Abstract: Methods for forming conductor contacts provide for etching through a capping layer located upon a conductor contact region within a substrate. A first pair of methods provide for etching through at least a lower thickness of the capping layer with other than a reactive ion etch to provide an exposed conductor contact region. A partially overlapping second pair of methods provides for converting at least an upper thickness of the capping layer to a converted material layer that is removed incident to providing an exposed conductor contact region. As adjunct to any of the methods, a liner layer is formed and located upon the exposed conductor contact region in absence of an undesirable reactive environment.

Abstract: Method for reducing resist poisoning. The method includes the steps of forming a first structure in a dielectric on a substrate, reducing amine related contaminants from the dielectric and the substrate prior to a formation of a second structure on the substrate such that the amine related contaminates will not diffuse out from either the substrate or the dielectric, wherein the reducing utilizes a plasma treatment which one of chemically ties up the amine related contaminates and binds, traps, or consumes the amine related contaminates during subsequent processing steps, forming the second structure on the substrate, and after the forming of the first structure, preventing poisoning of a resist layer in subsequent processing by the reducing.

Abstract: A method for reducing resist poisoning is provided. The method includes forming a first structure in a dielectric on a substrate and reducing amine related contaminants from the dielectric and the substrate created after the formation of the first structure. The method further includes forming a second structure in the dielectric. A first organic film may be formed on the substrate which is then heated and removed from the substrate to reduce the contaminant. Alternatively, a plasma treatment or cap may be provided. A second organic film is formed on the substrate and patterned to define a second structure in the dielectric.

Abstract: The present invention pertains to a system and method for the tokenization of text. The featurizer may be configured to receive input text and convert the input text into tokens. According to one aspect of the invention, the tokens may include only one type of character, the characters selected from the group consisting of letters, numbers, and punctuation. The tokenizer may also include a classifier. The classifier may be configured to receive the tokens from the featurizer. Furthermore, the classifier may be configured to analyze the tokens received from the featurizer to determine if the tokens may be input into a predetermined classification model using a preclassifier. If one of the tokens passes the preclassifier, then the token is classified using the predetermined classification model. Additionally, according to a first aspect of the invention, the tokenizer may also include a finalizer. The finalizer may be configured to receive the tokens and may be configured to produce a final output.

Abstract: A system and method is disclosed for detecting and repairing audio recordings that contain busy signals and extended periods of silence by searching for clusters of silence by reviewing the amplitude in an audio recording sample and listing each silence and sample time.

Abstract: A system and method for a speech recognition technology that allows language models to be customized through the addition of special pronunciations for components of phrases, which are added to the factory language models during customization. It allows components of a phrase to have different pronunciations inside customer-added phrases than are specified for those isolated components in the factory language models.

Abstract: A system and method for a speech recognition technology that allows language models for a particular language to be customized through the addition of alternate pronunciations that are specific to the accent of the dictator, for a subset of the words in the language model. The system includes the steps of identifying the pronunciation differences that are best handled by modifying the pronunciations of the language model, identifying target words in the language model for pronunciation modification, and creating a accented speech file used to modify the language model.

Abstract: A system and method for automatically modifying a language model and post-processor information is provided. The system includes the steps of language model identification, site-specific model creation, and language model adaptation.

Abstract: A decoupling capacitor is provided for a semiconductor device and may include a first low dielectric insulator layer and a low resistance conductor formed into at least two interdigitized patterns on the surface of the first low dielectric insulator in a single interconnect plane. A high dielectric constant material may be provided between the two patterns. A circuit for testing a plurality of these capacitors is also provided which includes a charge monitoring circuit, a coupling circuit and a control circuit.

Abstract: 5 A system and method may be disclosed for facilitating the site-specific customization of automated speech recognition systems by providing a customization client for site-specific individuals to update and modify language model input files and post processor input files. In customizing the input files, the customization client may provide a graphical user interface for facilitating the inclusion of words specific to a particular site. The customization client may also be configured to provide the user with a series of formatting rules for controlling the appearance and format of a document transcribed by an automated speech recognition system.

Abstract: A method for reducing resist poisoning is provided. The method includes forming a first structure in a dielectric on a substrate and reducing amine related contaminants from the dielectric and the substrate created after the formation of the first structure. The method further includes forming a second structure in the dielectric. A first organic film may be formed on the substrate which is then heated and removed from the substrate to reduce the contaminant. Alternatively, a plasma treatment or cap may be provided. A second organic film is formed on the substrate and patterned to define a second structure in the dielectric.

Abstract: Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.

Abstract: A method for reducing resist poisoning is provided. The method includes forming a first structure in a dielectric on a substrate and reducing amine related contaminants from the dielectric and the substrate created after the formation of the first structure. The method further includes forming a second structure in the dielectric. A first organic film may be formed on the substrate which is then heated and removed from the substrate to reduce the contaminant. Alternatively, a plasma treatment or cap may be provided. A second organic film is formed on the substrate and patterned to define a second structure in the dielectric.

Abstract: Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.

Abstract: An interconnect structure having reduced fringing fields of bottom corners of said interconnect structure and a method of fabricating the same is provided. The interconnect structure includes one or more interconnect levels one on top of each other, wherein each interconnect level is separated by a diffusion barrier and includes a dielectric stack of at least one low-k interlayer dielectric on at least one hybrid dielectric, said dielectrics having planar interfaces therebetween, each interconnect level further comprising metallic lines formed in said low-k interlayer dielectric, with the proviso that bottom horizontal portions of said metallic lines are not coincident with said interface, and said metallic lines are contained within said low-k interlayer dielectric. The interconnect structures may be fabricated such that top horizontal portions of the metallic lines are coplanar with a top surface of the low-k interlayer dielectric.

Abstract: A service monitor and a browser monitor determine performance metrics on both a server and a client in connection with a distributed application running on a network. While applicable to other types of distributed application data, an example is described in which a Web page is requested by a user running a browser program on the client computer. In response, the server transmits the requested Web page, along with JavaScript code that defines a browser monitor, to the client. A browser monitoring function controlled by this code determines a plurality of different performance metrics related to the access of Web pages by the client. In addition, the server monitor determines performance metrics specific to its function in providing the Web page to the client. A correlated performance metric is determined by combining a server performance metric with a browser performance metric.