Patents by Inventor Wojtek Sudol

Wojtek Sudol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6449821
    Abstract: A method for constructing a connection assembly for use in a multiple aperture ultrasonic tranducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and the connection assembly for interconnecting the segments of each elements and for connecting the segments to transmit/receive circuitsto form the aperatures of the array. An isolating layer is superimposed on the segments of the array and a plurality of via openings are formed through the isolating layer. At least one via opening being assocated with each segment of the array and each via opening exposing an area of an assocated segment. A conductive layer is superimposed on the isolating layer, the conductive layer having conduxtive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: September 17, 2002
    Assignee: Koninklijke Philips Electronics, N.V.
    Inventors: Wojtek Sudol, Francis E. Gurrie
  • Patent number: 6440076
    Abstract: An ultrasound transducer connector for connecting a transducer to a terminal on an ultrasound unit, the ultrasound transducer connector including a shell; a LIF connector supported by the shell; and a cable electrically connected to the LIF connector that electrically connects the LIF connector to the transducer.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: August 27, 2002
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Wojtek Sudol, Francis E. Gurrie, Walter Patrick Kelly, Jr., David P Dolan
  • Publication number: 20020060508
    Abstract: A connection assembly for use in a multiple aperture ultrasonic transducer including an array of elements for transmitting and receiving wherein each element includes a plurality of segments and the connection assembly interconnects the segments of the elements and the segments to transmit/receive circuits to form the apertures of the array. The connection assembly includes an isolating layer superimposed on the segments with at least one via opening located within the area of each segment and a conductive layer superimposed on the isolating layer with conductive paths interconnecting the segments and the segments to the transmit/receive circuits to form the apertures of the array. The conductive layer forms a continuous layer covering the isolating layer, the interior surfaces of the via openings and the areas of the segments exposed through the via openings and is scribed to divide the conductive layer into the conductive paths.
    Type: Application
    Filed: August 12, 1999
    Publication date: May 23, 2002
    Inventors: WOJTEK SUDOL, FRANCIS E. GURRIE
  • Patent number: 6162093
    Abstract: An ultrasound transducer connector assembly including a low insertion force connector, a leaf spring latch and several alternative housing configurations.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: December 19, 2000
    Assignee: Agilent Technologies, Inc.
    Inventors: Wojtek Sudol, Francis E. Gurrie, Walter Patrick Kelly, Jr.
  • Patent number: 5990598
    Abstract: A connection assembly for use in a multiple aperture ultrasonic transducer including an array of elements for transmitting and receiving wherein each element includes a plurality of segments and the connection assembly interconnects the segments of the elements and the segments to transmit/receive circuits to form the apertures of the array. The connection assembly includes an isolating layer superimposed on the segments with at least one via opening located within the area of each segment and a conductive layer superimposed on the isolating layer with conductive paths interconnecting the segments and the segments to the transmit/receive circuits to form the apertures of the array. The conductive layer forms a continuous layer covering the isolating layer, the interior surfaces of the via openings and the areas of the segments exposed through the via openings and is scribed to divide the conductive layer into the conductive paths.
    Type: Grant
    Filed: September 23, 1997
    Date of Patent: November 23, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Wojtek Sudol, Francis E. Gurrie
  • Patent number: 5629906
    Abstract: An acoustic transducer includes a support structure which holds an acoustic pulse generator having both a front application face and a rear face. An acoustic absorber is attached to the rear face of the pulse generator. An acoustic isolator is positioned between the acoustic absorber and a support structure/heat sink. A preferred embodiment of the acoustic isolator includes at least a first material layer exhibiting a first acoustic impedance value, and a second material layer exhibiting a second acoustic impedance value. The second acoustic impedance value is substantially different from the first acoustic impedance value. A boundary between the first material layer and the second material layer causes multiple acoustic reflections of an acoustic pulse emanating from the rear face of the pulse generator. The first material layer and second material layer both exhibit substantial heat transfer capabilities.
    Type: Grant
    Filed: February 15, 1995
    Date of Patent: May 13, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Wojtek Sudol, Francis E. Gurrie, Larry A. Ladd
  • Patent number: 5622175
    Abstract: A miniature rotatable sensor include an acoustic face positioned over a layer of attenuating material. Between the acoustic face and the attentuating material is a flexible circuit that contacts the acoustic face and has circuit edge that extend beyond the attenuating material to create an inner portion. The inner portion further includes a radial slot extending throught the perimeter of the attenuating material. The circuit edges are folded into the radial slot such that the flexible circuit exits tangential to the diameter of the sensor.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: April 22, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Wojtek Sudol, Francis E. Gurrie
  • Patent number: 5552565
    Abstract: A low cost shielded transducer cable provides electrical connection between an ultrasound transducer and a display processor. A wound transducer cable is constructed in a first embodiment using two layers of stripline assemblies helically wound in opposite directions around a flexible core. The layers of stripline assemblies are covered with a single metal braid and then coated with insulation. In a second embodiment a stripline transducer cable is formed from a stack of parallel stripline assemblies that may be coextruded with an insulating jacket. In a third embodiment a ribbon transducer cable is formed from a stacked arrangement of parallel ribbon cables and conducting shields that may be extruded in an insulating material.
    Type: Grant
    Filed: March 31, 1995
    Date of Patent: September 3, 1996
    Assignee: Hewlett-Packard Company
    Inventors: Paul Cartier, Wojtek Sudol, Gregory G. Vogel
  • Patent number: 5320104
    Abstract: An endoscopic ultrasound probe for use in transesophageal echo cardiography comprises a rotatable ultrasound transducer array for obtaining two-dimensional cross-sectional images along a variety of scan planes. The array is formed of a plurality of transducer elements and rotates about an axis perpendicular to the plane of the transducer elements. The rotating array defines a circular region of rotation and has a surface area which substantially matches the area of the circular region of rotation within the probe. More specifically, the elements of the array have varying mechanical lengths such that the rotatable array may have a circular shape, a substantially circular shaped or an N-sided polygonal shape where N is an integer greater than four.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: June 14, 1994
    Assignee: Hewlett-Packard Company
    Inventors: James Fearnside, Wojtek Sudol
  • Patent number: 5296651
    Abstract: A flexible circuit suitable for high density applications and having a long flexural life is disclosed. A thin film metallic ground plane deposited on a dielectric substrate electrically shields the conductor traces in the flexible circuit and eliminates cross-talk between conductor traces without reducing the flexibility or the flexural life of the flexible circuit.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: March 22, 1994
    Assignee: Hewlett-Packard Company
    Inventors: Francis E. Gurrie, Wojtek Sudol