Abstract: The invention concerns a wig or lace wig cap, to be worn by the user underneath a wig or lace wig. The cap is comprised of a plurality of panels using stretchable and breathable material, an elasticized banding and a plurality of sew on snap fasteners affixed to, said banding to form the Press and Go Wig and Lace Wig Snap Cap. Cooperating snaps are then affixed to a wig or lace wig around the entire circumference of the outer inside wig weft, concealing the application process, thereby producing a comfortable, airy and secure fit to the user. An additional banding is included, affixed with a plurality of snap fasteners designed to fit cooperating snaps of a wig or lace wig. Also included is a tension strap affixed with two cooperating snap fasteners designed to be used as an adjustment strap to the cap banding or separate banding.

Abstract: Computing device connectors are described. In one or more implementations, a connector includes one or more communication contacts configured to support transmission of data and a receptacle secured within an opening of a printed circuit board. The receptacle having the one or more communication contacts disposed therein to support transmission of data upon contact with one or more communication contacts of a plug disposed within the receptacle, the receptacle having an angled outer edge.

Abstract: Input device attachment techniques are described. In one or more implementations, an input device includes an input portion configured to generate signals to be processed by a computing device and a mid-spine that is physically attached to the input portion and configured to form a removable physical coupling to be secured to a first side of the computing device that includes a display device. The input device also includes a connection portion that is physically attached the mid-spine and is configured to form a removable physical coupling to be secured to a second side of the computing device that is different than the first side and form a communicative coupling to the computing device to communicate the generated signals from the input portion.

Abstract: This document describes a lockable display and techniques enabling use of a lockable display. The techniques can enable computing devices to lock and unlock a display using little or no power and with a seamless design. The techniques and apparatuses can also enable integration between a lockable display and various computing devices, including to create a nearly seamless physical and functional design.

Abstract: The invention concerns a wig or lace wig cap, to be worn by the user underneath a wig or lace wig. The cap is comprised of a plurality of panels using stretchable and breathable material, an elasticized banding and a plurality of sew on snap fasteners affixed to, said banding to form the Press and Go Wig and Lace Wig Snap Cap. Cooperating snaps are then affixed to a wig or lace wig around the entire circumference of the outer inside wig weft, concealing the application process, thereby producing a comfortable, airy and secure fit to the user. An additional banding is included, affixed with a plurality of snap fasteners designed to fit cooperating snaps of a wig or lace wig. Also included is a tension strap affixed with two cooperating snap fasteners designed to be used as an adjustment strap to the cap banding or separate banding.

Abstract: Techniques for object profile for object machining are described. In at least some implementations, an object profile is generated by measuring attributes of an object, such as its dimensions. The object profile can correspond to a data representation of object attributes. The object profile is employed to determine a machining path for machining the object based on a particular design and/or pattern. In at least some implementations, an alignment guide is generated that enables an object to be positioned for machining by a machining device. The alignment guide, for instance, can correspond to a particular position in a coordinate space. Aligning an object with the alignment guide includes moving the object (e.g., rotationally and/or translationally) to align with the alignment guide. When aligned with the alignment guide, the object can be machined according to a specified object profile and/or pattern.

Abstract: A disclosed device having a principle axis and including a magnetoresistive stack, the magnetoresistive stack having first and second opposing surfaces, the magnetoresistive stack including a free layer, a spacer layer, and a reference layer, wherein the spacer layer is positioned between the first and reference layer, the free layer includes magnetic material having a free magnetic orientation in a first plane; the spacer layer includes nonmagnetic material; and the reference layer includes magnetic material having a pinned magnetic orientation in a second plane, wherein the second plane is perpendicular to the first plane and parallel to the principle axis of the device; an insulating layer at least a portion of the outer surface of the magnetoresistive stack; a shielding layer surrounding at least a portion of the insulating layer; and a conducting layer, wherein the conducting layer provides electrical connection between the magnetoresistive stack and the shielding layer.

Abstract: The instant application discloses, among other things, techniques to allow publications suitable for varying aspect ratios and resolutions to be designed and stored, with an appropriate design selected at the time the publication is displayed.

Abstract: The instant application discloses, among other things, techniques to allow baseline alignment. Aligning baselines across columns may improve readability and aesthetics. Baseline alignment may include having lines of body text, images, titles, or other elements have a common lower horizontal guideline.

Abstract: The present invention includes methods directed to improved processes for producing a monolayer of sulfur on the surface of a semiconductor. As a surface layer, it functions to passivate the surface; if annealed, it provides a doping element.

Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Abstract: A computer mouse includes a head and a tail. The head is configured to detect movement relative to a reference surface. The head is selectively switchable between an on state and an off state. The tail is connected to the head and is moveable between a curved configuration and a flat configuration. The tail is configured to switch the head to the on state when in the curved configuration and to switch the head to the off state when in the flat configuration.

Abstract: An integrated circuit and a method of manufacturing the integrated circuit, the method including: (a) providing a substrate; (b) forming a copper diffusion barrier layer on the substrate; (c) forming a dielectric layer on a top surface of the copper diffusion barrier layer; (d) forming a copper damascene or dual damascene wire in the dielectric layer, a top surface of the copper damascene or dual damascene wire coplanar with a top surface of the dielectric layer; (e) forming a first capping layer on the top surface of the wire and the top surface of the dielectric layer; (f) after step (e) performing one or more characterization procedures in relation to said integrated circuit; and (g) after step (e) forming a second capping layer on a top surface of the first capping layer.

Abstract: The present invention includes methods directed to improved processes for producing a monolayer of sulfur on the surface of a semiconductor. As a surface layer, it functions to passivate the surface; if annealed, it provides a doping element.

Abstract: A method for classification of defects and running of grinding of lamination cylinders includes identifying defect areas in a map illustrating a plurality of surface measurements of a cylinder. The method includes calculating, for each area identified, a plurality of parameters. The method includes identifying a type of defect associated with the areas identified, on the basis of the parameters calculated. The method includes determining an acceptability threshold of a specific defect for each type of defect identified. The method includes defining a corrective action for each area on the basis of a comparison between the acceptability threshold associated with the type of defect of the area, and a measurement of the surface measurements of the cylinder associated with the area. The method includes determining grinding parameters on the basis of the surface measurements of the cylinder, if the corrective action is a grinding operation to remove the defects.

Abstract: An integrated circuit and a method of manufacturing the integrated circuit, the method including: (a) providing a substrate; (b) forming a copper diffusion barrier layer on the substrate; (c) forming a dielectric layer on a top surface of the copper diffusion barrier layer; (d) forming a copper damascene or dual damascene wire in the dielectric layer, a top surface of the copper damascene or dual damascene wire coplanar with a top surface of the dielectric layer; (e) forming a first capping layer on the top surface of the wire and the top surface of the dielectric layer; (f) after step (e) performing one or more characterization procedures in relation to said integrated circuit; and (g) after step (e) forming a second capping layer on a top surface of the first capping layer.

Abstract: A copper corrosion resistant integrated circuit. The integrated circuit including: a substrate; a copper diffusion barrier layer on the substrate; a dielectric layer on a top surface of the copper diffusion barrier layer; a copper damascene or dual damascene wire in the dielectric layer, a top surface of the copper damascene or dual damascene wire coplanar with a top surface of the dielectric layer; a first capping layer on the top surface of the wire and the top surface of the dielectric layer; and a second capping layer on a top surface of the first capping layer.

Abstract: A hopper coin feeder (1) comprises upper and lower hopper discs (18, 25). A flexible hopper wall (17) of diabolo shape cooperates with the upper disc (18) to control the feeding of coins by a coin pushing member (35) to the outer margin of the disc (18) where they are gripped between an annular band (33) and the disc (18) to be conveyed past a coin discriminator (61). Any coins or debris that drop from the edge of upper disc (18) are caught on the lower disc (25) and pass to a reject chute (132) and coin payout cup (12). An active coin delivery chute and diverter (80), FIG. 10, comprises a reciprocable plate (81) having a finger (82) which controls whether a coin fed from the upper disc (18) passes down the chute or is rejected onto the lower disc (25). Coins that pass down the chute enter a bowl (89) of a double-disc coin conveying assembly (5) that conveys a coin from the bowl (89) to a LIFO coin stacks (3) of a coin storage unit (1).