Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.

Abstract: Methods and apparatus for a magnetic field sensor including a die, a coil proximate the die to generate a magnetic field, and a magnetic field sensing element having to detect changes in the magnetic field generated by the coil in response to a ferromagnetic target.

Abstract: A variety of magnetic field sensor arrangements provide so-called “tooth detectors” using a simple low-cost magnet.

Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead.

Abstract: A variety of magnetic field sensor arrangements provide so-called “tooth detectors” using a simple low-cost magnet.

Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead.

Abstract: An integrated circuit includes at least one first magnetic field sensing element including at least one first magnetoresistance element configured to provide an output signal of the integrated circuit in response to a detected magnetic field. The integrated circuit also includes at least one second magnetic field sensing element including at least one second magnetoresistance element configured to have a characteristic indicative of a stress condition. A method for detecting a stress condition in an integrated circuit is also provided.

Abstract: A magnetic field sensor includes a plurality of magnetoresistance elements, each having at least one characteristic selected to provide a respective, different response to an applied magnetic field, wherein each of the plurality of magnetoresistance elements is coupled in parallel. Illustrative characteristics selected to provide the respective responses include dimensions and/or construction parameters such as materials, layer thickness and order, and spatial relationship of the magnetoresistance element to the applied magnetic field. A method includes providing each of a plurality of magnetoresistance elements with at least one characteristic selected to provide a respective, different response to an applied magnetic field, wherein each of the plurality of magnetoresistance elements is coupled in parallel.

Abstract: A system includes a magnetic target and a magnetic field sensor. The magnetic field sensor comprises an output node; a circuit to detect a magnetic field produced by the magnetic target; and a processor. The processor may be configured to transmit a signal onto the output node representing the detected magnetic field; detect whether the transmitted signal is interrupted by an external source; and, if the signal is interrupted, initiate a self-test of the apparatus. Corresponding methods and apparatuses are also disclosed.

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. The sensor further includes at least one wire bond coupled between the die and a first surface of the lead frame. The die is attached to a second, opposing surface of the lead frame in a lead on chip configuration. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract: A magnetic field sensor with enhanced immunity to external magnetic interference is presented. Included is a magnetic field signal generator and a demodulator. The magnetic field signal generator produces a magnetic field signal having a modulated signal portion in a first frequency band based on a sensed modulated AC bias magnetic field. The modulated AC bias magnetic field is produced by movement of ferromagnetic target relative to a bias coil when an AC signal is applied to the bias coil. When the magnetic field signal also includes an unwanted signal portion in a second frequency band based on external magnetic interference, demodulation performed by the demodulator results in the modulated signal portion being shifted from the first frequency band to a third frequency band and the unwanted signal portion being shifted to the first frequency band. The bias coil may be provided as part of the magnetic field sensor.

Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

Abstract: Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.

Abstract: A joystick assembly for use with a device including a joystick surface and a first magnet having north and south magnetic poles includes a second magnet having north and south magnetic poles and a movable elongated shaft having first and second opposing ends arranged along a major axis of the shaft. The first end of the shaft is coupled to the second magnet such that movement of the shaft results in movement of the second magnet relative to the first magnet such that a line between centers of the north and south magnetic poles of the second magnet is movable relative to a line between the north and south magnetic poles of the first magnet. An attraction of the second magnet to the first magnet results in a restoring force upon the shaft, and the shaft and the second magnet are removable from the joystick surface.

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract: A circuit to detect a movement of an object provides a threshold selection module or a peak identifier module that uses one or more threshold signals identified prior to a present cycle of magnetic field signal in order to establish a threshold signal used for a present cycle of the magnetic field signal. A method associated with the circuit is also described. The circuit and method can be tailored to store values associated with a least common multiple of a set of possible quantities of detectable features on target objects.

Abstract: In one aspect, a Hall Effect sensing element includes a Hall plate having a thickness less than about 100 nanometers an adhesion layer directly in contact with the Hall plate and having a thickness in a range about 0.1 nanometers to 5 nanometers. In another aspect, a sensor includes a Hall Effect sensing element. The Hall Effect sensing element includes a substrate that includes one of a semiconductor material or an insulator material, an insulation layer in direct contact with the substrate, an adhesion layer having a thickness in a range of about 0.1 nanometers to 5 nanometers and in direct contact with the insulation layer and a Hall plate in direct contact with the adhesion layer and having a thickness less than about 100 nanometers.

Abstract: A fluid manifold includes a block with a first aperture, a second aperture, and a curved fluid passage fabricated, via an additive manufacturing process, through the block between the first aperture and the second aperture. The curved fluid passage surrounds a cavity and includes a non-zero radius of curvature. A fluid manifold includes a volume of material and a fluid passage fabricated, via an additive manufacturing process, through the volume of material. The fluid passage includes a first passive element having a first diameter, a second passive element having a second diameter, and an orifice having a third diameter. The orifice is located between the first and second passive elements. The first and second diameters are smaller than the third diameter. A fluid manifold having a single block of material with a curved passage fabricated through the single block of material is prepared by an additive manufacturing process.

Abstract: In an embodiment, a circuit is configured to produce a magnetic field signal having a frequency spectrum. The circuit may also produce a temperature signal. A modulation circuit may modulate the temperature signal with a frequency outside the frequency spectrum of the magnetic field signal. The modulated signal and the magnetic field signal may be combined to produce a combined signal. A separation circuit may be configured to separate component signals from the combined signal. The separation circuit may include a first filter, which, when applied to the combined signal, produces a filtered signal; a modulation circuit configured to shift the data representing the temperature signal to a baseband frequency; and a second filter configured to separate the data representing the temperature signal from the combined signal.