Abstract: The invention relates to an image for detection of an aerial pattern comprising spatial differences in radiation intensity in a cross section of a beam of radiation in a lithographic apparatus for exposing a substrate. The image sensor comprises a lens (5) arranged to form a detection image of the aerial pattern and an image detector (6) arranged to measure radiation intensities in a plurality, of positions in the detection image.

Abstract: A lithographic apparatus is calibrated by reference to a primary reference substrate. Using an apparatus which need not be the same as the one being calibrated, there is obtained an apparatus-specific fingerprint of the primary reference substrate. Using the same set-up there is then obtained an apparatus-specific fingerprint of a secondary reference substrate. The apparatus-specific fingerprint of the primary reference substrate is subtracted from the apparatus-specific fingerprint of the secondary reference substrate to obtain and store an apparatus-independent fingerprint of the secondary reference substrate. The secondary reference substrate and stored apparatus-independent fingerprint are subsequently used together in place of the primary reference substrate as a reference for the calibration of the lithographic apparatus to be calibrated.

Abstract: A method of, and associated apparatus for, determining focus corrections for a lithographic projection apparatus. The method comprises exposing a plurality of global correction fields on a test substrate, each comprising a plurality of global correction marks, and each being exposed with a tilted focus offset across it; measuring a focus dependent characteristic for each of the plurality of global correction marks to determine interfield focus variation information; and calculating interfield focus corrections from the interfield focus variation information.

Abstract: The invention relates to an image sensor for detection of an aerial image formed by a beam of radiation in a lithographic projection apparatus for exposing a pattern onto a substrate held in a substrate plane by a substrate holder. The image sensor has an image detector and a lens. The lens is arranged to project at least part of the aerial image onto the image detector. The image sensor is positioned such within the substrate holder that the lens is positioned proximate the substrate plane.

Abstract: A lithographic apparatus can include the following devices: a patterning system, a projection system, and a radiation beam inspection device. The patterning system can be configured to provide a patterned radiation beam. The projection system can be configured to project the patterned radiation beam onto a target portion of a substrate. Further, the radiation beam inspection device can be configured to inspect at least a part of the patterned radiation beam. In a substrate exposure position, the projection system is configured to expose a pattern of radiation on the substrate using the patterned radiation beam and the radiation beam device is configured to move the reflecting device away from a light path of the patterned radiation beam. In a radiation beam inspection position, the radiation beam inspection device is configured to move the reflecting device into the light path of the patterned radiation beam.

Abstract: A method of, and associated apparatus for, determining focus corrections for a lithographic projection apparatus. The method comprises exposing a plurality of global correction fields on a test substrate, each comprising a plurality of global correction marks, and each being exposed with a tilted focus offset across it; measuring a focus dependent characteristic for each of the plurality of global correction marks to determine interfield focus variation information; and calculating interfield focus corrections from the interfield focus variation information.

Abstract: A lithographic method is provided that includes using an illumination system to provide a beam of radiation having an illumination mode, using a patterning device to impart the radiation beam with a pattern in its cross-section, and projecting the patterned radiation beam onto a substrate. The illumination mode is adjusted after the radiation beam has been projected onto the substrate. The adjustment is arranged to reduce the effect of optical aberrations due to lens heating on the projected pattern during projection of the pattern onto a subsequent substrate.

Abstract: A lithographic apparatus includes an illumination system to condition a radiation beam; a patterning device support to support a patterning device, the patterning device capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, and a projection system to project the patterned radiation beam in a scanning exposure along a scanning direction onto a target portion of the substrate. The illumination system is configured to form in a plane of the patterning device a slit shaped image. The slit shaped image has a curved shape with a slit curvature in the scanning direction, with a length in the scanning direction and a width perpendicular to the scanning direction. The slit shaped image is configured to create a curved pattern image portion of the patterned radiation beam in an image plane of the projection system.

Abstract: A lithographic apparatus is calibrated by reference to a primary reference substrate. Using an apparatus which need not be the same as the one being calibrated, there is obtained an apparatus-specific fingerprint of the primary reference substrate. Using the same set-up there is then obtained an apparatus-specific fingerprint of a secondary reference substrate. The apparatus-specific fingerprint of the primary reference substrate is subtracted from the apparatus-specific fingerprint of the secondary reference substrate to obtain and store an apparatus-independent fingerprint of the secondary reference substrate. The secondary reference substrate and stored apparatus-independent fingerprint are subsequently used together in place of the primary reference substrate as a reference for the calibration of the lithographic apparatus to be calibrated.

Abstract: The invention relates to an image for detection of an aerial pattern comprising spatial differences in radiation intensity in a cross section of a beam of radiation in a lithographic apparatus for exposing a substrate. The image sensor comprises a lens (5) arranged to form a detection image of the aerial pattern and an image detector (6) arranged to measure radiation intensities in a plurality, of positions in the detection image.

Abstract: A rework station and a metrology device(s) are incorporated into a lithographic processing cell so that a faulty substrate can be reworked directly and reprocessed without, for example, an overhead involved in changing masks, etc.

Abstract: The invention provides a height detecting apparatus for a lithographic apparatus. The height mapping apparatus includes a height mapping unit for providing at least one height map of a top surface of an object to be placed in a radiation beam of the lithographic apparatus, the object to be clamped by a clamping force applied thereto on a support constructed to support the object. The height mapping apparatus also includes a control unit for controlling the mapping unit to provide the at least one height map of the object relative to at least two different clamping pressure levels.

Abstract: A lithographic projection apparatus is disclosed that includes a predictive system configured to predict changes in projection system aberrations with time with respect to measured aberration values, a modelling system configured to determine an application-specific effect of said predicted projection system aberration changes on at least one parameter of an image for a selected pattern, a control system configured to generate a control signal specific to the selected pattern according to said predicted projection system aberration changes and their application-specific effect on the at least one parameter of the image, and an image adjusting system, responsive to the control signal, to compensate for the application-specific effect of said predicted projection system aberration changes on the image.

Abstract: A lithographic apparatus can include the following devices: a patterning system, a projection system, and a radiation beam inspection device. The patterning system can be configured to provide a patterned radiation beam. The projection system can be configured to project the patterned radiation beam onto a target portion of a substrate. Further, the radiation beam inspection device can be configured to inspect at least a part of the patterned radiation beam. In a substrate exposure position, the projection system is configured to expose a pattern of radiation on the substrate using the patterned radiation beam and the radiation beam device is configured to move the reflecting device away from a light path of the patterned radiation beam. In a radiation beam inspection position, the radiation beam inspection device is configured to move the reflecting device into the light path of the patterned radiation beam.

Abstract: A method of reducing a wave front aberration is provided for a lithographic process whereby the reducing is based on the selected pattern to be printed and the selected illumination mode used for exposure. Wave front aberrations of a projection system of a lithographic apparatus are measured and reduced by calculating adjustments of optical elements of the projection system and applying the calculated adjustments to the projection system. The calculation of adjustments is based on information on a spatial distribution of radiant intensity in a pupil of the projection system as present during exposing the radiation sensitive layer, and is limited to aberrations in projection lens pupil areas of relative high radiant flux.

Abstract: A lithographic apparatus includes an illumination system to condition a radiation beam; a patterning device support to support a patterning device, the patterning device capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, and a projection system to project the patterned radiation beam in a scanning exposure along a scanning direction onto a target portion of the substrate. The illumination system is configured to form in a plane of the patterning device a slit shaped image. The slit shaped image has a curved shape with a slit curvature in the scanning direction, with a length in the scanning direction and a width perpendicular to the scanning direction. The slit shaped image is configured to create a curved pattern image portion of the patterned radiation beam in an image plane of the projection system.

Abstract: A lithographic apparatus wherein a dipole illumination mode used for printing a line pattern, is arranged to provide quadrupole illumination. Radiation emanating from the two additional poles and passing the mask pattern without being affected by diffraction is prevented from reaching the wafer by a radiation blocking aperture disposed in the projection system. Astigmatism aberration due to lens heating associated with the dipole illumination mode is reduced by lens heating associated with the additional poles of the quadrupole illumination mode.

Abstract: A lithographic method is provided that includes using an illumination system to provide a beam of radiation having an illumination mode, using a patterning device to impart the radiation beam with a pattern in its cross-section, and projecting the patterned radiation beam onto a substrate. The illumination mode is adjusted after the radiation beam has been projected onto the substrate. The adjustment is arranged to reduce the effect of optical aberrations due to lens heating on the projected pattern during projection of the pattern onto a subsequent substrate.

Abstract: A lithographic method is provided and comprises using an illumination system to provide a beam of radiation having an illumination mode, using a patterning device to impart the radiation beam with a pattern in its cross-section, and projecting the patterned radiation beam onto a plurality of substrates. The illumination mode is adjusted after the radiation beam has been projected onto one or more substrates. The adjustment is arranged to reduce the effect of aberrations due to lens heating on the projected pattern during projection of the pattern onto one or more subsequent substrates.

Abstract: The invention relates to an image sensor for detection of an aerial image formed by a beam of radiation in a lithographic projection apparatus for exposing a pattern onto a substrate held in a substrate plane by a substrate holder. The image sensor has an image detector and a lens. The lens is arranged to project at least part of the aerial image onto the image detector. The image sensor is positioned such within the substrate holder that the lens is positioned proximate the substrate plane.