Abstract: A field facet system for a lithography apparatus comprises: an optical element comprising a base body and an elastically deformable facet portion connected to the base body and having a light-reflecting optically active surface; and a plurality of actuating elements for deforming the facet portion to change a radius of curvature of the optically active surface. The actuating elements are operatively connected to the facet portion to isolate a heat induced deflection of the actuating elements from the facet portion so that the radius of curvature is not affected by the heat-induced deflection of the actuating elements.

Abstract: A field facet system for a lithography apparatus comprises: an optical element which comprises an elastically deformable facet portion having a light-reflecting optically active surface; and at least one actuating element for introducing a bending moment into the facet portion to deform the facet portion to change a radius of curvature of the optically active surface. The facet portion is curved in an arched manner in a plan view of the optically active surface. The rigidity of the facet portion as viewed along a longitudinal direction of the facet portion is variable so that a normal vector oriented perpendicularly to the optically active surface tilts exclusively about a spatial direction when the bending moment is introduced into the facet portion.

Abstract: A facet mirror for an illumination optical unit of a projection exposure apparatus has a large number of displaceable individual facets with a facet main body and a reflection surface arranged on it. At least some of the individual facets have a displacement range such that they come into contact with a stop surface in one or more displacement positions.

Abstract: A facet mirror for an illumination optical unit of a projection exposure apparatus has a large number of displaceable individual facets with a facet main body and a reflection surface arranged on it. At least some of the individual facets have a displacement range such that they come into contact with a stop surface in one or more displacement positions.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: A projection exposure apparatus for semiconductor lithography has a connecting element for connecting a component of the apparatus to a supporting cooling structure of the apparatus. The connecting element has a receiving region for receiving the component, and the connecting element has a foot region for connecting the connecting element to the supporting cooling structure. At least one joint is arranged between the receiving and foot regions, and at least one heat conducting element is arranged between the receiving and foot regions. The heat conducting element is soft in the actuation direction of the joint and has a stiffness perpendicularly to the actuation direction of the joint that is at least twice as large as in the actuation direction of the joint.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: A projection exposure apparatus for semiconductor lithography has a connecting element for connecting a component of the apparatus to a supporting cooling structure of the s apparatus. The connecting element has a receiving region for receiving the component, and the connecting element has a foot region for connecting the connecting element to the supporting cooling structure. At least one joint is arranged between the receiving and foot regions, and at least one heat conducting element is arranged between the receiving and foot regions. The heat conducting element is soft in the actuation direction of the joint and has a stiffness perpendicularly to the actuation direction of the joint that is at least twice as large as in the actuation direction of the joint.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10?3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: The disclosure provides a method that includes filling a cavity in a substrate with a second material, wherein the substrate includes a first material. The method also includes using galvanic and/or chemical deposition of a third material to apply an overcoating to a first surface of the substrate in a region of the cavity. The method further includes removing the second material from the cavity. In addition, the method includes, before or after removing the second material from the cavity, applying a reflective layer to the overcoating. The disclosure also provides related optical articles and systems.

Abstract: The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10?3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.

Abstract: A beam reverser module for an optical power amplifier of a laser arrangement comprises at least one reflecting surface for receiving an incoming laser beam propagating in a first direction and reflecting the incoming laser beam into a second direction different from the first direction, wherein the at least one reflecting surface is a highly reflecting surface of at least one mirror.

Abstract: The disclosure provides a cooler for use in a plasma generation chamber of a radiation source for an extreme ultraviolet wavelength range. The cooler has a heat sink which is at least partially manufactured of a substrate material having a thermal conductivity of greater than 50 W/mK. A coolant duct is formed in the substrate material, and the coolant duct is configured to have a coolant flow therethrough. The cooler also includes a connection piece made of a metal or a metal alloy for connecting a coolant line to the coolant duct. The cooler further includes a connecting element for connecting the connection piece to the heat sink so that, when the connection piece is connected to the heat sink, a continuous line is formed by the coolant duct and the coolant line.

Abstract: A reflective optical element for use in an EUV system is disclosed. The reflective optical element includes a base body, which is produced at least partly from a substrate material. At least one cooling channel through which a cooling medium can flow is arranged in the base body. A material having a thermal conductivity of greater than 50 W/mK is provided as substrate material. The reflective optical element also includes a polishing layer, which is applied on the substrate material. The polishing layer includes an amorphous material which can be processed via polishing.

Abstract: An optical component includes an optical element, a mount for the optical element, and a temperature control device configured to control a temperature of a part of the mount based on at least one parameter selected from the group consisting of a coefficient of expansion of a substrate of the optical element, and a coefficient of expansion of a material of the mount.