Patents by Inventor William C. Allison

William C. Allison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
    Publication number: 20150343595
    Abstract: Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
    Type: Application
    Filed: August 11, 2015
    Publication date: December 3, 2015
    Inventors: William C. Allison, Diane Scott, Robert Kerprich, Ping Huang, Richard Frentzel
  • POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
    Publication number: 20150273655
    Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
    Type: Application
    Filed: June 5, 2015
    Publication date: October 1, 2015
    Inventors: William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson
  • POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
    Publication number: 20150273656
    Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
    Type: Application
    Filed: June 11, 2015
    Publication date: October 1, 2015
    Inventors: William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson
  • POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER
    Publication number: 20150266160
    Abstract: Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.
    Type: Application
    Filed: June 1, 2015
    Publication date: September 24, 2015
    Inventors: Paul Andre Lefevre, William C. Allison, Diane Scott, James P. LaCasse
  • Polishing pad with foundation layer and polishing surface layer
    Patent number: 9067297
    Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: June 30, 2015
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson
  • Polishing pad with grooved foundation layer and polishing surface layer
    Patent number: 9067298
    Abstract: Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: June 30, 2015
    Assignee: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Diane Scott, James P. LaCasse
  • POLISHING PAD WITH ALIGNMENT FEATURE
    Publication number: 20150152236
    Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
    Type: Application
    Filed: January 30, 2015
    Publication date: June 4, 2015
    Inventors: Robert Kerprich, William C. Allison, Diane Scott
  • Polishing pad for eddy current end-point detection
    Patent number: 9028302
    Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: May 12, 2015
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson
  • POLISHING PAD WITH APERTURE
    Publication number: 20150079878
    Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
    Type: Application
    Filed: November 21, 2014
    Publication date: March 19, 2015
    Inventors: William C. Allison, Diane Scott, Rajeev Bajaj
  • Polishing pad with alignment feature
    Patent number: 8968058
    Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: March 3, 2015
    Assignee: NexPlanar Corporation
    Inventors: Robert Kerprich, William C. Allison, Diane Scott
  • POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON
    Publication number: 20150056900
    Abstract: Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 26, 2015
    Inventors: Rajeev Bajaj, Ping Huang, Robert Kerprich, William C. Allison, Richard Frentzel, Diane Scott
  • LOW DENSITY POLISHING PAD
    Publication number: 20150038066
    Abstract: Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Inventors: Ping Huang, William C. Allison, Richard Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott
  • Polishing pad with alignment aperture
    Patent number: 8920219
    Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 30, 2014
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Rajeev Bajaj
  • POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS
    Publication number: 20140273777
    Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
    Publication number: 20140206268
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Rinehart, Robert Kerprich
  • POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
    Publication number: 20140167305
    Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
    Type: Application
    Filed: February 19, 2014
    Publication date: June 19, 2014
    Inventors: Ping Huang, Diane Scott, James P. LaCasse, William C. Allison
  • HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
    Publication number: 20140123563
    Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: NEXPLANAR CORPORATION
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson
  • Polishing pad with multi-modal distribution of pore diameters
    Patent number: 8702479
    Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: April 22, 2014
    Assignee: NexPlanar Corporation
    Inventors: Ping Huang, Diane Scott, James P. LaCasse, William C. Allison
  • Polishing Pad for Eddy Current End-Point Detection
    Publication number: 20140102010
    Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Application
    Filed: December 6, 2013
    Publication date: April 17, 2014
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson
  • Homogeneous polishing pad for eddy current end-point detection
    Patent number: 8657653
    Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: February 25, 2014
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson