Patents by Inventor William B. Mullen, III

William B. Mullen, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density electrical lead
    Patent number: 4598972
    Abstract: An improved electronic clip-on lead is disclosed. It is comprised of an elongated shaft suitable for electrical connection having a front spring finger extending from one end. A rear bracing member is positioned behind and parallel to the front spring finger by a support structure which fixes the displacement of the rear bracing member to the front spring finger.
    Type: Grant
    Filed: January 7, 1985
    Date of Patent: July 8, 1986
    Assignee: Motorola, Inc.
    Inventors: William B. Mullen, III, Glenn F. Urbish
  • Electrical subassembly structure
    Patent number: 4586764
    Abstract: An electrical subassembly structure of two substrates has metalized portions located adjacent to the upper and lower edges on the back of each substrate. Clip on leads are attached to one substrate with a portion of each lead soldered to the lower edge metalized portion. The two substrates are electrically and mechanically joined by soldering upper edge metalized portions together and soldering the lower edge metalized portions of the other substrate to the lead portions.
    Type: Grant
    Filed: January 7, 1985
    Date of Patent: May 6, 1986
    Assignee: Motorola, Inc.
    Inventors: William B. Mullen, III, James E. Van Hout, William M. Bradford