Abstract: In an embodiment a lid includes a top section and a side section arranged below the top section. A vertical height of the top section is calculated by ITS*HB, ITS being a first multiple integer and HB being a basic height, and a vertical height of the side section is calculated by Iss* HB, Iss being a second multiple integer and HB being the basic height HB.

Abstract: A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

Abstract: In an embodiment an electronic device includes a carrier board having an upper surface, an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a flexible mounting layer arranged between the upper surface of the carrier board and the mounting side of the electronic chip, the flexible mounting layer mounting the electronic chip to the carrier board, wherein the mounting side has at least one first region and a second region, and wherein the electronic chip has at least one chip contact element in the first region and at least one connection element arranged on the at least one first region and connecting the at least one chip contact element to the upper surface of the carrier board, wherein the flexible mounting layer separates the second region from the connection element.

Abstract: In an embodiment a lid includes a top section and a side section below the top section, wherein a vertical height of the top section is ITS*HB, ITS being a first multiple integer and HB being a basic height, and wherein a vertical height of the side section is ISS*HB, ISS being a second multiple integer and HB being the basic height HB.

Abstract: An electronic device with stud bumps is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the carrier board has at least one recess in the upper surface, and wherein at least one of the stud bumps reaches into the recess.

Abstract: In an embodiment a sensor arrangement includes a substrate, at least one spacer arranged directly onto a surface of the substrate, wherein the spacer comprises a soft material and a sensor chip attached to the substrate by an adhesive, wherein both the at least one spacer and the adhesive are arranged at least partly between the sensor chip and the substrate, and wherein the spacer is adapted and arranged to define a bond line thickness of the adhesive.

Abstract: The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Abstract: A carrier substrate and a method for making a carrier substrate are disclosed. In an embodiment a carrier substrate includes a substrate body having a multilayer structure, electrical connection pads on a top surface of the substrate body, an organic cushion layer on the top surface of the substrate body, electrically conductive elongated parts arranged on top of the cushion layer, wherein each conductive elongated part is contacted to a respective electric connection pad and a solder pad located at an end of each elongated part distant from the respective connection pad.

Abstract: A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

Abstract: A method for measuring a behavior of a MEMS device is disclosed. In an embodiment a method includes mounting the MEMS device to a testing apparatus that comprises a vibration source, wherein the MEMS device comprises a 6-axis or 9-axis inertial sensor, applying a vibration to the MEMS device by the vibration source and simultaneously moving the testing apparatus according to a predefined movement pattern, reading output data provided by the inertial sensor and comparing the output data to the predefined movement pattern and/or reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.

Abstract: In an embodiment an electronic device includes a carrier board having an upper surface, an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a flexible mounting layer arranged between the upper surface of the carrier board and the mounting side of the electronic chip, the flexible mounting layer mounting the electronic chip to the carrier board, wherein the mounting side has at least one first region and a second region, and wherein the electronic chip has at least one chip contact element in the first region and at least one connection element arranged on the at least one first region and connecting the at least one chip contact element to the upper surface of the carrier board, wherein the flexible mounting layer separates the second region from the connection element.

Abstract: A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

Abstract: An electronic device with stud bumps is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the carrier board has at least one recess in the upper surface, and wherein at least one of the stud bumps reaches into the recess.

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface of the carrier board, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, and wherein a laminated polymer hood at least partly covers the top side of the electronic chip and extends onto the upper surface of the carrier board.

Abstract: A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.

Abstract: A method for measuring a behavior of a MEMS device is disclosed. In an embodiment a method includes mounting the MEMS device to a testing apparatus that comprises a vibration source, wherein the MEMS device comprises a 6-axis or 9-axis inertial sensor, applying a vibration to the MEMS device by the vibration source and simultaneously moving the testing apparatus according to a predefined movement pattern, reading output data provided by the inertial sensor and comparing the output data to the predefined movement pattern and/or reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.

Abstract: A carrier substrate and a method for making a carrier substrate are disclosed. In an embodiment a carrier substrate includes a substrate body having a multilayer structure, electrical connection pads on a top surface of the substrate body, an organic cushion layer on the top surface of the substrate body, electrically conductive elongated parts arranged on top of the cushion layer, wherein each conductive elongated part is contacted to a respective electric connection pad and a solder pad located at an end of each elongated part distant from the respective connection pad.

Abstract: A sensor component having a MEMS sensor and an ASIC for one sensor function each. A base element, a wall element in the form of a frame and a cover together enclose a cavity of a housing. The MEMS sensor is mounted inside the cavity on the base element of the housing. The ASIC has an active sensor surface and is mounted on or under the cover or is embedded in the cover. Electrical external contacts for the MEMS sensor and ASIC are provided on an external surface of the housing. The cavity has at least one opening or bushing.

Abstract: A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.

Abstract: A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.