Abstract: A process for the production of N-acylaminophenols by the concurrent hydrogenation of a nitrophenol to an aminophenol and the acylation of the aminophenol with acyl anhydride takes place on a continuous basis in a stirred tank reactor in which liquid product is continuously withdrawn from the reactor. Of particular interest is the manufacture of acetaminophen, N-acetyl-p-aminophenol by continuous reaction of p-ntirophenol, hydrogen and acetic anhydride.

Abstract: A process for the production of N-alkyl anilines by the concurrent hydrogenation of a nitrobenzene to an aniline and the acylation of the aniline with acyl anhydride takes place on a continuous basis in a stirred tank reactor in which liquid product is continuously withdrawn from the reactor.

Abstract: A catalytic process for preparing 4-hydroxyacetophenone oxime by reacting 4-hydroxyacetophenone with NH.sub.3 and H.sub.2 O.sub.2 in the liquid phase, in the presence of a catalyst substantially consisting of a titanium-containing molecular sieve such as a highly crystalline substance, containing SiO.sub.2 and having a zeolitic structure.

Abstract: The present invention pertains to a method of preparing substituted and unsubstituted N-hydroxy-2-aminobutane diacid derivatives which can be dehydrated to 2-aminobut-2-ene dioic acid derivatives, which can be subsequently converted to pyridine and quinoline derivatives.

Abstract: The present invention pertains to a method of preparing substituted and unsubstituted N-hydroxy-2-aminobutane diacid derivatives. The invention also pertains to the use of N-hydroxy-2-aminoethane derivatives (including the N-hydroxy-2-aminobutane diacid derivatives) in the preparation of pyridine derivatives.

Abstract: This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.

Abstract: Substituted phenethanol ethers are prepared by the catalytic reduction of corresponding substituted phenylglyoxal acetals. The catalytic reduction is carried out by reacting a substituted phenylglyoxal acetal with hydrogen in the presence of an acid catalyst and a metal catalyst. Certain substituted phenylglyoxal acetals, and more particularly, 4-hydroxyphenylglyoxal dialkyl acetals are prepared by reacting 4-hydroxyacetophenone with a primary or a secondary alkyl alcohol in the presence of a hydrogen ion (H+) source and a nitrosonium ion (NO+) source.

Abstract: A base developable negative acting photoresist composition which is thermally stable, provides high resolution at short exposure times and is capable of development by means of conventional aqueous alkaline developers. The present compositions comprise an alkali soluble hydroxylated polyamide and/or polyimide binder material, a photopolymerizable compound containing at least two ethylenically-unsaturated double bonds, and a light-sensitive photoinitiator.

Abstract: The invention provides a method for producing 4-(2'-methoxyethyl)phenol by brominating 4-hydroxyacetophenone to produce alpha-bromo-5-hydroxyacetophenone, and then causing a methoxide-bromide exchange to thereby produce alpha-methoxy-4-hydroxyacetophenone; and then conducting a single step reduction of alpha-methoxy-4-hydroxyacetophenone with at least two equivalents of hydrogen per equivalent of alpha-methoxy-4-hydroxyacetophenone in the presence of a hydrogenation catalyst to thereby directly produce 4-(2'-methoxyethyl)phenol.

Abstract: Polymerizable compounds comprising perfluoroalkyl groups, reproduction layers containing these compounds, and use of the reproduction layers for waterless offset printing. The novel polymerizable compounds comprise at least two acryloyl or methacryloyl groups and at least one perfluoroalkyl group which is linked to the molecule through a functional group, in particular, an ester or amide function. The compounds can be prepared, for example, from hydroxyl group-containing acrylates or methacrylates and perfluoroalkyl group-containing carboxylic acid chlorides, in the presence of an amine or from perfluoroalkyl group-containing carboxylic acid derivatives and reactive acryloyloxy or methacryloyloxy compounds. Oligomeric compounds can additionally be synthesized from the above-mentioned compounds by linking, for example, with diisocyanates.

Abstract: This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.

Abstract: An improved method of gas separation and novel polyimide membranes are disclosed and claimed. Membranes in accordance with the present invention include the condensation product of fluorinated diamines such as 2,2'-bis(3-aminophenyl)hexafluoropropane, 2,2'-bis(4-aminophenyl)hexafluoropropane and 2-(3-aminophenyl)-2'-(4-aminophenyl)hexafluoropropane with aromatic dianhydrides such as 3,3', 4,4' benzophenone tetracarboxylic acid dianhydride.

Abstract: Polyimides and polyamide-acids having improved solubility and processing characteristics and high glass transition temperatures are provided, having incorporated into the polymeric chain the novel aromatic dianhydride compound 4,4'-bis[2-(3,4-dicarboxyphenyl) hexafluoroisopropyl] diphenyl dianhydride. The polyamide-acids and polyimides are prepared by reacting the 12F-Diphenyl DA with aromatic or aliphatic diamines. It has been found that the polyimides of this invention have improved solubility characteristics, good dielectric properties while at the same time exhibiting relatively high glass transition temperatures, and superior thermal and thermo-oxidative stability. The polymers may be processed into films, fibers or compression molded or fabricated into composites at moderate temperatures and pressures.

Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.

Abstract: A novel method is disclosed for the preparation of 2,3-pyridine-dicarboxylates by the reaction of a ketoester such as dimethyl oxalacetate with an .alpha.,.beta.-unsaturated aldehyde or ketone such as 2-ethylacrolein and at least 1 molar equivalent of ammonium salt in suitable solvent.

Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)hexafluoroisopropyl]diphenyl ether.

Abstract: This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.

Abstract: Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.

Abstract: Polyimides and polyamide-acids having improved solubility and processing characterisitcs are provided having incorporated into the polymeric chain as a novel aromatic diamine compound, 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoropropane (3,4'-6F Diamine). The polyamide-acids and polyimides are prepared by reacting the 3,4'-6F Diamine with aromatic tetracarboxylic acids or anhydrides thereof. It has been found that the polyimides of this invention have improved solubility characterisitics, low dielectric constants and improved thermal flow properties as a consequence of the meta/para positioning of the amino groups on the diamine, which renders these polymers more readily melt spinnable for the production of fibers. The polymers may also be compression molded and fabricated into composites at moderate temperatures and pressures. Solutions of the polyimides may be cast into films.

Abstract: High molecular weight polyimides are formed by polycondensation of 2,2-bis(4-aminophenyl) hexafluoropropane or 2,2-bis(3-aminophenyl) hexafluoropropane with one or more of bis-(3,4 dicarboxyphenyl) ether dianhydride; 3,3', 4,4' benzophenone tetracarboxylic acid dianhydride; 3,3', 4,4' diphenyl tetracarboxylic acid dianhydride and 2,2-bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride. Generally, the polymers of the present invention are characterized by a molecular weight of more than about 90,000.