Abstract: A magnetic field sensor includes a substrate first and second magnetic field sensing elements, comprising first and second magnetoresistance elements, respectively. The first and second magnetic field sensing elements are responsive to the magnet. At or more positions of the magnet relative to the first and second magnetic field sensing elements while the magnet is stopped moving, at least one of the first magnetic field sensing element or the second magnetic field sensing element is in saturation in response to the magnet.

Abstract: A pressure sensor comprises a deformable substrate, at least one coil supported by the substrate and responsive to a changing coil drive signal to produce a changing magnetic field, a fluid chamber having a first wall formed by the substrate and a second wall formed by a conductive material and positioned proximate to the at least one coil so that the changing magnetic field produces eddy currents within the conductive material that generate a reflected magnetic field, and at least one magnetic field sensing element configured to detect the reflected magnetic field and produce a signal responsive to a distance between the magnetic field sensing element and the second wall. The substrate is deformable by fluid pressure within the fluid chamber and the deformation of the substrate changes the distance between the magnetic field sensing element and the second wall.

Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.

Abstract: A method of providing a sensor IC package can include applying a film to a leadframe having first and second surfaces, mounting at least one component to the film, and applying a pre-mold material to cover at least a portion of the leadframe and the passive component while leaving a first side of the leadframe exposed. The film can be removed and a die attached to the first side of the leadframe. At least one electrical connection can be formed between the die and the leadframe. The assembly of the die, the leadframe, and the pre-mold material can be encapsulated with a final mold material to provide a low profile IC package.

Abstract: Methods and apparatus for a magnetic field sensor integrated circuit including a lead frame having a first surface, a second opposing surface, and a plurality of leads. A substrate has a first surface supporting a magnetic field sensing element and a second surface attached to the first surface of the lead frame. A magnet has a first surface and a second, opposing surface, and is configured to generate a magnetic field. A spacer is positioned between the first surface of the magnet and the second surface of the lead frame with a thickness selected to establish a predetermined distance between the first surface of the magnet and the magnetic field sensing element, the predetermined distance selected to provide the magnetic field signal as a sinusoidal signal.

Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead.

Abstract: A magnetic field sensor includes a substrate first and second magnetic field sensing elements, comprising first and second magnetoresistance elements, respectively. The first and second magnetic field sensing elements are responsive to the magnet. At or more positions of the magnet relative to the first and second magnetic field sensing elements while the magnet is stopped moving, at least one of the first magnetic field sensing element or the second magnetic field sensing element is in saturation in response to the magnet.

Abstract: A joystick assembly for use with a device including a joystick surface and a first magnet having north and south magnetic poles includes a second magnet having north and south magnetic poles and a movable elongated shaft having first and second opposing ends arranged along a major axis of the shaft. The first end of the shaft is coupled to the second magnet such that movement of the shaft results in movement of the second magnet relative to the first magnet such that a line between centers of the north and south magnetic poles of the second magnet is movable relative to a line between the north and south magnetic poles of the first magnet. An attraction of the second magnet to the first magnet results in a restoring force upon the shaft, and the shaft and the second magnet are removable from the joystick surface.

Abstract: Methods and apparatus for sensor including a die, a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface, lead fingers to provide electrical connections to the leadframe and to the die; and a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of the IC package. The leadframe may have a cutout region in which the component is positioned.

Abstract: A pressure sensor comprises a deformable substrate, at least one coil supported by the substrate and responsive to a changing coil drive signal to produce a changing magnetic field, a fluid chamber having a first wall formed by the substrate and a second wall formed by a conductive material and positioned proximate to the at least one coil so that the changing magnetic field produces eddy currents within the conductive material that generate a reflected magnetic field, and at least one magnetic field sensing element configured to detect the reflected magnetic field and produce a signal responsive to a distance between the magnetic field sensing element and the second wall. The substrate is deformable by fluid pressure within the fluid chamber and the deformation of the substrate changes the distance between the magnetic field sensing element and the second wall.

Abstract: A joystick assembly for use with a device including a joystick surface and a first magnet having north and south magnetic poles includes a second magnet having north and south magnetic poles and a movable elongated shaft having first and second opposing ends arranged along a major axis of the shaft. The first end of the shaft is coupled to the second magnet such that movement of the shaft results in movement of the second magnet relative to the first magnet such that a line between centers of the north and south magnetic poles of the second magnet is movable relative to a line between the north and south magnetic poles of the first magnet. An attraction of the second magnet to the first magnet results in a restoring force upon the shaft, and the shaft and the second magnet are removable from the joystick surface.

Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.

Abstract: A pressure sensor includes a conductive substrate having a cavity which forms a thin portion that can be deformed by a pressure differential. A magnetic field sensor has at least one coil responsive to a changing coil drive signal and positioned proximate to the thin portion of the substrate that induces eddy currents in the thin portion that generate a reflected magnetic field. Magnetic field sensing elements detect the reflected magnetic field and generate a magnetic field signal. The magnetic field sensor is positioned so that deformation of the thin portion of the substrate causes a distance between the thin portion of the substrate and the magnetic field sensor to change.

Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.

Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.

Abstract: Methods and apparatus for an integrated circuit having first and second domains with an insulative material electrically isolating the first and second domains. A conductive shield is disposed between the first and second domains and a current sensor has at least one magnetoresistive element proximate the shield to detect current flow in the shield due to breakdown of the insulative material.

Abstract: An electronics module assembly for detecting photons is provided to include: a substrate layer; a buried layer deposited upon a first surface area of the substrate layer; an intrinsic layer deposited upon a first portion of a first surface area of the buried layer; a plug layer deposited upon a second portion of the first surface area of the buried layer; a p-plus layer deposited upon a first surface area of the intrinsic layer; an n-plus layer deposited upon a first surface area of the plug layer; a pre-metal dielectric (PMD) layer deposited upon the p-plus layer and n-plus layer; a first node coupled, through the PMD layer, to the p-plus layer; and a second node coupled, through the PMD layer, to the n-plus layer.

Abstract: According to an embodiment of the present disclosure, a photodetector device can include a substrate layer; a bottom contacting layer disposed over a surface of the substrate layer and having a first contacting region and a second contacting region, the bottom contacting layer providing a low resistance path between the first and second contacting regions; an insulating layer disposed over a surface of the bottom contacting layer; an intrinsic region disposed within the insulating layer, the intrinsic region in electrical contact with the first contacting region of the bottom contacting layer, the intrinsic region comprising a low band-gap material; a metal contact disposed within the insulating layer and in electrical contact with the second contacting region of the bottom contacting layer; an anode in electrical contact with the intrinsic region; and a cathode in electrical contact with the metal contact.

Abstract: Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

Abstract: Methods and apparatus for magnetic field sensor having a sensing element, an analog circuit path coupled to the sensing element for generating an output voltage in response to a magnetic field applied to the sensing element, and a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor.