Patents by Inventor William Boyd

William Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210319642
    Abstract: In an example, a method includes receiving, by an election office system from a voter device, a request for a voting ballot for an election, part or all of voter ID information associated with a first mobile identification credential which the voter device received from a first authorizing party system (APS), and consented data indication which indicates the part or all of voter ID information that is authorized by the voter device for release by the first APS to the election office system, the part or all of voter ID information to be verified to the election office system by the first APS; and using the verified part or all of voter ID information to verify or not verify an identity of the voter. The identity of the voter is to be verified before the election office system grants the request to provide the voting ballot to the voter.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 14, 2021
    Applicant: The Government of the United States of America, as represented by the Secretary of Homeland Security
    Inventors: Daniel A. Boyd, Kelli L. Biegger, Chang Ellison, Brandon P. Gutierrez, Jason Lim, William Washington, Arun Vemury, Nathan Grebasch
  • Patent number: 11132066
    Abstract: Systems and methods for radial gesture navigation are provided. In example embodiments, user input data is received from a user device. The user input data indicates a continuous physical user interaction associated with a display screen of the user device. An initial point and a current point are detected from the user input data. A radius distance for a circle that includes the current point and is centered about the initial point is determined. An action is selected from among multiple actions based on the radius distance being within a particular range among successive ranges along a straight line that starts at the initial point and extends through the circle. Each range among the successive ranges corresponds to a particular action among the multiple actions. The selected action is performed in response to detecting a completion of the continuous physical user interaction.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 28, 2021
    Assignee: Snap Inc.
    Inventors: Ty Blachly, Nathan Boyd, Donald Giovannini, Krish Jayaram, Evan Spiegel, William Wu
  • Publication number: 20210277830
    Abstract: A baffle is provided herein. The baffle includes a cylindrical baffle section. The cylindrical baffle section includes one or more holes. The baffle also includes a split line retaining section. The split line retaining section includes one or more mounting bosses. Each of the one or more mounting bosses receives one or more mounting bolts.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 9, 2021
    Inventors: Thomas Jakab, William Boyd Hubbard, Jeffrey Todd Roberts, Adrian L. Stoicescu
  • Publication number: 20210277827
    Abstract: A system includes a housing for a gas turbine engine, and a fan disposed in the housing to rotate coaxially with a gas turbine included in the housing. The system also includes an inlet guide vane disposed in the housing in axial alignment with the fan and configured to have an open position where a first flow of air is received by the fan through the inlet guide vane, and a closed position where airflow through the inlet guide vane is obstructed. The system further includes a heat exchanger disposed in a supply passage in fluid communication with a second flow of air received by the fan. The second flow of air is received by the fan via the supply passage with the inlet guide vane in the open position or in the closed position.
    Type: Application
    Filed: March 9, 2020
    Publication date: September 9, 2021
    Applicant: Rolls-Royce North American Technologies Inc.
    Inventors: Douglas David Dierksmeier, Douglas Boyd, Douglas J. Snyder, Graham Burkholder, William Barry Bryan
  • Patent number: 11103670
    Abstract: A humidification canister for humidifying a breathing gas, the humidification canister includes a fluid supply configured to supply a fluid and a first gas flow path in fluid communication with the fluid supply. A first gas flow path is configured to humidify the breathing gas with the fluid. A second gas flow path at least partially surrounds the first gas flow path. A method of insulating a breathing gas in a humidification canister using a gas is also disclosed.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: August 31, 2021
    Assignee: Vapotherm, Inc.
    Inventors: Felino V. Cortez, Jr., Owen S. Bamford, William F. Niland, George McGarrity, Carl Buyer, Kenneth Miller, Peter Boyd
  • Publication number: 20210239995
    Abstract: Described are various embodiments of space-compressing methods, materials, devices, and systems, and imaging or optical devices and systems using same. In one embodiment, an optical system comprises an optical convergence element having a defined optical path convergence distance and disposed so to produce converging optical rays along an optical convergence path to converge at said distance; an optical space-compression medium disposed along the optical convergence path to intersect the converging optical rays to compress a resulting optical convergence distance by imparting an inward transverse translation of the converging optical rays while substantially maintaining respective incident convergence angles upon output.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 5, 2021
    Inventors: Jeffrey Stephen Lundeen, Robert William Boyd, Orad Reshef, Michael Patrick Delmastro, Ali Hussain H. Alhulaymi, Lambert Giner, Katherine Karla Misaye Bearne, Jordan Theodore Roger PAGÉ
  • Publication number: 20210192046
    Abstract: This disclosure describes methods, devices, systems, and procedures in a computing system for capturing a configuration state of an operating system executing on a central processing unit (CPU), and offloading tasks for managing malware and vulnerable software, based on the configuration state, to a resource management unit, such as a system-on-chip (SoC). The resource management unit identifies a status of a process as malware or vulnerable software, based on its fingerprint, and acts to protect the computing system from unwanted effects.
    Type: Application
    Filed: June 17, 2020
    Publication date: June 24, 2021
    Applicant: Google LLC
    Inventors: Alex Levin, Stephen William Boyd
  • Patent number: 10804822
    Abstract: A motor drive circuit for driving an electric motor includes a plurality of driver circuits, each one of the plurality of driver circuit comprising a high side transistor coupled to a low side transistor in a half bridge arrangement, wherein each one of the high side transistors and each one of the low side transistors has a respective control node and respective first and second current passing nodes, wherein the second current passing node of each of the high side transistors is coupled to the first current passing node of a respective one of the low side transistors at a respective junction node, wherein each one of the plurality of driver circuits is operable to drive a respective current out of a respective junction node into a respective winding of the electric motor. The motor drive circuit further includes a capacitor coupled to the first current passing node of each one of the high side transistors, the capacitor operable to hold a capacitor voltage.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: October 13, 2020
    Assignee: Allegro MicroSystems, LLC
    Inventors: William Boyd Alcorn, Robert Stoddard, Timothy Reynolds
  • Publication number: 20200297491
    Abstract: A system for treating a diseased native valve in a patient includes a valve prosthesis and a delivery device. The prosthesis includes an anchor and a frame. The delivery device includes an outer sheath, an inner shaft, an anchor guide, and a tether. The anchor is shaped to encircle chordae or leaflets of a native valve. The frame is configured to sit within the anchor. The inner shaft is positioned within the outer sheath and translatable and rotatable relative to the outer sheath. The anchor guide is attached to a distal end of the inner shaft and has a curved distal section. The tether is configured to detachably couple to the anchor and to longitudinally translate the anchor within the inner shaft and anchor guide. The anchor is configured to be actuated from a delivery configuration to the deployed configuration when the anchor is translated out of the anchor guide.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 24, 2020
    Inventors: Claudio ARGENTO, Andrew BACKUS, Alice YANG, Ali SALAHIEH, Jasper Ellington ADAMEK-BOWERS, Connor MULCAHY, Ryan William BOYD, Nicholas SPINELLI, Tom SAUL
  • Patent number: 10672624
    Abstract: A method of making a semiconductor device may include providing a carrier comprising a semiconductor die mounting site. A build-up interconnect structure may be formed over the carrier. A first portion of a conductive interconnect may be formed over the build-up interconnect structure in a periphery of the semiconductor die mounting site. An etch stop layer and a second portion of the conductive interconnect may be formed over the first portion of the conductive interconnect. A semiconductor die may be mounted to the build-up interconnect at the semiconductor die mounting site. The conductive interconnect and the semiconductor die may be encapsulated with a mold compound. A first end of the conductive interconnect on the second portion of the conductive interconnect may be exposed. The carrier may be removed to expose the build-up interconnect structure. The first portion of the conductive interconnect may be etched to expose the etch stop layer.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: June 2, 2020
    Assignee: Deca Technologies Inc.
    Inventors: Christopher M. Scanlan, William Boyd Rogers, Craig Bishop
  • Patent number: 10600652
    Abstract: A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less than a footprint of the semiconductor substrate. The pool of etching solution and the semiconductor substrate can be moved with respect to each other. A pool boundary of the pool of etching solution can be defined on the semiconductor substrate with at least one air-knife such that the pool of etching solution etches the layer of material over the semiconductor substrate within the footprint of the pool of etching solution. The etching solution and at least a portion of the layer of material etched by the etching solution can be removed with the at least one air-knife.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 24, 2020
    Assignee: Deca Technologies Inc.
    Inventors: Timothy L. Olson, William Boyd Rogers, Ferdinand Aldas
  • Publication number: 20200028452
    Abstract: A motor drive circuit for driving an electric motor includes a plurality of driver circuits, each one of the plurality of driver circuit comprising a high side transistor coupled to a low side transistor in a half bridge arrangement, wherein each one of the high side transistors and each one of the low side transistors has a respective control node and respective first and second current passing nodes, wherein the second current passing node of each of the high side transistors is coupled to the first current passing node of a respective one of the low side transistors at a respective junction node, wherein each one of the plurality of driver circuits is operable to drive a respective current out of a respective junction node into a respective winding of the electric motor. The motor drive circuit further includes a capacitor coupled to the first current passing node of each one of the high side transistors, the capacitor operable to hold a capacitor voltage.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 23, 2020
    Applicant: Allegro Microsystems, LLC
    Inventors: William Boyd Alcorn, Robert Stoddard, Timothy Reynolds
  • Publication number: 20190271162
    Abstract: Methods and associated apparatuses are described herein that provide a tile alternative material. The tile alternative material may be manufactured by providing a substrate that defines a first surface, and a second surface opposite the first surface. The second surface is configured to be secure, via an adhesive or otherwise, to a support surface. The method further includes coating an exterior layer on the first surface of the substrate, and forming a pattern element in the first surface of the substrate. Forming the pattern element includes removing material from the substrate and the coated exterior layer of the first surface to form one or more recessed portions.
    Type: Application
    Filed: February 22, 2019
    Publication date: September 5, 2019
    Inventors: William BOYD, Nicholas GODFREY, David OBER, Calvin TRUMBO
  • Patent number: 10204803
    Abstract: A semiconductor device and method of making the semiconductor device is described. A semiconductor die can be provided. A polymer layer can be formed over the semiconductor die. A via can be formed in the polymer layer. The polymer layer can be cross-linked in a first process, after forming the via, by exposing the polymer layer to ultraviolet (UV) radiation to form a sidewall of the via with via sidewall slope greater than or equal to 45 degrees and to further form a cross-linked via sidewall surface. The polymer layer can be thermally cured in a second process after the first process, wherein a maximum ramp-up rate from room temperature to a peak temperature of the second process is greater than 10 degrees Celsius per minute.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: February 12, 2019
    Assignee: Deca Technologies Inc.
    Inventors: William Boyd Rogers, Willibrordus Gerardus Maria van den Hoek
  • Publication number: 20180330966
    Abstract: A method of making a semiconductor device may include providing a carrier comprising a semiconductor die mounting site. A build-up interconnect structure may be formed over the carrier. A first portion of a conductive interconnect may be formed over the build-up interconnect structure in a periphery of the semiconductor die mounting site. An etch stop layer and a second portion of the conductive interconnect may be formed over the first portion of the conductive interconnect. A semiconductor die may be mounted to the build-up interconnect at the semiconductor die mounting site. The conductive interconnect and the semiconductor die may be encapsulated with a mold compound. A first end of the conductive interconnect on the second portion of the conductive interconnect may be exposed. The carrier may be removed to expose the build-up interconnect structure. The first portion of the conductive interconnect may be etched to expose the etch stop layer.
    Type: Application
    Filed: June 19, 2018
    Publication date: November 15, 2018
    Inventors: Christopher M. Scanlan, William Boyd Rogers, Craig Bishop
  • Patent number: 10050004
    Abstract: A method of making a semiconductor device can comprise providing a temporary carrier comprising a semiconductor die mounting site, and forming an insulating layer over the temporary carrier. Conductive pads can be formed within openings in the insulating layer and be positioned both within and without the die mounting area. A backside redistribution layer (RDL) can be formed over the temporary carrier before mounting a semiconductor die at the die mounting site. Conductive interconnects can be formed over the temporary carrier in a periphery of the semiconductor die mounting site. A semiconductor die can be mounted face up to the insulating layer. The conductive interconnects, backside RDL, and semiconductor die can be encapsulated with a mold compound. A build-up interconnect structure can be formed and connected to the semiconductor die and the conductive interconnects. The temporary carrier can be removed and the conductive pads exposed in a grinding process.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: August 14, 2018
    Assignee: DECA Technologies Inc.
    Inventors: Christopher M. Scanlan, William Boyd Rogers, Craig Bishop
  • Patent number: 9938669
    Abstract: A regulator moldboard and grader blade assembly includes a moldboard having at least one transversely extending pin, the pin having a notch with a surface inclined toward the moldboard. At least one grader blade has at least one mounting opening having a flared surface complementary to the notch so that the blade is hangable on the pin so that the notch draws the blade against the moldboard as a fastener tightens the blade to the moldboard.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: April 10, 2018
    Assignee: NORDCO INC.
    Inventors: James William Boyd, David A. Spence, Justin Jerome Pipol, Michael David Thompson
  • Publication number: 20170221830
    Abstract: A method of making a semiconductor device can include providing a temporary carrier with a semiconductor die mounting site, and forming conductive interconnects over the temporary carrier in a periphery of the semiconductor die mounting site. A semiconductor die can be mounted at the semiconductor die mounting site. The conductive interconnects and semiconductor die can be encapsulated with mold compound. First ends of the conductive interconnects can be exposed. The temporary carrier can be removed to expose second ends of the conductive interconnects opposite the first ends of the conductive interconnects. The conductive interconnects can be etched to recess the second ends of the conductive interconnects with respect to the mold compound. The conductive interconnects can comprise a first portion, a second portion, and an etch stop layer disposed between the first portion and the second portion.
    Type: Application
    Filed: April 4, 2017
    Publication date: August 3, 2017
    Inventors: Christopher M. Scanlan, William Boyd Rogers, Craig Bishop
  • Publication number: 20170221719
    Abstract: A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less than a footprint of the semiconductor substrate. The pool of etching solution and the semiconductor substrate can be moved with respect to each other. A pool boundary of the pool of etching solution can be defined on the semiconductor substrate with at least one air-knife such that the pool of etching solution etches the layer of material over the semiconductor substrate within the footprint of the pool of etching solution. The etching solution and at least a portion of the layer of material etched by the etching solution can be removed with the at least one air-knife.
    Type: Application
    Filed: April 11, 2017
    Publication date: August 3, 2017
    Inventors: Timothy L. Olson, William Boyd Rogers, Ferdinand Aldas
  • Patent number: D878429
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: March 17, 2020
    Inventors: Craig Rekow, Paul Magee, Michael Gallagher, Douglas Bornhorst, William Boyd