Abstract: In particular embodiments, a computing device provides for presentation a user interface including a first interactive element. The computing device receives first user input selecting the first interactive element and, in response to the first user input, provides for presentation a second interactive element. The second interactive element may be associated with functionality to dismiss the first interactive element. The computing device receives second user input comprising moving the first interactive element toward the second interactive element. In response to the first interactive element being within a particular distance of the second interactive element and receiving third user input, the computing device removes the first interactive element and the second interactive element from presentation in the user interface.

Abstract: In particular embodiments, a computing device provides for presentation a user interface including an image. The computing device receives user input to proceed to a second view of the image and, in response to the user input, provides for presentation the second view of the image.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

Abstract: A closure that is constructed and arranged to be sealed to an opening in a flexible film pouch that has an interior. The closure includes a body that has a top, bottom, sides, front and back, wherein the body has a body through-channel with a bottom opening and a top opening, and wherein the body is elongated, such that its extent from front to back is greater than its extent from side to side. The closure has an upper member coupled to the top of the body, wherein the upper member has an upper member through-channel with a bottom opening and a top opening, where the upper member through-channel is contiguous with the body through-channel. The top of the body is bisected by a body longitudinal axis and has a latitudinal axis that bisects and is perpendicular to the longitudinal axis, where a center of the body is defined by the intersection of the longitudinal and latitudinal axes. The upper member top opening (i.e., the outlet opening of the closure) is asymmetric about the center of the body.

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract: In particular embodiments, a computing device provides for presentation a first user interface including a first interactive element. The computing device receives first user input selecting the first interactive element and, in response to the first user input, provides for presentation multiple second interactive elements, each of the second interactive elements being presented with an associated label. The computing device receives a second user input selecting one of the second interactive elements and, in response to the second user input, provides for presentation a second user interface.

Abstract: According to one embodiment, a system includes a memory, a processor, and an interface. For a first region, the processor calculates a risk associated with a political situation of the first region, a risk associated with a legal situation of the first region, a risk associated with an economic situation of the first region, a risk associated with a social situation of the first region, a risk associated with a technological situation of the first region, and a risk associated with an environmental situation of the first region. For a first entity, the processor calculates a risk associated with an exposure level of the first entity in the first region. Based at least on these calculated risks, the processor calculates a ranking for the first region, the ranking representing an amount of risk to the first entity in the first region. The interface communicates the ranking for display.

Abstract: Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.

Abstract: According to one embodiment, a system includes a memory, a processor, and an interface. For a first region, the processor calculates a risk associated with a political situation of the first region, a risk associated with a legal situation of the first region, a risk associated with an economic situation of the first region, a risk associated with a social situation of the first region, a risk associated with a technological situation of the first region, and a risk associated with an environmental situation of the first region. For a first entity, the processor calculates a risk associated with an exposure level of the first entity in the first region. Based at least on these calculated risks, the processor calculates a ranking for the first region, the ranking representing an amount of risk to the first entity in the first region. The interface communicates the ranking for display.

Abstract: Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.

Abstract: An improved method is provided for positioning a directional antenna coupled to a radio towards a satellite. The method includes: receiving an input to the radio from an operator of the radio, where the input indicates a desired time period for positioning the antenna; transmitting, during the desired time period, a plurality of burst data transmissions from the radio over a channel associated with the satellite; receiving a plurality of reply data transmissions from the satellite which correspond to the plurality of burst data transmissions sent by the radio; determining a metric indicative of signal quality for each of the reply data transmissions; and outputting from the radio an indicator for each metric. The operator of the radio can use the indicator output by the radio to better position the antenna towards the satellite.

Abstract: A system and method of identifying, assessing and prioritizing risks are provided. The system and method may include a risk identification module that may identify one or more risks to a business, organization, entity, group or department within the entity, etc. One or more risk variables associated with each identified risk may then be identified. In some examples, the risk variables may be the same or substantially similar for all identified risks. A risk score for each identified risk variable may be determined and an overall risk score for each identified risk may then be determined based on the determined variable risk scores. In some examples, the overall score may be normalized on a predetermined scale. Once an overall score for each risk is determined, the risks having the highest priority may be identified.

Abstract: A computer system assesses the overall risk for different technologies for an organization. Technologies may be evaluated by obtaining severity levels and environmental risk scores for the vulnerabilities associated with the technologies. Each severity level measures a possible risk level of a corresponding vulnerability, while each environmental risk score is based on the organization's environment. Technology risk scores are then determined from the severity levels and the environmental risk scores. Each technology may then be categorized from a statistical distribution of the technology risk scores. An indexed risk score for each technology may also be determined based on time trending variables. Inputs may be a number of vulnerabilities, blended advisory/severity scores, and a standard deviation of the blended advisory/severity scores, and the results then provide behavior forecasting of the technologies.

Abstract: The present invention generally provides a cluster tool for processing a substrate. In one embodiment, the cluster tool comprises at least one processing rack, which comprises a first plurality of substrate processing chambers that are positioned adjacent to each other and aligned in a first direction, a second plurality of substrate processing chambers that are positioned adjacent to each other and adjacent to at least one of the first plurality of substrate processing chambers, the second plurality of substrate processing chambers being positioned in a second direction relative to the first direction, a first shuttle robot movable in the first direction for moving substrates between each of the first plurality of substrate processing chambers, and a second shuttle robot movable in the second direction for moving substrates between each of the second plurality of substrate processing chambers.

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

Abstract: An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and second processing racks, each having two or more vertically stacked substrate processing chambers, a first robot assembly able to access the first processing rack from a first side, a second robot assembly able to access the first processing rack from a second side and the second processing rack from a first side, a third robot assembly able to access the second processing rack from a second side, and a fourth robot assembly able to access the first and second processing racks and to load substrates in a cassette.

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.