Patents by Inventor William A. Wojtczak

William A. Wojtczak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ETCHING COMPOSITIONS
    Publication number: 20240279549
    Abstract: The present disclosure is directed to etching compositions that are useful for, e.g., selectively removing silicon nitride from a semiconductor substrate as an intermediate step in a multistep semiconductor manufacturing process.
    Type: Application
    Filed: February 8, 2024
    Publication date: August 22, 2024
    Inventors: Kohei Hayashi, Thomas Dory, William A. Wojtczak
  • Surface Treatment Compositions and Methods
    Publication number: 20240254415
    Abstract: This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate.
    Type: Application
    Filed: January 23, 2024
    Publication date: August 1, 2024
    Inventors: William A. Wojtczak, Kazutaka Takahashi
  • Surface Treatment Compositions and Methods
    Publication number: 20240258111
    Abstract: This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
    Type: Application
    Filed: February 6, 2024
    Publication date: August 1, 2024
    Inventors: William A. Wojtczak, Kazutaka Takahashi, Atsushi Mizutani, Keeyoung Park
  • ETCHING COMPOSITIONS
    Publication number: 20240174924
    Abstract: The present disclosure is directed to etching compositions that are useful for, e.g., selectively removing titanium nitride (TiN) from a semiconductor substrate without substantially forming a cobalt oxide hydroxide layer.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 30, 2024
    Inventors: Emil A. Kneer, William A. Wojtczak
  • Cleaning formulation for removing residues on surfaces
    Patent number: 11639487
    Abstract: This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: May 2, 2023
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Cleaning formulation for removing residues on surfaces
    Patent number: 11618867
    Abstract: This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; and 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: April 4, 2023
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    Publication number: 20230100080
    Abstract: This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Application
    Filed: November 2, 2022
    Publication date: March 30, 2023
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    Publication number: 20230066300
    Abstract: This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; and 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Application
    Filed: November 2, 2022
    Publication date: March 2, 2023
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Surface Treatment Compositions and Methods
    Publication number: 20230048767
    Abstract: This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 16, 2023
    Inventors: William A. Wojtczak, Kazutaka Takahashi, Atsushi Mizutani, Thomas Dory, Keeyoung Park
  • Surface treatment compositions and methods
    Patent number: 11508569
    Abstract: This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate. The methods can include a) supplying a sublimating material to a substrate having a pattern disposed on a surface thereof; b) maintaining the sublimating material on the surface for a time sufficient to modify the surface; c) solidifying the sublimating material on the surface; and d) removing by sublimation the sublimating material disposed on the surface.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: November 22, 2022
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: William A. Wojtczak, Kazutaka Takahashi, Atsushi Mizutani, Thomas Dory, Keeyoung Park
  • Etching composition
    Patent number: 11499099
    Abstract: This disclosure relates to etching compositions containing 1) at least one oxidizing agent; 2) at least one chelating agent; 3) at least one organic solvent; 4) at least one amine compound; and 5) water.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: November 15, 2022
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Kazutaka Takahashi, Tomonori Takahashi, William A. Wojtczak
  • Methods of using surface treatment compositions
    Patent number: 11447642
    Abstract: This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: September 20, 2022
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: William A. Wojtczak, Atsushi Mizutani, Keeyoung Park
  • CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    Publication number: 20220275313
    Abstract: This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) alkanolamine; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Application
    Filed: May 20, 2022
    Publication date: September 1, 2022
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Cleaning formulation for removing residues on surfaces
    Patent number: 11401487
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion; and 5) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: August 2, 2022
    Assignee: Fujifilm Electronics Materials U.S.A., Inc.
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Cleaning formulation for removing residues on surfaces
    Patent number: 11359169
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion; and 5) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: June 14, 2022
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    Publication number: 20220145222
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion; and 5) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Application
    Filed: January 24, 2022
    Publication date: May 12, 2022
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Cleaning formulation for removing residues on surfaces
    Patent number: 11286444
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion; and 5) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: March 29, 2022
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Stripping compositions for removing photoresists from semiconductor substrates
    Patent number: 11208616
    Abstract: This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one carboxylic acid; 4) at least one Group II metal cation; 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 6) water, in which the composition is free of a compound comprising at least three hydroxyl groups. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: December 28, 2021
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Atsushi Mizutani, William A. Wojtczak, Yasuo Sugishima, Raj Sakamuri
  • Surface treatment compositions and articles containing same
    Patent number: 11174394
    Abstract: This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: November 16, 2021
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: William A. Wojtczak, Atsushi Mizutani, Keeyoung Park
  • METHODS OF USING SURFACE TREATMENT COMPOSITIONS
    Publication number: 20210122925
    Abstract: This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
    Type: Application
    Filed: January 7, 2021
    Publication date: April 29, 2021
    Inventors: William A. Wojtczak, Atsushi Mizutani, Keeyoung Park