Patents by Inventor William J. Rudik

William J. Rudik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board including multiple wire photosensitive adhesive
    Patent number: 4544801
    Abstract: A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.
    Type: Grant
    Filed: August 9, 1984
    Date of Patent: October 1, 1985
    Assignee: International Business Machines Corporation
    Inventors: William J. Rudik, George P. Schmitt, John F. Shipley