, high resistivity, and good high-temperature and UV stability, and is applicable to a liquid crystal display (LCD), and particularly an LCD display requiring fast response speed, such that a good display effect of images without ghosting can be achieved when the LCD display works in a harsh environment.

Abstract: The present invention discloses a liquid crystal composition and a display device containing the same. The liquid crystal composition comprises one or more compounds of general Formula I; one or more compounds of general Formula II; and one or more compounds of general Formula III. The liquid crystal composition provided in the present invention has the properties of large optical and dielectric anisotropies, high clearing point, fast response speed, high resistivity, and good high-temperature and UV stability, and is applicable to a liquid crystal display (LCD), and particularly an LCD display requiring fast response speed, such that a good display effect of images without ghosting can be achieved when the LCD display works in a harsh environment.

Abstract: An optical communication apparatus comprises a laser, a laser driver chip, a photodetector, an amplifier chip, an assembling plate and at least two I/O interfaces. The laser, the laser driver chip, the photodetector and the amplifier chip are disposed on the assembling plate. The laser is connected to the laser driver chip via transmission lines and the photodetector is connected to the amplifier chip via transmission lines. A plurality of conducting vias are formed in the assembling plate, the laser driver chip and the amplifier chip are respectively connected to different I/O interfaces via electrical transmission lines passing through the conducting vias. The laser is connected to an optical fiber to transmit optical signals, and the photodetector is connected to another optical fiber to receive optical signals. A method of assembling such an optical communication apparatus is also provided.

Abstract: An optical communication apparatus comprises a laser, a laser driver chip, a photodetector, an amplifier chip, an assembling plate and at least two I/O interfaces. The laser, the laser driver chip, the photodetector and the amplifier chip are disposed on the assembling plate. The laser is connected to the laser driver chip via transmission lines and the photodetector is connected to the amplifier chip via transmission lines. A plurality of conducting vias are formed in the assembling plate, the laser driver chip and the amplifier chip are respectively connected to different I/O interfaces via electrical transmission lines passing through the conducting vias. The laser is connected to an optical fiber to transmit optical signals, and the photodetector is connected to another optical fiber to receive optical signals. A method of assembling such an optical communication apparatus is also provided.