Abstract: An ultrasound transducer (10) comprises an application specific integrated circuit (ASIC) (14), an array of acoustic elements (20), and a pitch independent interposer (12). The ASIC (14) includes a plurality of contact pads (16) on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements (22) of the array (20) are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer (12) features a plurality of conductive elements (26) separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.

Abstract: An ultrasound transducer (40,70,100) comprises a combined individual die integrated circuit (42,72,102) and an array of acoustic elements (44,74,104) coupled to the combined individual die integrated circuit via an array of flip-chip bumps (46,76,106). The combined individual die integrated circuit includes a first integrated circuit die (48,78,108) aligned with at least one additional integrated circuit die (50,80,(110,112)). In addition, the first integrated circuit die, the at least one additional die integrated circuits, and the array of acoustic elements together form a large aperture transducer array.

Abstract: An acoustic imaging apparatus (100, 200, 300, 400) includes an acoustic probe (110) adapted to receive an acoustic signal, an acoustic signal processor (120) adapted to receive and process the acoustic signal from the acoustic probe, a display (130) for displaying images in response to the processed acoustic signal, and a non-manual control device (160, 160a, 160b, 160c). The acoustic imaging apparatus (100, 200, 300, 400) is adapted to control at least one of the acoustic probe (110), the acoustic signal processor (120) and the display 9130) in response to at least one signal from the non-manual control device (160, 160a, 160b, 160c). The non-manual control device (160, 160a, 160b, 160c) is either operated by a human foot, or mounted on a human head and operated by movement of the human head.

Abstract: The present invention relates to an apparatus and a method for obtaining a 3D image in radial applications, typically endorectal imaging.

Abstract: An ultrasound transducer includes one or more microbeamformer integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements.

Abstract: An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.

Abstract: An ultrasound transducer probe (40) includes a support substrate (54), an integrated circuit (42) and an array of piezoelectric elements (50). The support substrate (54) has a non-linear surface (55). The integrated circuit (42) physically couples to the support substrate (54) overlying the non-linear surface (55), wherein the integrated circuit (42) substantially conforms to a shape of the non-linear surface (55). An array of piezoelectric elements (50) couples to the integrated circuit (42).

Abstract: A method and system for using two-dimensional transducer arrays for improving the field of view during an ultrasonic examination are disclosed. The ultrasonic imaging system includes a two-dimensional transducer array with a plurality of acoustic elements, a beam controller, a signal processor, and a display. The beam controller controls a generated acoustic beam capable of being advanced longitudinally or laterally along the two-dimensional transducer array. Additionally, the generated acoustic beam is capable of being phase-shifted by the beam controller. Combining the phase shifting of and advancement of the acoustic beam increases the field of view of the two-dimensional array.

Abstract: A flip-chip electrical coupling (100, 200, 300) is formed between first and second electrical components (110, 180; 410, 480). The coupling (100, 200, 300) includes a bump (240, 340) and a contact pad (315). The first electrical component (110, 210, 310, 410) includes the contact pad (315) electrically coupled to the first electrical component (110, 210, 310, 410) and a passivation layer (130, 230, 330) overlying the first electrical component (110, 210, 310, 410) and the contact pad (315). The passivation layer (130, 230, 330) is arranged having an opening (120, 220, 320) positioned over the contact pad (315). A bump (240, 340) is positioned overlying the opening (120, 220, 320) and substantially overlying the passivation layer (130, 230, 330). The bump (240, 340) is formed to be in electrical contact with the contact pad (315). The bump (240, 340) is arranged to couple the first and second electrical components (110, 180; 410, 480) during the flip-chip coupling process.

Abstract: A flip-chip electrical coupling between first and second electrical components (250, 260). The coupling includes a bump (210) and a pad (220). The bump (210) is electrically coupled to the first electrical component (250). The pad (220) is electrically coupled to the second electrical component (260). The pad (220) is electrically coupled to and dimensioned smaller than a corresponding coupling surface (214) of the bump (210). The pad (220) and bump (210) may be electrically coupled together using an ultrasonic stub bump bonding process, conductive epoxy, etc.

Abstract: An ultrasound transducer (40,70,100) comprises a combined individual die integrated circuit (42,72,102) and an array of acoustic elements (44,74,104) coupled to the combined individual die integrated circuit via an array of flip-chip bumps (46,76,106). The combined individual die integrated circuit includes a first integrated circuit die (48,78,108) aligned with at least one additional integrated circuit die (50,80,(110,112)). In addition, the first integrated circuit die, the at least one additional die integrated circuits, and the array of acoustic elements together form a large aperture transducer array. large aperture transducer array.

Abstract: An ultrasound transducer includes one or more microbeam-former integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements.

Abstract: An ultrasound transducer probe (40) includes a support substrate (54), an integrated circuit (42) and an array of piezoelectric elements (50). The support substrate (54) has a non-linear surface (55). The integrated circuit (42) physically couples to the support substrate (54) overlying the non-linear surface (55), wherein the integrated circuit (42) substantially conforms to a shape of the non-linear surface (55). An array of piezoelectric elements (50) couples to the integrated circuit (42).

Abstract: An ultrasound transducer (100) comprises an integrated circuit (52) and an array of acoustic elements (92,94,96) coupled to the integrated circuit via flip chip bumps (76,78). The flip chip bumps comprise high aspect ratio bumps having an aspect ratio greater than 1:1. The aspect ratio comprises a ratio of a bump height (82) to a bump width (84).

Abstract: According to an embodiment of the present disclosure, an ultrasound transducer probe (80) includes an attenuation backing substrate (94), an integrated circuit (88), and an array of piezoelectric elements (84). The integrated circuit (88) couples to the attenuation backing substrate (94), the integrated circuit (88) being translucent to acoustic waves. The array of piezoelectric elements (84) couples to the integrated circuit (88); the array of piezoelectric elements (84) having an acoustic matching layer disposed on a first surface of the array thereof.

Abstract: A method and system for using two-dimensional transducer arrays for improving the field of view during an ultrasonic examination are disclosed. The ultrasonic imaging system includes a two-dimensional transducer array with a plurality of acoustic elements, a beam controller, a signal processor, and a display. The beam controller controls a generated acoustic beam capable of being advanced longitudinally or laterally along the two-dimensional transducer array. Additionally, the generated acoustic beam is capable of being phase-shifted by the beam controller. Combining the phase shifting of and advancement of the acoustic beam increases the field of view of the two-dimensional array.

Abstract: Ultrasonic transducers having a reduced size in comparison with prior art ultrasonic transducers and including a thermally-conductive body, a flexible circuit bent at least partially around the body, an acoustic assembly arranged on the flexible circuit and electronic components for controlling the acoustic assembly to transmit and receive ultrasonic waves. Signal transmission lines, such as coax wires, are coupled to the flexible circuit such that the electronic components, the acoustic assembly and the signal transmission lines are connected in a circuit defined in part by the flexible circuit. By bending the flexible circuit with the acoustic assembly, and optionally the electronic components, arranged thereon about the body, they are positioned in a vertical configuration which allows for a compact transducer which has a small, even miniature size in comparison to prior art ultrasonic transducers.

Abstract: Acoustic imaging systems are provided. A preferred system includes a transducer lens configured to mate with a transducer body. The transducer lens is configured to propagate acoustic energy. Preferably, the transducer lens is formed, at least partially, of an acoustic-matching material, which exhibits acoustic properties corresponding to acoustic properties of a body to be imaged. Methods also are provided.

Abstract: An acoustic backing element includes a glass fiber epoxy composite planar substrate to the outer major surfaces of which are applied electrically conductive material. The electrically conductive material may be a conductive layer that is etched to expose electrical contact material in the form of conductive traces. Each conductive trace provides electrical connection between a transducer element and electrical control circuitry typically located on an electrical circuit board. The acoustic backing element provides precisely located electrical contacts for connecting the transducer elements to their control circuitry, while simultaneously providing superior acoustic attenuation. In addition, the thermal coefficient of expansion (TCE) of the glass fiber epoxy composite material comprising the planar substrate can be closely matched to the TCE of the electrical contact material.

Abstract: Acoustic imaging systems are provided. A preferred system includes a transducer lens configured to mate with a transducer body. The transducer lens is configured to propagate acoustic energy. Preferably, the transducer lens is formed, at least partially, of an acoustic-matching material, which exhibits acoustic properties corresponding to acoustic properties of a body to be imaged. Methods also are provided.