Abstract: A projection exposure apparatus for semiconductor lithography has a connecting element for connecting a component of the apparatus to a supporting cooling structure of the apparatus. The connecting element has a receiving region for receiving the component, and the connecting element has a foot region for connecting the connecting element to the supporting cooling structure. At least one joint is arranged between the receiving and foot regions, and at least one heat conducting element is arranged between the receiving and foot regions. The heat conducting element is soft in the actuation direction of the joint and has a stiffness perpendicularly to the actuation direction of the joint that is at least twice as large as in the actuation direction of the joint.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: A projection exposure apparatus for semiconductor lithography has a connecting element for connecting a component of the apparatus to a supporting cooling structure of the s apparatus. The connecting element has a receiving region for receiving the component, and the connecting element has a foot region for connecting the connecting element to the supporting cooling structure. At least one joint is arranged between the receiving and foot regions, and at least one heat conducting element is arranged between the receiving and foot regions. The heat conducting element is soft in the actuation direction of the joint and has a stiffness perpendicularly to the actuation direction of the joint that is at least twice as large as in the actuation direction of the joint.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10?3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10?3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: The disclosure provides a cooler for use in a plasma generation chamber of a radiation source for an extreme ultraviolet wavelength range. The cooler has a heat sink which is at least partially manufactured of a substrate material having a thermal conductivity of greater than 50 W/mK. A coolant duct is formed in the substrate material, and the coolant duct is configured to have a coolant flow therethrough. The cooler also includes a connection piece made of a metal or a metal alloy for connecting a coolant line to the coolant duct. The cooler further includes a connecting element for connecting the connection piece to the heat sink so that, when the connection piece is connected to the heat sink, a continuous line is formed by the coolant duct and the coolant line.

Abstract: A reflective optical element for use in an EUV system is disclosed. The reflective optical element includes a base body, which is produced at least partly from a substrate material. At least one cooling channel through which a cooling medium can flow is arranged in the base body. A material having a thermal conductivity of greater than 50 W/mK is provided as substrate material. The reflective optical element also includes a polishing layer, which is applied on the substrate material. The polishing layer includes an amorphous material which can be processed via polishing.

Abstract: An optical component includes an optical element, a mount for the optical element, and a temperature control device configured to control a temperature of a part of the mount based on at least one parameter selected from the group consisting of a coefficient of expansion of a substrate of the optical element, and a coefficient of expansion of a material of the mount.

Abstract: An optical component comprises at least one optically effective optical element which heats up when irradiated with light, and at least one holding element for the at least one optical element for holding the at least one optical element in a carrier structure, wherein the at least one optical element is connected to the at least one holding element in heat conducting fashion, and wherein the at least one holding element is at least partially provided with an active cooling system for carrying off heat from the at least one optical element. Additionally or alternatively, a temperature control device is provided which controls the temperature of at least a part of the mount of the optical element.

Abstract: A reflective optical element (10) for use in an EUV system is disclosed. The reflective optical element includes a base body, which is produced at least partly from a substrate material. At least one cooling channel through which a cooling medium can flow is arranged in the base body. A material having a thermal conductivity of greater than 50 W/mK is provided as substrate material. The reflective optical element also includes a polishing layer, which is applied on the substrate material. The polishing layer includes an amorphous material which can be processed via polishing.

Abstract: An optical component comprises at least one optically effective optical element which heats up when irradiated with light, and at least one holding element for the at least one optical element for holding the at least one optical element in a carrier structure, wherein the at least one optical element is connected to the at least one holding element in heat conducting fashion, and wherein the at least one holding element is at least partially provided with an active cooling system for carrying off heat from the at least one optical element. Additionally or alternatively, a temperature control device is provided which controls the temperature of at least a part of the mount of the optical element.

Abstract: An optical component comprises at least one optically effective optical element which heats up when irradiated with light, and at least one holding element for the at least one optical element for holding the at least one optical element in a carrier structure, wherein the at least one optical element is connected to the at least one holding element in heat conducting fashion, and wherein the at least one holding element is at least partially provided with an active cooling system for carrying off heat from the at least one optical element. Additionally or alternatively, a temperature control device is provided which controls the temperature of at least a part of the mount of the optical element.

Abstract: An optical component comprises at least one optically effective optical element which heats up when irradiated with light, and at least one holding element for the at least one optical element for holding the at least one optical element in a carrier structure, wherein the at least one optical element is connected to the at least one holding element in heat conducting fashion, and wherein the at least one holding element is at least partially provided with an active cooling system for carrying off heat from the at least one optical element. Additionally or alternatively, a temperature control device is provided which controls the temperature of at least a part of the mount of the optical element.