Patents by Inventor Werner Webers

Werner Webers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150217779
    Abstract: The invention relates to a method for controlling the operation of a hybrid vehicle and to a hybrid vehicle using said method, which vehicle can be driven by an internal combustion engine and/or an electrical drive which can be supplied via a reserve of stored electrical energy, wherein the vehicle comprises a drive control having a user interface and wherein the method comprises a user determining by means of the user interface that the vehicle be driven primarily only by the electrical drive at a specific point in time and/or for a specific length of time or route.
    Type: Application
    Filed: July 4, 2013
    Publication date: August 6, 2015
    Inventors: Kaspar Schmoll Genannt Eisenwerth, Werner Weber
  • Patent number: 8443955
    Abstract: The invention relates to a device and to a method for controlling a coupling system having a coupling provided with a hydraulic actuation system, which includes an adjustable coupling part for connecting and separating a power transmission path between a coupling input side and a coupling output side, a hydraulic connection that connects the actuation unit to an electrohydraulic actuator that is arranged outside the coupling, and a control unit for controlling the actuator. The hydraulic connection forms a hydraulic system together with hydraulic components of the actuation unit and the actuator. According to the invention, a mechanical stop that delimits the adjustment of the coupling part on the actuation unit is formed. A pressure sensor monitors the pressure in the hydraulic system or a control signal of the actuator.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: May 21, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Ralf Schuler, Werner Weber, Kaspar Schmoll Genannt Eisenwerth, Alexander Bawidamann
  • Patent number: 8415191
    Abstract: Embodiments relate to micromachine structures. In one embodiment, a micromachine structure includes a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element includes a FinFET structure having a height and a width, the height being greater than the width.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: April 9, 2013
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kolb, Reinhard Mahnkopf, Christian Pacha, Bernhard Winkler, Werner Weber
  • Publication number: 20120164774
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Application
    Filed: February 27, 2012
    Publication date: June 28, 2012
    Applicant: Infineon Technologies, AG
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Patent number: 8198690
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: June 12, 2012
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Publication number: 20120061777
    Abstract: Embodiments relate to micromachine structures. In one embodiment, a micromachine structure includes a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element includes a FinFET structure having a height and a width, the height being greater than the width.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 15, 2012
    Inventors: Stefan Kolb, Reinhard Mahnkopf, Christian Pacha, Bernhard Winkler, Werner Weber
  • Patent number: 8076738
    Abstract: Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: December 13, 2011
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kolb, Reinhard Mahnkopf, Christian Pacha, Bernhard Winkler, Werner Weber
  • Patent number: 8004682
    Abstract: One embodiment relates to a method for determining a concentration of a molecular species of interest. In this method, electromagnetic radiation is transmitted into a volume of gas within an output exhaust system. The transmitted electromagnetic radiation has a first intensity at a characteristic frequency that is associated with a transition of the molecular species of interest. Electromagnetic radiation is then received from the volume of gas at a second intensity. The method then correlates the first intensity to the second intensity to determine the concentration of the molecular species of interest within the volume of gas. Other methods and systems are also disclosed.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: August 23, 2011
    Assignee: Infineon Technologies AG
    Inventors: Werner Weber, Rudolf Lachner
  • Patent number: 7977850
    Abstract: A bulk acoustic wave device includes a first electrode, a second electrode, a piezoelectric layer arranged between the first and second electrodes and a semiconductor layer arranged between the first and second electrodes. The semiconductor layer is electrically isolated from the first electrode.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: July 12, 2011
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Mohamed Abd Allah, Werner Weber, Robert Thalhammer, Jyrki Kaitila
  • Patent number: 7922093
    Abstract: A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: April 12, 2011
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Werner Weber
  • Patent number: 7851875
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: December 14, 2010
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Publication number: 20100301434
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Application
    Filed: August 10, 2010
    Publication date: December 2, 2010
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Patent number: 7817037
    Abstract: The invention relates to an electronic component that can be operated by means of an alternating voltage. Said component includes at least one input, at least one output and a pair of electronic sub-components with an identical function. The input(s) of the electronic component is/are coupled to a respective input of the electronic sub-components with an identical function and the output(s) of the electronic component is/are coupled to a respective output of said electronic sub-components. In addition, the electronic component is configured in such a way that at least one output only one output signal of the first sub-component of the pair of functionally identical electronic components can be picked up during a first half-wave of an alternating voltage, whereas only one output signal of the second sub-component of the pair of functionally identical electronic can be picked up during the second half-wave of the alternating voltage.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: October 19, 2010
    Assignee: Infineon Technologies AG
    Inventors: Ralf Brederlow, Sylvain Briole, Christian Pacha, Roland Thewes, Werner Weber
  • Patent number: 7775115
    Abstract: A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: August 17, 2010
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Thomas Herndl, Werner Weber, Joachim Weitzel, Albert Auburger
  • Patent number: 7725629
    Abstract: A processor arrangement having a plurality of processor units and a control computer. Each of the processor units is connected to at least one adjacent processor unit and has one control element and at least one communications interface for providing a data communications link with an adjacent processor unit. The control computer is connected to one of the processor units, and is configured for exchanging information with the processor unit and for assigning one control element of the plurality of control elements to a device that is electrically connected to the processor arrangement for the control of the device.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: May 25, 2010
    Assignee: Infineon Technologies AG
    Inventors: Thomas Sturm, Rupert Glaser, Christl Lauterbach, Annelie Sohr, Werner Weber, Frank Schliep
  • Publication number: 20100101913
    Abstract: The invention relates to a device and to a method for controlling a coupling system having a coupling provided with a hydraulic actuation system, which includes an adjustable coupling part for connecting and separating a power transmission path between a coupling input side and a coupling output side, a hydraulic connection that connects the actuation unit to an electrohydraulic actuator that is arranged outside the coupling, and a control unit for controlling the actuator. The hydraulic connection forms a hydraulic system together with hydraulic components of the actuation unit and the actuator. According to the invention, a mechanical stop that delimits the adjustment of the coupling part on the actuation unit is formed. A pressure sensor monitors the pressure in the hydraulic system or a control signal of the actuator.
    Type: Application
    Filed: October 16, 2007
    Publication date: April 29, 2010
    Inventors: Ralf Schuler, Werner Weber, Kaspar Schmoll Genannt Eisenwerth, Alexander Bawidamann
  • Publication number: 20090260417
    Abstract: One embodiment relates to a method for determining a concentration of a molecular species of interest. In this method, electromagnetic radiation is transmitted into a volume of gas within an output exhaust system. The transmitted electromagnetic radiation has a first intensity at a characteristic frequency that is associated with a transition of the molecular species of interest. Electromagnetic radiation is then received from the volume of gas at a second intensity. The method then correlates the first intensity to the second intensity to determine the concentration of the molecular species of interest within the volume of gas. Other methods and systems are also disclosed.
    Type: Application
    Filed: April 16, 2008
    Publication date: October 22, 2009
    Applicant: Infineon Technologies AG
    Inventors: Werner Weber, Rudolf Lachner
  • Publication number: 20090218912
    Abstract: A bulk acoustic wave device includes a first electrode, a second electrode, a piezoelectric layer arranged between the first and second electrodes and a semiconductor layer arranged between the first and second electrodes. The semiconductor layer is electrically isolated from the first electrode.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 3, 2009
    Inventors: Mohamed Abd Allah, Werner Weber, Robert Thalhammer, Jyrki Kaitila
  • Publication number: 20090179286
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 16, 2009
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Publication number: 20090084181
    Abstract: Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Stefan KOLB, Reinhard MAHNKOPF, Christian PACHA, Bernhard WINKLER, Werner WEBER