Abstract: A digital thermometer includes a first oscillator to generate a first clock signal, wherein a period of the first clock signal remains constant in view of changes in a temperature of the apparatus and a first counter coupled to the first oscillator, the first counter to count a fixed number of cycles of the first clock signal associated with a measurement period. The digital thermometer further includes a second oscillator to generate a second clock signal, wherein a period of the second clock signal varies with changes in the temperature and a second counter coupled to the second oscillator, the second counter to generate an output representing a count of a number of cycles of the second clock signal that occur during the measurement period. In addition, the digital thermometer includes calibration circuitry coupled to the second counter, the calibration circuitry to calibrate the output of the second counter to generate a value representing the temperature of the apparatus.

Abstract: A modular tire pressure leak detection system includes a tire that supports a vehicle and a sensor unit mounted on the tire. The sensor unit detects real-time tire parameters inside the tire and transmits the parameters to a processor. A plurality of modules are in electronic communication with the processor. The plurality of modules include a pre-processing module that receives the parameters and applies a set of operations to generate pressure time series data, a leak detection module that receives the pressure time series data and determines a leak rate of the tire, and a post-processing module that receives the leak rate of the tire and analyzes the leak rate of the tire with determinations from a plurality of conditions. A leak alert is issued by the post-processing module based upon the analysis of the leak rate of the tire and the determinations from the plurality of conditions.

Abstract: A printing system includes: a plurality of unitary objects each having a unique identification code, a plurality of fixtures arranged on a base, and a printer controller. Each unitary object includes a uniquely-shaped three-dimensional body fixed to a plate by a connection mechanism. Each fixture includes: a fixture block defining a printing opening; and a plate guide defined in the fixture block and configured to receive the plate. A target region of the three-dimensional body is aligned within the printing opening of the fixture block when the plate is fixed within the plate guide. The printer controller is configured to: detect the unique identification code of each unitary object; and control an ink dispenser to print a unique topographical design on each aligned target region of each three-dimensional body, the unique topographical design being associated with the detected unique identification code.

Abstract: A variety of applications can include apparatus or methods that provide a well ring for resistive ground power domain segregation. The well ring can be implemented as a n-well in a p-type substrate. Resistive separation between ground domains can be generated by biasing a n-well ring to an external supply voltage. This approach can provide a procedure, from a process standpoint, that provides relatively high flexibility to design for chip floor planning and simulation, while providing sufficient noise rejection between independent ground power domains when correctly sized. Significant noise rejection between ground power domains can be attained.

Abstract: Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.

Abstract: Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.

Abstract: A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSSs) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

Abstract: A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSSs) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

Abstract: A method includes placing a weighted fluid in the subterranean formation. The weighted fluid includes calcium bromide. The weighted fluid includes one or more secondary salts that are each independently an inorganic bromide salt other than calcium bromide. The weighted fluid also includes water. The weighted fluid has a density at standard temperature and pressure of at least about 1.7 g/cm3.

Abstract: The present disclosure may be directed to defoaming methods and compositions. A method of treating a subterranean formation may comprise providing a defoaming composition, wherein the defoaming composition comprises a tall-oil-derived surfactant. The method may further comprise mixing the defoaming composition with an aqueous fluid to form a treatment fluid such that foaming in the treatment fluid is reduced, wherein the treatment fluid is a water-based fluid. The method may further comprise placing the treatment fluid into the subterranean formation.

Abstract: A method and system for presentation of an augmented reality experience is disclosed. The method for producing the augmented reality viewing experience comprises viewing real-world objects such as 2D and 3D works of art or other objects through a portable device such as a smart phone, tablet or augmented reality goggles. An augmented reality application controlling the augmented reality experience prompts the viewer to begin the experience. Both three-dimensional and two-dimensional multi-media presentations, such as an animation telling a story related to the real-world object are displayed on the portable device in one or more virtual screens anchored to the real-world object.

Abstract: The present disclosure may be directed to defoaming methods and compositions. A method of treating a subterranean formation may comprise providing a defoaming composition, wherein the defoaming composition comprises a tall-oil-derived surfactant. The method may further comprise mixing the defoaming composition with an aqueous fluid to form a treatment fluid such that foaming in the treatment fluid is reduced, wherein the treatment fluid is a water-based fluid. The method may further comprise placing the treatment fluid into the subterranean formation.

Abstract: Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.

Abstract: A method and system for presentation of an augmented reality experience is disclosed. The method for producing the augmented reality viewing experience comprises viewing real-world objects such as 2D and 3D works of art or other objects through a portable device such as a smart phone, tablet or augmented reality goggles. An augmented reality application controlling the augmented reality experience prompts the viewer to begin the experience. Both three-dimensional and two-dimensional multi-media presentations, such as an animation telling a story related to the real-world object are displayed on the portable device in one or more virtual screens anchored to the real-world object.

Abstract: Embodiments relate to removing residue from a well bore and well bore equipment with a treatment fluid composition, and in some embodiments, to treatment fluid compositions that comprise nanoparticles. An embodiment provides a method of removing drilling fluid residue from the surfaces of well equipment. The method comprising: applying a solid nanoparticle film to at least a portion of the surfaces of the well equipment with a treatment fluid comprising solid nanoparticles; and allowing the solid nanoparticles to interact with the surfaces of the well equipment and the drilling fluid residue adhered to the surfaces of the well equipment to remove at least a portion of the drilling fluid residue from the surfaces of the well equipment.

Abstract: A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSS s) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

Abstract: A disclosed embodiment of a downhole tool includes a pump that is powered by rotation of the drill string to increase fluid pressure during downhole circulation.

Abstract: Embodiments relate to removing residue from a well bore and well bore equipment with a treatment fluid composition, and in some embodiments, to treatment fluid compositions that comprise nanoparticles. An embodiment provides a method of removing drilling fluid residue from the surfaces of well equipment. The method comprising: applying a solid nanoparticle film to at least a portion of the surfaces of the well equipment with a treatment fluid comprising solid nanoparticles; and allowing the solid nanoparticles to interact with the surfaces of the well equipment and the drilling fluid residue adhered to the surfaces of the well equipment to remove at least a portion of the drilling fluid residue from the surfaces of the well equipment.

Abstract: Various embodiments disclosed relate to weighted fluids for treatment of subterranean formations. In various embodiments, the present invention provides a method of treating a subterranean formation. The method includes placing a weighted fluid in the subterranean formation. The weighted fluid includes calcium bromide. The weighted fluid includes one or more secondary salts that are each independently an inorganic bromide salt other than calcium bromide. The weighted fluid also includes water. The weighted fluid has a density at standard temperature and pressure of at least about 1.7 g/cm3.

Abstract: Embodiments relate to removing residue from a well bore and well bore equipment with a treatment fluid composition, and in some embodiments, to treatment fluid compositions that comprise nanoparticles. An embodiment provides a method of removing drilling fluid residue from the surfaces of well equipment. The method comprising: applying a solid nanoparticle film to at least a portion of the surfaces of the well equipment with a treatment fluid comprising solid nanoparticles; and allowing the solid nanoparticles to interact with the surfaces of the well equipment and the drilling fluid residue adhered to the surfaces of the well equipment to remove at least a portion of the drilling fluid residue from the surfaces of the well equipment.