Abstract: Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.

Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.

Abstract: This invention relates to novel hydroxy polyimides and radiation sensitive compositions prepared therefrom. More particularly the invention relates to positive photoresists useful in the preparation of a thermally stable relief pattern on a substrate e.g. a silicon wafer or aluminum plate. The novel hydroxy polyimides of the invention may also be used to provide thermally stable organic protective films and layers e.g. an insulating and/or a passivating layer in a semi-conductor component.The novel hydroxy polyimides of in this invention can be synthesized by the condensation of a hydroxy-substituted aminophenol and a dianhydride. Radiation sensitive compositions prepared from the novel hydroxy polyimides of the invention can be developed in aqueous base developer or organic solvent developer; preferably aqueous base developer. Also, the base developer dissolution properties of the polyimides can be controlled by incorporating a non-hydroxyl diamine into the polyimide.

Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The product of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)-hexafluoroisopropyl]diphenyl ether.

Abstract: Process for the purification of organic polyanhydrides to substantially-completely remove trace metals, such as for the production of metal-free electronic grade polymers. The process comprises decyclizing in an aqueous vehicle to form the polyacid, treating with an adsorption agent, crystallizing the polyacid, filtering and reconverting to the polyanhydride which is substantially free of trace metals. The purified polyanhydride can be reacted with other metal-free monomers to form metal-free polymers having excellent insulating properties for use in electrical components.

Abstract: A novel method is disclosed for the preparation of 2,3-pyridine-dicarboxylates by the reaction of a ketoester such as dimethyl oxalacetate with an .alpha.,.beta.-unsaturated aldehyde or ketone such as 2-ethylacrolein and at least 1 molar equivalent of ammonium salt in suitable solvent utilizing a dehydrogenation catalyst such as palladium on carbon.

Abstract: Polyesters of 4,4'bis[2-(4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether having high transparency, high solvent solubility and excellent melt processability are prepared. They possess high thermal and radiation stability and are useful in the preparation of protective films, protective paints, films, fibers, diffusion membranes and shaped articles where high service temperature and radiation resistance are desired.

Abstract: Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.

Abstract: This invention is directed to novel, linear polycarbonamides derived from the condensation of 4,4'-bis[2-(4-carboxyphenyl)hexafluoroisopropyl]diphenyl ether or a derivative thereof with a primary diamine; preferably an aromatic diamine. The novel, linear polycarbonamides of the invention are useful in preparing molded and extruded articles, films and fibers having high thermal stability, resistance to soiling, excellent mechanical properties, good transparency and radiation stability. In addition, they may be processed into useful articles at lower processing temperatures than the comparable polycarbonamides of the prior art.

Abstract: A photosensitive polyimide polymer composition comprising a solvent soluble polyimide condensation product of an aromatic dianhydride and an aromatic diamine, a polyfunctional ethylenically unsaturated monomer and a photoinitiator. The solvent soluble polyimides of the composition are prepared from at least one compound selected from 2,2-hexafluoro-bis-(3,4-dicarboxyphenyl)tetracarboxylic dianhydride; 1,1-bis-[4-(1,2-dicarboxyphenyl)]-1-phenyl-2,2,2-trifluoroethane dianhydride; 2,2-hexafluoro-bis(3-aminophenyl)propane; 2,2-hexafluoro-bis(4-aminophenyl)propane; 2,2-hexafluoro-bis-[4-(3-aminophenoxy)phenyl]propane; 2,2-hexafluoro-bis-[4-(4-aminophenoxy)phenyl]propane and 1,1-bis-(4-aminopheny)-1-phenyl-2,2,2-trifluoroethane or mixtures thereof.

Abstract: In a process for hydrodimerizing an olefinic nitrile, amide or ester by electrolyzing an aqueous solution of the olefinic compound, alkali metal salt and quaternary ammonium or phosphonium cations, the selectivity with which the hydrodimer is produced is surprisingly high when the solution contains less than about 5% by weight of the olefinic compound and alkali metal cations constituting more than half of the total weight of all cations in the solution and the solution is electrolyzed in contact with a cathode consisting essentially of cadmium.