Abstract: A method of apparatus for immersion cooling electronic equipment including immersing the electronic equipment in a pressure-sealed tank containing a heat transfer fluid and including a vapor space fluidicly coupled to a condenser; operating the electronic equipment to generate heat and evaporate some of the heat transfer fluid, causing heat transfer fluid vapor to enter the condenser; condensing the heat transfer fluid vapor in the condenser to produce a condensate; returning the condensate to the tank; and increasing power consumption to increase heat generated by the electronic equipment and develop an increased pressure of the heat transfer fluid vapor to bring the apparatus into an equilibrium condition.

Abstract: MEMS shutters are applied in displays and imaging devices. In a display, sensors may detect light from a light source that is back-reflected by a MEMS shutter and/or ambient light that enters through the MEMS shutter. The sensors may be used to monitor performance of the light source and/or ambient lighting conditions. In an imaging device, MEMS shutters may be applied to selectively block light to prevent overexposed areas within an image.

Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Abstract: A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. A method of manufacturing the carrier further described. The method includes forming a composite frame having a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom are each formed from a polymer material. The method further includes forming an opening sized for receiving a substrate and providing a plurality of support pins extending into the opening for supporting the substrate within the opening. The opening is formed slightly larger than the substrate such that a gap exists between the substrate and the opening.

Abstract: A support for a substrate processing chamber comprises a chuck having a substrate receiving surface, and a base comprising an upper wall comprising a recessed trench having (i) an attachment face at a first depth, and (ii) a fluid channel at a second depth. A lower wall is seated in the recessed trench and attached to the attachment face of the upper wall, to close the fluid channel. A fluid inlet is provided to supply a heat transfer fluid to the fluid channel and a fluid outlet provided to discharge the heat transfer fluid from the fluid channel.

Abstract: A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. A method of manufacturing the carrier further described. The method includes forming a composite frame having a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom are each formed from a polymer material. The method further includes forming an opening sized for receiving a substrate and providing a plurality of support pins extending into the opening for supporting the substrate within the opening. The opening is formed slightly larger than the substrate such that a gap exists between the substrate and the opening.

Abstract: A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Abstract: A support for a substrate processing chamber comprises a chuck having a substrate receiving surface, and a base comprising an upper wall comprising a recessed trench having (i) an attachment face at a first depth, and (ii) a fluid channel at a second depth. A lower wall is seated in the recessed trench and attached to the attachment face of the upper wall, to close the fluid channel. A fluid inlet is provided to supply a heat transfer fluid to the fluid channel and a fluid outlet provided to discharge the heat transfer fluid from the fluid channel.

Abstract: An optical system for viewing an object has a plurality of lenses and a main optical axis coincident with the centers of the lenses. The optical system further comprises a low magnification optical subsystem that is operative to view the object at a first magnification and a high magnification optical subsystem that is operative to view the object at a second magnification that is higher than the first magnification. The high magnification optical subsystem has a high magnification optical axis along which light rays that are received from the main optical axis are transmitted. A movable element is locatable on the high magnification optical axis and is movable in directions transverse to the axis for receiving and transmitting light rays.

Abstract: A support for a substrate processing chamber comprises a fluid circulating reservoir comprising a channel having serpentine convolutions. A fluid inlet supplies a heat transfer fluid to the fluid circulating reservoir and a fluid outlet discharges the heat transfer fluid. In one version, the channel is doubled over to turn back upon itself.

Abstract: An optical system for viewing an object has a plurality of lenses and a main optical axis coincident with the centers of the lenses. The optical system further comprises a low magnification optical subsystem that is operative to view the object at a first magnification and a high magnification optical subsystem that is operative to view the object at a second magnification that is higher than the first magnification. The high magnification optical subsystem has a high magnification optical axis along which light rays that are received from the main optical axis are transmitted. A movable element is locatable on the high magnification optical axis and is movable in directions transverse to the axis for receiving and transmitting light rays.

Abstract: A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.

Abstract: A support for a substrate processing chamber has upper and lower walls that are joined by a peripheral sidewall to define a reservoir. A fluid inlet supplies a heat transfer fluid to the reservoir. In one version, a plurality of protrusions extends into the reservoir to perturb the flow of the heat transfer fluid through the reservoir. In another version, the reservoir is an elongated channel having one or more of (i) serpentine convolutions, (ii) integral fins extending into the channel, (iii) a roughened internal surface, or (iv) a changing cross-section. A fluid outlet discharges the heat transfer fluid from the reservoir.

Abstract: Direct slicing of CAD models to generate process planning instructions for solid freeform fabrication may overcome inherent disadvantages of using STL format in terms of the process accuracy, ease of file management, and incorporation of multiple materials. This paper will present the results of our development of a direct slicing algorithm for layered freeform fabrication. The direct slicing algorithm was based on a neutral, international standard (ISO 10303) STEP-formatted NURBS geometric representation and is intended to be independent of any commercial CAD software. The following aspects of the development effort will be presented: 1) Determination of optimal build direction based upon STEP-based NURBS models; 2) Adaptive subdivision of NURBS data for geometric refinement; and 3) Ray-casting slice generation into sets of raster patterns.

Abstract: A device for discharging at least one substance therefrom, comprising a container having a body member with substantially a vertical wall and a closure member, the body member is provided with an upper opening via which the substance is received and a lower opening closable by the closure member, wherein the body member and said closure member together define a cavity for containing the substance and wherein the body member and the closure member is movable relative to each other for discharging the substance.

Abstract: We formulate the network-wide traffic measurement/analysis problem as a series of set-cardinality-determination (SCD) problems. By leveraging recent advances in probabilistic distinct sample counting techniques, the set-cardinalities, and thus, the network-wide traffic measurements of interest can be computed in a distributed manner via the exchange of extremely light-weight traffic digests (TD's) amongst the network nodes, i.e. the routers. A TD for N packets only requires O(loglog N) bits of memory storage. The computation of such O(loglog N)-sized TD is also amenable for efficient hardware implementation at wire-speed of 10 Gbps and beyond. Given the small size of the TD's, it is possible to distribute nodal TD's to all routers within a domain by piggybacking them as opaque data objects inside existing control messages, such as OSPF link-state packets (LSPs) or I-BGP control messages.

Abstract: An electrical accessory has releasably engageable first and second body members. The first body member includes a receiving portion adapted to be releasably engageable with a plug member of an electric cord of an electric appliance. The second body member has a first plug member that is electrically connectable with an electricity mains supply, a second plug member adapted to be releasably engageable with the first body member and an electric cord electrically connecting the first and second plug members. A securing device secures the first body member to a surface.

Abstract: In a network including a centralized controller and a plurality of routers forming a security perimeter, a method for selectively discarding packets during a distributed denial-of-service (DDoS) attack over the network. The method includes aggregating victim destination prefix lists and attack statistics associated with incoming packets received from the plurality of routers to confirm a DDoS attack victim, and aggregating packet attribute distribution frequencies for incoming victim related packets received from the plurality of security perimeter routers. Common scorebooks are generated from the aggregated packet attribute distribution frequencies and nominal traffic profiles, and local cumulative distribution function (CDF) of the local scores derived from the plurality of security perimeter routers are aggregated.