Abstract: The present disclosure is directed to systems and methods for targeted UVB phototherapy for treating autoimmune disorders and other indications. In one embodiment, a phototherapeutic system can include a radiation source configured to emit light. At least 75% of the light emitted by the radiation source can have a target wavelength range with a bandwidth between 298 nm and 307 nm. The phototherapeutic system can also include a controller operably connected to the radiation source and configured to determine a dosage for a phototherapy session. Dosage can correspond to a product of the intensity of the radiation source and an exposure time of the radiation source, and may have an upper bound less than 1 minimal erythema dose (MED). Delivery of the dose of phototherapy can stimulate an immune response to treat an autoimmune disorder.

Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.

Abstract: A device and method of spreading plasma which allows for plasma etching over a larger range of process chamber pressures. A plasma source, such as a linear inductive plasma source, may be choked to alter back pressure within the plasma source. The plasma may then be spread around a deflecting disc which spreads the plasma under a dome which then allows for very even plasma etch rates across the surface of a substrate. The apparatus may include a linear inductive plasma source above a plasma spreading portion which spreads plasma across a horizontally configured wafer or other substrate. The substrate support may include heating elements adapted to enhance the etching.

Abstract: A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.

Abstract: A trap system adapted to trap polyimide or other vapors exiting from a process chamber. The vapors are routed from the process chamber through a heated exit line at low pressure and then cooled, resulting in condensation at a selected location. The condensed vapors accumulate in a liquid trap. A method of condensing polymer vapors in vacuum exit lines of process chambers, where the flow which may have vaporized polymer vapor is cooled to enhance condensation at a chosen location. The liquid trap can be emptied and replaced, resulting in the removal of the condensed liquid. The chamber exit lines are protected from condensation build up.

Abstract: The present disclosure is directed to systems and methods for increased vitamin D3 production during phototherapy treatments. In one embodiment, a phototherapeutic system can include an ultraviolet (UV) source directed toward an irradiation zone and a filter between the UV source and the irradiation zone. The UV source can be configured to deliver a predetermined energy level during a phototherapy session. The filter can at least substantially remove UV radiation outside of a predetermined wavelength spectrum. The predetermined spectrum can have a bandwidth of at most 10 nm and can be focused at a wavelength corresponding to a maximum on a vitamin D3 phototherapy action spectrum for the predetermined energy level.

Abstract: The present disclosure is directed to systems and methods for targeted UVB phototherapy for dermatologic disorders and other indications. In one embodiment, a phototherapeutic system can include a radiation source configured to emit light. At least 75% of the light emitted by the radiation source can have wavelength with a bandwidth between 298 nm and 307 nm. The phototherapeutic system can also include a controller operably connected to the radiation source and configured to determine a dosage for a phototherapy session. Dosage can correspond to a product of the intensity of the radiation source and an exposure time of the radiation source, and may have an upper bound less than 1 minimal erythema dose (MED). Delivery of the dose of phototherapy can stimulate production of calcitriol and vitamin D3 in the user's skin and can provide an immune response to treat a dermatological disorder.

Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.

Abstract: The present disclosure is directed to systems and methods for increased vitamin D3 production during phototherapy treatments, in one embodiment, a phototherapeutic system can include an ultraviolet (UV) source directed toward an irradiation zone and a filter between the UV source and the irradiation zone. The UV source can be configured to deliver a predetermined energy ieve! during a phototherapy session. The filter can at least substantially remove UV radiation outside of a predetermined wavelength spectrum. The predetermined spectrum can have a bandwidth of at most 10 nm and can be focused at a wavelength corresponding to a maximum on a vitamin D3 phototherapy action spectrum for the predetermined energy level.

Abstract: A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, rehydration of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.

Abstract: A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.

Abstract: A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.

Abstract: A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, rehydration of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.

Abstract: A process for the coating of substrates comprising insertion of a substrate into a process oven, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a metered chemical withdrawal subsystem, and a vaporization subsystem.

Abstract: An apparatus and method for the development of photoresist utilizing vaporized developer. The substrate may be cooled such that the vaporized developer condenses on the substrate and in the features developing in the substrate. An ultrasonic vibrator may be used to vibrate the substrate to dispel the condensed vapors in the features.

Abstract: A process chamber for the coating of substrates with silanes with a double door seal. The double door seal may have a cavity between the seals which may be evacuated or pressurized, including with an inert gas. An apparatus for the coating of substrates comprising a process oven, a gas plasma subsystem, a metered chemical withdrawal subsystem, a vacuum subsystem, a vaporization subsystem, and a double door seal. A process oven utilizing a double sealed door with pressurized inert gas between the seals to reduce oxygen contamination and risks associated with silane processes.

Abstract: A process for the coating of substrates which are at least partially coated with indium tin oxide comprising insertion of a substrate into a process oven, dehydration of the substrate, plasma cleaning of the substrate, vaporizing chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby coating the substrate.

Abstract: A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.

Abstract: A silane coated substrate with a consistent surface energy across its surface. This consistent silane layer has a contact angle with a variation of less than +/?10 degrees as measured by a goniometer. The consistent silane layer also retains its consistency in moist environments. A silane layer with a minimum of defects.

Abstract: A plasma cleaning apparatus for cleaning lead frames or other items comprised of a chamber adapted for containing a plasma, a magazine positioned in the chamber for holding the lead frames, a first active electrode positioned in the chamber on one side of the magazine and a second active electrode positioned in the chamber on the other side of the magazine. A first grounded electrode is positioned between the first active electrode and the magazine and a second grounded electrode is positioned between the second active electrode and the magazine. The magazine is held at the same voltage as the first and second active electrodes and a plasma is generated which extends from the first active electrode to the second active electrode.