Abstract: Nozzle structure suitable for bringing heated fluid into contact with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a substrate or removal therefrom. The nozzle structure comprises a conduit forming member engageable with the component and with the substrate to form a heated fluid conduit extending around the periphery of the component, and a heated fluid delivery conduit coupled to the conduit forming member for delivering heated fluid to the heated fluid conduit to effect melting of solder or the like at the terminals of the component.

Abstract: A desolderer and heater assembly therefor wherein the heater assembly includes at least a heating element and a solder transfer means where the forward end of the solder transfer means is adapted to receive a desoldering tip and where the thermal characteristics of the rear end portion of the solder transfer means are such that the heater element raises the rear end portion of the solder transfer means to a solder melting temperature shortly after the tip reaches this temperature. The desolderer includes a solder collection chamber into which molten solder is ejected from the solder transfer means where the solder collection chamber may be disposed either inside or outside the desolderer handle. Various embodiments are described whereby the heater assembly may be adapted to receive a seal mounting member so that the forward end of the solder collection chamber can be sealed at a surface which is removed from the path the molten solder traverses through the solder transfer means.

Abstract: Apparatus including a planar support having a plurality of terminations such as plated through holes arranged therein in an array and a plurality of sensing devices respectively associated with the terminations for measuring a physical quantity thereat such as temperature. The resulting structure is useful for training a person in a manual skill such as soldering. Also disclosed is a common connector plug for receiving at one side of the support a plurality of electrical leads from the sensing devices and an analyzer and indicator connected to the common plug for measuring the time required for the temperature and/or pressure at one of the terminals to rise from an initial value to a final value, the terminal being that to which a device such as a soldering iron is applied to effect the soldering of an electrical connection thereat.

Abstract: A vacuum control system is disclosed consisting of a pedal actuated valve connected between a source of air under pressure and a Venturi tube where the valve and the Venturi tube are enclosed within a base and a treadle member pivotally mounted on the base for actuating the valve. The Venturi tube has a port in which a vacuum is created upon actuation of the valve to its open position. Air ejected from the Venturi may be noiselessly diffused by porous filler material disposed adjacent the output side of the Venturi. Further, the ejected air is directed away from the foot and leg of the operator by enlarging the clearance between the forward edges of the treadle member and base while decreasing the clearance between the rear edges thereof when the treadle member is depressed to actuate the system.

Abstract: A desoldering device is disclosed which can be connected to a plurality of different pencil type soldering irons having a removable soldering tip. The device comprises a head member with an adaptor which can be secured to the soldering iron after the soldering tip has been removed. The head member has a through passage in which is positioned a hollow tube and copper tip. A base member is secured to the hollow tube and supports a glass container for receiving softened solder. A source of suction is connected to the base member for drawing the softened solder through the hollow tip and tube and depositing it in the glass container.