Abstract: Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to an outlet tube are provided with a nozzle adaptor which has an internal adapter body which is resiliently carries a support collar which is held in an axial direction relative to the internal body by a spring. A bezel ring having a plurality of receiving tabs is mounted in the support collar, the tabs on the bezel ring in the support collar engage tabs on a mounting plate of each nozzle assembly, causing compression of the spring and resulting in a clamping of the mounting plate between a bottom surface of the internal body and the bezel ring.

Abstract: A soldering/desoldering apparatus has a handpiece with a handgrip portion from which a hot air tube extends, a vacuum pickup tube which extends through the handgrip portion and hot air tube, one end of which has a suction cup mounted thereon and an opposite end of which is connected to a flexible vacuum line. Furthermore, an adjustment knob for axially shifting the vacuum pickup tube is provided on the handgrip portion and the vacuum pickup tube is resiliently displaceably supported relative to a displacement mechanism formed by a slide rod fixed to an inner wall of the handgrip portion and a rack member slidably disposed on the slide rod and geared to the adjustment knob. The pickup tube is fixed to a slide bracket which is slidably disposed on the slide rod between the ends of the rack member and between a pair of coil springs which act to position the slide bracket in a neutral position between the ends of the rack member. Additionally, nozzles having a fixed vacuum pickup extension can be used.

Abstract: A soldering iron including an insulator, a dissipator, and a hollow, cylindrical handle through which the electrical cable travels, and in which the wires, extending from the electrical cable and connected to the heater unit by individual plug and socket connectors, are able to move freely for making it easier to exchange the heating element but prevent the wires from being accidentally disconnected by pulling on the electrical cord during use. More specifically, a single electrical insulator body, which fits inside the dissipator, receives all of the electrical connectors. Furthermore, the insulator provides unidirectional strain relief by trapping the wires against an inside tapered portion of the dissipator when mounted within the dissipator and releases the wires in the opposite direction simply by the act of being removed from the dissipator.

Abstract: A handheld low voltage machining tool with which any one or more of drilling, milling, and abrading operations can be safely performed even on densely populated, multilayer, circuit boards. Provisions are made for preventing electrical overstress by isolating the tip of the machining tool from the drive motor as well as for preventing abrupt starting of the tool which can cause jerking, jumping or skipping of the tool off of the target. Still further, dynamic braking of the tool bit is achieved, both upon release of an operator actuated control switch and due to a selected conductive layer being reached. For the latter effect, a probe is provided by which a low voltage can be delivered to a component or conductor on the board, and circuitry detects grounding of this voltage by contact with the grounded bit of the machining tool.

Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.

Abstract: A component installation/removal tweezer-type handpiece having two arms and a tinnable or nontinnable tip including a pair of legs respectively removably mounted with respect to the arms and a plurality of serially connected bands attached to the first and second legs such that an opening is formed within the serially connected bands so that the bands are adapted, upon closure of the tweezer-type handpiece, to clamp the terminals of an electronic component or the like and transmit heat to the terminals. In another embodiment a tweezer-type or probe-type handpiece includes a tinnable or nontinnable tip having first and second legs and one or more bands extending between the legs whereby the band(s) is adapted to transfer heat to terminals associated with an electronic component. In all embodiments of the invention the tips may be provided with a variety of sheathing or overlayer combinations to achieve a variety of application requirements.

Abstract: A thermocouple arrangement for developing, evaluating, monitoring and adjusting any process performed on or otherwise so as to thermally affect a printed circuit board assembly or other electronic assembly (including bare circuit board or boards in the manufacturing process), such as soldering/desoldering and various other production, rework and repair processes including cleaning, fluxing, preheating, thermocompression bonding and spot welding. In accordance with various embodiments, a layer of a first conductor material is applied on a first surface of an electrically insulative support, while a second layer of a second, dissimilar, conductor material is applied to at least one other surface of the support using conventional printed circuit board construction techniques.

Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.

Abstract: Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.

Abstract: This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heater is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heate is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid toward the sides of the component. The nozzle has downwardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle. The baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the component to or removal of the component from a printed circuit board.

Abstract: An in-line solder extractor and a tubular heating assembly for use therewith having a tubular tip disposed within the tubular heating assembly a hollow handle, the heater assembly being mounted with respect to the forward portion of the handle a solder collection chamber disposed within the handle, and forward and rearward seals for sealing the forward and rearward ends.

Abstract: Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle for receiving solder from the reservoir; an element for conveying the molten solder in the reservoir to the nozzle; and a source connected to the contained space for introducing a pressurized gas into the space to raise the solder through the conveying means to a predetermined level within the nozzle and maintaining said solder at said predetermined level to thus effect the operation with the molten solder and then removing the gas to return the solder to the reservoir. The gas is pulsed at least during the time the solder approaches and reaches the predetermined level. The apparatus includes a plurality of different size hollow nozzles for receiving solder from the reservoir where the nozzles are removably attachable with respect to the reservoir.

Abstract: A X-Y table is disclosed having a table rotatably mounted on a base for movement in the X-Y and .theta. directions. The device includes fine adjustments in both X and Y directions and a quick shear mechanism with means for automatically returning the table to its original position after the quick shear procedure. The table may be used as a stand above unit or particularly for use in installing and removing components from printed circuit boards.

Abstract: A mounting structure is disclosed including two pairs of spaced apart parallel rails with a longitudinal slot separating each of the pair. A trackway is formed under each pair of rails and a slider is slidable in the trackway and may be connected to a third rail orthogonally mounted on the pairs of rails, by means of a bolt passing through the slider and engaging a nut in a T-shaped slot in the third rail.

Abstract: Heater device suitable for heating a fluid such as air to be contacted with a printed circuit board for melting solder or the like thereon. The device comprises two heat exchange elements having at least one passage through which fluid to be heated passes. A stainless steel etched foil heater is disposed in a plane between the first and second heat exchange elements, and a fluid entry port is provided in flow communication with the first and second heat exchange elements for admitting fluid to be heated into the at least one passage. A fluid exit port is provided in flow communication with the at least one passage for passing heated fluid from the passage to the substrate to melt the solder or the like thereon. The fluid entering through the fluid entry port and exiting through the fluid exit port flows in generally the same direction as the plane of the heater.

Abstract: Heater device suitable for heating a fluid such as air to be contacted with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a printed circuit board or removal therefrom. The device comprises two heat exchange elements having a stainless steel etched foil heater sandwiched therebetween. Each heat exchange element is approximately square in configuration, and has a passageway extending from an outer peripheral point of each element about a central axis parallel to the four sides of each element toward the center. The heat exchange elements may be connected for serial flow whereby air to be heated passes along the passageway of one element and then enters the second heat exchange element and passes through that element and exits therefrom, or for parallel flow whereby a first stream of air to be heated passes through one of the elements and a second stream of air to be heated passes through the second heat exchange element.

Abstract: An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask having at least one hole extending therethrough and the hole being aligned with the component. A conduit is provided for directing liquid solder into the hole in the mask to contact leads of the component and thus facilitate installation or removal thereof from the board.