Abstract: An identification (ID) tag includes a substrate having an input capable of receiving a high frequency signal. For instance, the high frequency signal can be a radio frequency (RF) signal that is generated as part of a radio frequency (RF) ID system. A first charge pump is coupled to the input and is configured to convert the high frequency signal to a substantially direct current (DC) voltage. A data recovery circuit is coupled to the input and is capable of recovering data from the high frequency signal. A back scatter switch is coupled to the input and is capable of modifying an impedance of the input, responsive to a control signal. A state machine is disposed on the substrate and is responsive to the data recovered by the second charge pump, where the state machine is capable of generating the control signal for the back scatter switch in response to the data.

Abstract: An RF addressable sensor network architecture is provided. The RF addressable sensor network includes one or more RF addressable sensors, one or more wireless sensor readers coupled to a communications network, and one or more end user devices coupled to the communications network. The RF addressable sensor network may also include a sensor network processor. An RF addressable sensor includes one or more sensor elements, one or more antennas for communicating with the wireless sensor reader, an RF power and communications interface, and RFID control module, and a sensor interface. The wireless sensor reader includes one or more antennas, a user interface, a controller, a network communications module, and an RF addressable sensor logic module.

Abstract: A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. In one aspect for making a die frame, a wafer that comprises a plurality of dies is attached to a surface of a tape structure. A grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure. A portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure. The grid shaped structure removably holds the plurality of dies. One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface. In an alternative aspect, when the grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure, the surface of the tape structure is breached in the grooves.

Abstract: Embodiments of the present invention provide a method and system for optimizing an interrogation of a tag population that includes a plurality of tags. The method includes defining a number of time slots allocated to a first read cycle, and selecting a different number of time slots allocated to a second read cycle based on a duration of the first read cycle.

Abstract: Methods, systems, and apparatuses for antenna designs for radio frequency identification (RFID) tags are described.

Abstract: A radio frequency identification (RFID) architecture is described. RFID tags are interrogated by a reader, which may be located in a network of readers. The reader transmits symbols to the tags. Tags respond to the interrogations with symbols that each represent one or more bits of data. An RFID tag includes an antenna pad, a receiver, a state machine, and a modulator. The receiver is coupled to the antenna pad. The receiver receives a symbol from the antenna pad and outputs a received signal. The state machine is configured to determine a response symbol from the received signal and an operating state of the tag. The modulator is coupled to the antenna pad. The modulator is configured to backscatter modulate the received symbol with the response symbol. The modulator is configured to output the backscatter modulated symbol to the antenna pad.

Abstract: A method, system, and apparatus for remotely calibrating data symbols received by a radio frequency identification (RFID) tag population are described. Tags are interrogated by a reader, which may be located in a network of readers. The reader transmits data symbols to the tags. Tags respond to the interrogations with symbols that each represent one or more bits of data. To calibrate the tags, the reader transmits a plurality of pulses of different lengths to the tag population. The tags receive the plurality of pulses. A characteristic of each pulse, such as a pulse length, is stored by the tags. The stored pulse lengths are used to define different data symbols that are subsequently received by the tags from the reader.

Abstract: Methods and systems for the negotiation of a population of RFID tags with improved security is provided. In one aspect, tags are singulated without using information that directly identifies the tags in the tag population. A key is generated to identify each RFID tag of the population of RFID tags. The generated key does not include bits identifying an item with which the particular RFID tag is associated. An algorithm is operated to identify one or more tags in the population of RFIDs tags using the generated keys. In another aspect, frequency hopping and/or spread spectrum techniques are used to provide improved security while negotiating tags. In another aspect, the reader causes the tags to scroll series of bits back to the reader for each bit sent to the tags to provide improved security.

Abstract: A method, system, and apparatus for communicating with a radio frequency identification (RFID) tag population that includes one or more tags are described. The tags are interrogated by a reader which may be located in a network of readers. The reader interrogates the tags by transmitting data symbols to the tags. Tags respond to the reader with backscatter symbols. Bit patterns, such as identification numbers stored in the tags, are collected from the plurality of tags without collisions. Collisions are avoided because the backscatter symbols transmitted by the tags use different characteristics to represent different data bits. For example, a first backscatter symbol frequency is used by the tag to represent a “0” bit, and a second backscatter symbol frequency is used by the tag to represent a “1” bit.

Abstract: A method, system, and apparatus for interrogating a radio frequency identification (RFID) tag population are described. Tags are interrogated by a reader. The reader and tags engage in communication according to communications algorithms, where data symbols are exchanged between the reader and tags. Furthermore, a reader implicitly controls the operating state of every tag in the tag population by transmitting a single data symbol. Bit patterns may be collected from the tags by the reader, using a variety of interrogation techniques. In a general interrogation, the reader exchanges symbols with the tag population to interrogate the entire tag population. In a specific interrogation, a reader exchanges symbols with the tag population to target a particular tag identification number. Tags may also be placed in a superposition state by the reader, where they respond whenever a received data symbol matches the next bit of their identification number.

Abstract: A cable having an electrostatic discharge (ESD) dissipative coating. The cable includes a lead and an ESD dissipative coating operatively coupled to the lead. Other layers such as adhesives and insulating layers can be provided. The ESD dissipative coating can also function as the insulator for the lead.

Abstract: A method, system, and apparatus for writing data to integrated circuits is described. A charged particle source supplies a beam of charged particles. A wafer plate mounts a wafer having a plurality of transistors distributed among an array of integrated circuits on a surface. A beam column receives the beam of charged particles and selectively passes the beam of charged particles to the surface of the wafer. The selectively passed beam of charged particles irradiates selected transistors of the plurality of transistors to cause the selected transistors to permanently change from a first state to a second state. The second state can be a fully “on” state, a fully “off” state, or a state in between for the selected transistors. Each integrated circuit of the array includes at least one of the selected transistors and at least one non-selected transistor. A combination of selected and non-selected transistors of the integrated circuit corresponds to data for the integrated circuit.

Abstract: A radio frequency identification (RFID) architecture is described. RFID tags are interrogated by a reader, which may be located in a network of readers. The reader transmits symbols to the tags. Tags respond to the interrogations with symbols that each represent one or more bits of data. An RFID tag includes an antenna pad, a receiver, a state machine, and a modulator. The receiver is coupled to the antenna pad. The receiver receives a symbol from the antenna pad and outputs a received signal. The state machine is configured to determine a response symbol from the received signal and an operating state of the tag. The modulator is coupled to the antenna pad. The modulator is configured to backscatter modulate the received symbol with the response symbol. The modulator is configured to output the backscatter modulated symbol to the antenna pad.

Abstract: An RF addressable sensor network architecture is provided. The RF addressable sensor network includes one or more RF addressable sensors, one or more wireless sensor readers coupled to a communications network, and one or more end user devices coupled to the communications network. The RF addressable sensor network may also include a sensor network processor. An RF addressable sensor includes one or more sensor elements, one or more antennas for communicating with the wireless sensor reader, an RF power and communications interface, and RFID control module, and a sensor interface. The wireless sensor reader includes one or more antennas, a user interface, a controller, a network communications module, and an RF addressable sensor logic module.

Abstract: A method, system, and apparatus for remotely calibrating data symbols received by a radio frequency identification (RFID) tag population are described. Tags are interrogated by a reader, which may be located in a network of readers. The reader transmits data symbols to the tags. Tags respond to the interrogations with symbols that each represent one or more bits of data. To calibrate the tags, the reader transmits a plurality of pulses of different lengths to the tag population. The tags receive the plurality of pulses. A characteristic of each pulse, such as a pulse length, is stored by the tags. The stored pulse lengths are used to define different data symbols that are subsequently received by the tags from the reader.

Abstract: A system and method for conducting an inventory of tags, wherein each tag is assigned a Tag ID and a manufacturer number. Each tag can be attached to an item to take inventory of those items. A tag reader transmits a wake-up signal followed by at least one clock signal. Each tag increments a first tag count in response to the clock signals, and transmits the Tag ID assigned to the tag when the first tag count corresponds to the Tag ID assigned to the tag. The tag reader records the transmitted Tag IDs. When more than one tag transmits simultaneously, the tag stores the Tag ID in order to resolve the contention when the first read cycle is complete. In the second read cycle, the tag reader transmits the contended Tag ID followed by at least one clock signal.

Abstract: A method and system for device assembly and a method, system, and apparatus for transfer of dies using a pin plate are described herein. A die plate is received having dies. The body of the die plate has a plurality of holes extending therethrough. Each die covers a corresponding hole on a first surface of the die plate. The die plate is positioned to be closely adjacent to the web of substrates. The punching device has a plurality of punching members extending from an outer surface. The punching device is planar or alternatively cylindrical. The punching device is applied to a second surface of the die plate to cause a set of the punching members to extend through a set of holes in the die plate, causing dies to be transferred from the die plate to one or more destination substrates or other surfaces.

Abstract: A system, method and apparatus for die transfer using a changeable or movable material is described herein. The die plate has a planar body. The body has a plurality of holes therethrough. Each die covers a corresponding hole on a first surface of the die plate. The holes are filled with a material that can be caused to expand, exert pressure, or move when exposed to one or more stimuli. The die plate is positioned to be closely adjacent to the web of substrates. The dies can subsequently be transferred from the die plate to one or more destination substrates or other surfaces by applying one or more stimuli to the material, causing the material to expand, exert pressure, or move. The action of the material causes the dies to separate from the die plate.

Abstract: Methods and systems for authenticating the operation of electronic devices, such as RFID tags are provided. In accordance with the method, a web of substrates having a plurality of devices attached thereto are received. The operation of a first set of the plurality of devices is authenticated. If it is determined that one or more devices is not operating properly, the location of each device is determined. The web of substrates is then moved incrementally to expose a second set of the plurality of devices. Each device that does not operate properly is indicated by applying ink to the substrate containing the device or by removing the device.

Abstract: A method, system, and apparatus for transfer of dies using a die plate having die cavities is described herein. The die plate has a planar body. The body has a plurality of cells or cavities which are open at the first surface of the body. Each cell has a hole extending from the bottom surface of the cell to a second surface of the body. A wafer or support structure can be positioned to be closely adjacent to each other. A suction can be applied to the second surface of the die plate so that a plurality of dies can be transferred into a plurality of cells of the die plate. The dies can subsequently be transferred from the die plate having die cavities to one or more destination substrates or surfaces, by a punching mechanism.