Abstract: A housing and a method for manufacturing a housing are disclosed. In an embodiment a housing for an electric component includes a first housing part and a second housing part, wherein the first housing part and the second housing part are connected in a joining region, wherein the joining region is completely or partially covered by a metallic coating on an outside, wherein the first housing part is joined to the second housing part by a connecting agent, wherein the connecting agent is an adhesive or a solder material, wherein the metallic coating covers the first housing part only at an upper side of the first housing part accessible from the outside when the housing parts are joined by the connecting agent, and wherein the metallic coating extends laterally beyond the first housing part and at least partially covers the second housing part.

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface of the carrier board, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, and wherein a laminated polymer hood at least partly covers the top side of the electronic chip and extends onto the upper surface of the carrier board.

Abstract: A microphone having a housing including a bottom part and an upper part, and a transducer element which is arranged in the housing and is electrically and mechanically connected to the bottom part. For stress-free mounting of the transducer element, a flexible connecting element is proposed, which is pliable and/or compressible, is arranged between the transducer element and the upper part, and connects the transducer element to the upper part. The connecting element comprises a plastic, in which gas bubbles are distributed, the gas bubbles having a volume fraction of between 50 and 98% in the connecting element.

Abstract: A housing and a method for manufacturing a housing are disclosed. In an embodiment a housing for an electric component includes a first housing part and a second housing part, wherein the first housing part and the second housing part are connected in a joining region, wherein the joining region is completely or partially covered by a metallic coating on an outside, wherein the first housing part is joined to the second housing part by a connecting agent, wherein the connecting agent is an adhesive or a solder material, wherein the metallic coating covers the first housing part only at an upper side of the first housing part accessible from the outside when the housing parts are joined by the connecting agent, and wherein the metallic coating extends laterally beyond the first housing part and at least partially covers the second housing part.

Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Abstract: A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.

Abstract: A MEMS device comprises a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.

Abstract: A microphone has a housing comprising a bottom part and an upper part, and a transducer element which is arranged in the housing and is electrically and mechanically connected to the bottom part. For stress-free mounting of the transducer element, a flexible connecting element is proposed, which is pliable and/or compressible, is arranged between the transducer element and the upper part and connects the transducer element to the upper part. The connecting element comprises a plastic, in which gas bubbles are distributed, the gas bubbles having a volume fraction of between 50 and 98% in the connecting element.

Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.

Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.

Abstract: For a microphone having an increased rear volume, a cavity housing is proposed, comprising at least a base plate and a covering, which define and enclose the cavity. On the base plate, a microphone transducer, usually an MEMS component, is mounted alongside a sound guiding element. The microphone transducer and the sound guiding element are sealed off with respect to the base plate by a partition and separate the front volume from a rear volume under the covering. The sound guiding element provides a sound channel, which connects an opening in the covering to the front volume. The sound guiding element finishes right up against the covering and thus seals off the sound channel with respect to the rear volume.

Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.

Abstract: The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Abstract: A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.

Abstract: A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.

Abstract: A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.