Abstract: The operator may first place a blank device in a first socket in a first site. The APS may self-teach the position and orientation of that first socket by removing and replacing the device in the socket one or more times, and by detecting the position of the device in the socket or by monitoring a change in position of the device as it is placed into the socket. The APS then picks the device from the first socket (or from the input tray) and moves it in succession through the rest of the sockets to establish position and orientation of each socket. After all sockets are taught, the APS loads all sockets with blank devices, and programming begins. Alternatively, the programming job begins as each site is taught and before the remaining sites are taught so that production output can begin “immediately.

Abstract: Apparatuses and methods for using direct solar radiation. The apparatus may include a housing defining a window configured to transmit solar radiation and a secondary radiation source for transmitting a second radiation in response to the solar radiation via a non-transitory computer-readable medium having computer-readable instructions stored thereon and configured to be executed by a processor to measure the solar radiation and actuate the secondary radiation source.

Abstract: Apparatuses and methods for using direct solar radiation. The apparatus may include a housing defining a window configured to transmit solar radiation and a secondary radiation source for transmitting a second radiation in response to the solar radiation via a non-transitory computer-readable medium having computer-readable instructions stored thereon and configured to be executed by a processor to measure the solar radiation and actuate the secondary radiation source.

Abstract: An object detection system utilizes a teach cycle performed with a low-pressure blow-off (i.e. positive pressure) instead of vacuum (negative pressure). During the teach operation, the positive pressure is enabled and the nozzle is lowered to the object. An air sensor detects pressure or flow at the nozzle tip. A rise in pressure or drop in flow is detected as the nozzle makes contact with the object (i.e. just before or just after actual physical contact is made). The height of the object is stored as the taught height to be used subsequently in repetitive operations by the machine. This teaching method is particularly useful for very small objects because the positive pressure does not lift the object.

Abstract: The operator may first place a blank device in a first socket in a first site. The APS may self-teach the position and orientation of that first socket by removing and replacing the device in the socket one or more times, and by detecting the position of the device in the socket or by monitoring a change in position of the device as it is placed into the socket. The APS then picks the device from the first socket (or from the input tray) and moves it in succession through the rest of the sockets to establish position and orientation of each socket. After all sockets are taught, the APS loads all sockets with blank devices, and programming begins. Alternatively, the programming job begins as each site is taught and before the remaining sites are taught so that production output can begin “immediately.

Abstract: An object detection system utilizes a teach cycle performed with a low-pressure blow-off (i.e. positive pressure) instead of vacuum (negative pressure). During the teach operation, the positive pressure is enabled and the nozzle is lowered to the object. An air sensor detects pressure or flow at the nozzle tip. A rise in pressure or drop in flow is detected as the nozzle makes contact with the object (i.e. just before or just after actual physical contact is made). The height of the object is stored as the taught height to be used subsequently in repetitive operations by the machine. This teaching method is particularly useful for very small objects because the positive pressure does not lift the object.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: Systems and methods for teaching a location in a device programming apparatus. The X, Y, Z and angle coordinates of a pick and place nozzle are initialized, and the nozzle is moved in the X and Y coordinates to a position above the device in the location to be taught. The new X and Y coordinates of the nozzle are stored to a memory along with the initial angle coordinate. The system automatically determines the Z location of the surface of the device. The nozzle then automatically picks up the device and performs vision centering to determine the X, Y and angle offsets with respect to the initialized coordinates. The X, Y and angle offsets are used to modify the stored X, Y and angle coordinates so as to precisely determine the X and Y location of the device center as well as the device angle with respect to the system's global reference frame.

Abstract: A fluid mass flow controller, particularly adapted for controlling mass flow rates of toxic and reactive gases used in semiconductor device fabrication, includes a control circuit connected to pressure sensors for sensing the differential pressure across a flow restrictor in the mass flow controller for controlling a valve to control the fluid mass flow rate to a setpoint. The control circuit compares the differential pressure with the downstream pressure at a measured temperature with a data set of a gas passing through the flow controller for a range of differential pressures and downstream pressures and adjusts the flow control rate accordingly. The flow controller is mechanically uncomplicated including a two part body for supporting the pressure sensors, a remotely controllable flow control valve and the flow restrictor.

Abstract: A computer controlled group of programmer sites are provided to burn in or enter operating code into various types of programmable electronic devices, such as programmable memories, programmable logic devices (or PLD's), field programmable gate arrays (or FPGA's), and the like. The programmer sites are conned to a central controller and operate under control of the central controller, typically personal computer. Each programmer site includes its own computer processor or CPU. Initially for a production run of a particular type of device, one of the programmer sites serves as a master site. At the master site, an optimized control sequence for the device is developed in conjunction with the central controller. Once this is achieved, the optimal sequence is broadcast to all programmer sites connected to the central controller.

Abstract: A computer controlled group of programmer sites are provided to burn in or enter operating code into various types of programmable electronic devices, such as programmable memories, programmable logic devices (or PLD's), field programmable gate arrays (or FPGA's), and the like. The programmer sites are connected to a central controller and operate under control of the central controller, typically personal computer. Each programmer site includes its own computer processor or CPU. Initially for a production run of a particular type of device, one of the programmer sites serves as a master site. At the master site, an optimized control sequence for the device is developed in conjunction with the central controller. Once this is achieved, the optimal sequence is broadcast to all programmer sites connected to the central controller.

Abstract: A computer controlled group of programmer sites are provided to burn in or enter operating code into various types of programmable electronic devices, such as programmable memories, programmable logic devices (or PLD's), field programmable gate arrays (or FPGA's), and the like. The programmer sites are connected to a central controller and operate under control of the central controller, typically personal computer. Each programmer site includes its own computer processor or CPU. Initially for a production run of a particular type of device, one of the programmer sites serves as a master site. At the master site, an optimized control sequence for the device is developed in conjunction with the central controller. Once this is achieved, the optimal sequence is broadcast to all programmer sites connected to the central controller.

Abstract: A computer controlled group of programmer sites are provided to burn in or enter operating code into various types of programmable electronic devices, such as programmable memories, programmable logic devices (or PLD's), field programmable gate arrays (or FPGA's), and the like. The programmer sites are connected to a central controller and operate under control of the central controller, typically personal computer. Each programmer site includes its own computer processor or CPU. Initially for a production run of a particular type of device, one of the programmer sites serves as a master site. At the master site, an optimized control sequence for the device is developed in conjunction with the central controller. Once this is achieved, the optimal sequence is broadcast to all programmer sites connected to the central controller.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: A computer controlled group of programmer sites are provided to burn in or enter operating code into various types of programmable electronic devices, such as programmable memories, programmable logic devices (or PLD's), field programmable gate arrays (or FPGA's), and the like. The programmer sites are connected to a central controller and operate under control of the central controller, typically personal computer. Each programmer site includes its own computer processor or CPU. Initially for a production run of a particular type of device, one of the programmer sites serves as a master site. At the master site, an optimized control sequence for the device is developed in conjunction with the central controller. Once this is achieved, the optimal sequence is broadcast to all programmer sites connected to the central controller.

Abstract: A paint spray booth and air supply arrangement includes a main fan for blowing air and an air supply plenum in fluid communication with the main fan for receiving blown air therefrom. A support grid is positioned beneath the air supply plenum and includes a plurality of grid openings. A painting chamber is positioned beneath the support grid. A plurality of diffuser modules are positioned within the plurality of grid openings, respectively, for directing blown air from the air supply plenum in a substantially vertically downward direction through the painting chamber. Each diffuser includes an adjustment feature for selectively adjusting the speed of air directed therethrough. An apparatus is provided for individually adjusting the adjustment feature in each of the plurality of diffuser modules for creating areas of variable air speed through the painting chamber corresponding with each diffuser module while the diffuser modules being adjusted are supported on the support grid.

Abstract: A semiconductor structure including a doped semiconductor substrate defining a surface. A buffer layer of epitaxial semiconductor material overlies the substrate surface, the buffer layer having a relatively higher dopant concentration than the substrate and being virtually free from oxygen precipitation. A layer of intrinsic semiconductor material overlies the buffer layer, and a device layer of epitaxial semiconductor material is situated on the intrinsic layer. The device layer is formed to have a relatively lower dopant concentration than the first layer. Isolation regions extend from a surface of the device layer into the buffer layer for forming an electrically isolated device region in the device layer. At least one active device is formed in the isolated device region.