Patents by Inventor Wolfgang Raberg

Wolfgang Raberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250199095
    Abstract: The implementation proposes a magnetoresistive sensor, including at least one xMR sensor element formed from a layer stack, having a magnetically free layer having a magnetically free vortex magnetization, and having at least one reference layer having a reference magnetization in a predetermined direction. Magnetically free layers having a magnetically free vortex magnetization that are arranged along the predetermined direction on opposite sides of the xMR sensor element and laterally adjacent to the xMR sensor element. The adjacent magnetically free layers can act as magnetic flux concentrators for the magnetoresistive sensor element arranged therebetween.
    Type: Application
    Filed: December 9, 2024
    Publication date: June 19, 2025
    Inventors: Bernhard ENDRES, Wolfgang RABERG, Andreas STRAßER
  • Publication number: 20250160221
    Abstract: A method of manufacturing a superconductive integrated circuit on a substrate includes forming a first superconductive layer of a superconductive material over the substrate. A Josephson junction (JJ) layer stack including a JJ barrier layer is formed over the first superconductive layer. The JJ layer stack is structured to form a JJ structure. The first superconductive layer is structured to form a structured first superconductive layer. A dielectric cover layer is formed over the JJ structure. The dielectric cover layer is structured a first time to expose an upper side of the JJ structure. A second superconductive layer of a superconductive material is formed over the dielectric cover layer. The second superconductive layer is structured to form a structured second superconductive layer.
    Type: Application
    Filed: October 31, 2024
    Publication date: May 15, 2025
    Inventors: Wolfgang RABERG, Michael KIRSCH, Jash BANKER, Jochen BRAUMÜLLER, Nicolas ARLT
  • Publication number: 20250116745
    Abstract: The implementation proposes a substrate and a method for heating a magnetoresistive sensor. The substrate includes a wire-on-chip (WoC) layer. The WoC layer has one or more conductive WoC wires for generating a magnetic field, the one or more conductive WoC wires being integrated in a chip plane. The substrate further includes a heating layer. The heating layer has one or more conductive heating wires for increasing a temperature of the substrate.
    Type: Application
    Filed: September 30, 2024
    Publication date: April 10, 2025
    Inventors: Wolfgang RABERG, Milan AGRAWAL
  • Publication number: 20240357947
    Abstract: An electronic circuit includes a substrate and a superconducting electronic circuit unit which is constructed on the substrate. The superconducting electronic circuit unit includes a capacitor with parallel plates opposite one another and a crystalline capacitor dielectric arranged between the parallel plates.
    Type: Application
    Filed: April 15, 2024
    Publication date: October 24, 2024
    Inventors: Jochen BRAUMÜLLER, Florian BRANDL, Michael KIRSCH, Wolfgang RABERG, Nicolas ARLT, Jash BANKER, Patrick HANEKAMP
  • Patent number: 12092704
    Abstract: Some embodiments relate to a magnetoresistive sensor element comprising a magnetoresistive strip. The magnetoresistive strip includes a first linear segment, and a second linear segment arranged in series with the first linear segment. The second linear segment adjoins the first linear segment at a first inner corner corresponding to a first obtuse angle having a first magnitude. The magnetoresistive strip also includes a third linear segment arranged in series with the first and second linear segments, and a fourth linear segment arranged in series with the first, second, and third linear segments. The fourth linear segment adjoins the third linear segment at a second inner corner corresponding to a second obtuse angle having a second magnitude. Te second magnitude differs from the first magnitude.
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: September 17, 2024
    Assignee: Infineon Technologies AG
    Inventors: Juergen Zimmer, Wolfgang Raberg
  • Publication number: 20240230797
    Abstract: The present disclosure proposes a spin valve device comprising a layer stack. The layer stack comprises one or more layers forming a unidirectionally magnetized reference system, a vortex-magnetized free layer, a non-magnetic layer separating the reference system from the free layer, and one or more layers forming a bias structure being exchange-coupled to the free layer, the bias structure having a vortex-magnetization with closed flux of a predetermined rotation direction.
    Type: Application
    Filed: October 16, 2023
    Publication date: July 11, 2024
    Inventors: Dieter SUESS, Armin SATZ, Wolfgang RABERG, Klemens PRÜGL, Mathias KLAEUI
  • Publication number: 20240170374
    Abstract: A semiconductor package includes a lead frame that includes a die pad and a first lead extending away from the die pad, a semiconductor die mounted on the die pad, a load path connection that electrically connects a first load terminal of the semiconductor die with the first lead, and a magnetic sensor arrangement mounted directly on a region of the lead frame which forms part of the load path connection, wherein the magnetic sensor arrangement comprises a magnetic current sensor that is configured to measure a current flowing through the load path connection and an electrical isolation layer that electrically isolates the magnetic current sensor from the lead frame.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Shu Hui Goh, Gianluca Camuso, Thai Kee Gan, Wolfgang Raberg, Wolfgang Scholz, Elvis Wei Shi, Joo Teng Teoh, Hui Wen Goh, Chiao Eing Lim
  • Publication number: 20240133982
    Abstract: The present disclosure proposes a spin valve device comprising a layer stack. The layer stack comprises one or more layers forming a unidirectionally magnetized reference system, a vortex-magnetized free layer, a non-magnetic layer separating the reference system from the free layer, and one or more layers forming a bias structure being exchange-coupled to the free layer, the bias structure having a vortex-magnetization with closed flux of a predetermined rotation direction.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Dieter SUESS, Armin SATZ, Wolfgang RABERG, Klemens PRÜGL, Mathias KLAEUI
  • Patent number: 11815532
    Abstract: The described techniques address issues associated with coreless current sensors by implementing a current sensor solution that may use as few as two, two-dimensional (2D) linear sensors. The discussed techniques provide a coreless current sensor solution that is independent of the sensor position with respect to a current-carrying conductor. An algorithm is also described for auto-calibration of sensor position with respect to a current-carrying conductor to calculate the current flowing through the conductor. The calculation of current may be performed independent of the position of the current-carrying conductor with respect to the sensor, and thus the disclosed techniques provide additional advantages regarding installation flexibility without sacrificing measurement accuracy.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: November 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Milan Agrawal, Dominik Durner, Wolfgang Raberg
  • Patent number: 11808791
    Abstract: A current sensor arrangement includes a first conductor configured to conduct a first portion of a primary current in a current flow direction; a second conductor configured to conduct a second portion of the primary current in the current flow direction; and a magnetic sensor. The first and second conductor are coupled in parallel. The first current produces a first magnetic field as it flows through the first conductor and the second current produces a second magnetic field as it flows through the second conductor. The first conductor and the second conductor are separated from each other in a first direction that is orthogonal to the current flow direction, thereby defining a gap. The magnetic sensor is arranged in the gap such that the first conductor is arranged over a first portion of the magnetic sensor and the second conductor is arranged under a second portion of the magnetic sensor.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: November 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Guenter Schwarzberger, Sebastian Maerz, Wolfgang Raberg
  • Publication number: 20230324477
    Abstract: The present disclosure relates to a magnetic sensor device, including a substrate spanning a plane, a plurality of series-connected TMR resistance elements arranged on the substrate, wherein each of the TMR resistance elements has at least one magnetic tunnel contact and wherein each of the TMR resistance elements has the same reference magnetization. The series-connected TMR resistance elements are arranged and interconnected on the substrate in such a way that an electric current flow direction in the plane relative to the reference magnetization changes at least once along a current path through the series-connected TMR resistance elements.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 12, 2023
    Inventor: Wolfgang RABERG
  • Patent number: 11761990
    Abstract: A current sensor arrangement includes a first conductor configured to conduct a first portion of a primary current in a current flow direction; a second conductor configured to conduct a second portion of the primary current in the current flow direction; and a magnetic sensor. The first and second conductor are coupled in parallel. The first current produces a first magnetic field as it flows through the first conductor and the second current produces a second magnetic field as it flows through the second conductor. The first conductor and the second conductor are separated from each other in a first direction that is orthogonal to the current flow direction, thereby defining a gap. The magnetic sensor is arranged in the gap such that the first conductor is arranged over a first portion of the magnetic sensor and the second conductor is arranged under a second portion of the magnetic sensor.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: September 19, 2023
    Assignee: Infineon Technologies AG
    Inventors: Guenter Schwarzberger, Sebastian Maerz, Wolfgang Raberg
  • Publication number: 20230160929
    Abstract: The described techniques address issues associated with coreless current sensors by implementing a current sensor solution that may use as few as two, two-dimensional (2D) linear sensors. The discussed techniques provide a coreless current sensor solution that is independent of the sensor position with respect to a current-carrying conductor. An algorithm is also described for auto-calibration of sensor position with respect to a current-carrying conductor to calculate the current flowing through the conductor. The calculation of current may be performed independent of the position of the current-carrying conductor with respect to the sensor, and thus the disclosed techniques provide additional advantages regarding installation flexibility without sacrificing measurement accuracy.
    Type: Application
    Filed: November 24, 2021
    Publication date: May 25, 2023
    Inventors: Milan Agrawal, Dominik Durner, Wolfgang Raberg
  • Publication number: 20230066358
    Abstract: The described techniques facilitate the use of a magnetic field sensor that implements the same magnetic layer stack for the detection of the x, y, and z components of an external magnetic field. The sensor advantageously is insensitive to orthogonal stray fields and operates with a reduced offset compared to conventional magnetic field sensors. The linear regime implemented by the sensor to facilitate magnetic field detection may also be adjusted per application by tuning the current strength.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Dieter Suess, Udo Ausserlechner, Armin Satz, Klemens Pruegl, Wolfgang Raberg, Milan Agrawal, Johannes Guettinger, Michael Kirsch
  • Publication number: 20230034717
    Abstract: Some embodiments relate to a magnetoresistive sensor element comprising a magnetoresistive strip. The magnetoresistive strip includes a first linear segment, and a second linear segment arranged in series with the first linear segment. The second linear segment adjoins the first linear segment at a first inner corner corresponding to a first obtuse angle having a first magnitude. The magnetoresistive strip also includes a third linear segment arranged in series with the first and second linear segments, and a fourth linear segment arranged in series with the first, second, and third linear segments. The fourth linear segment adjoins the third linear segment at a second inner corner corresponding to a second obtuse angle having a second magnitude. Te second magnitude differs from the first magnitude.
    Type: Application
    Filed: October 11, 2022
    Publication date: February 2, 2023
    Inventors: Juergen Zimmer, Wolfgang Raberg
  • Patent number: 11519977
    Abstract: A magnetoresistive sensor has a sensor plane in which the magnetoresistive sensor is sensitive to a magnetic field. The magnetoresistive sensor includes a reference layer having a reference magnetization that is fixed and that is aligned with an in-plane axis of the sensor plane; and a magnetic free layer disposed proximate to the reference layer, the magnetic free layer having a free layer magnetization aligned along an out-of-plane axis that is out-of-plane to the sensor plane. The free layer magnetization is configured to tilt away from the out-of-plane axis and towards the sensor plane in a presence of an external in-plane magnetic field.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: December 6, 2022
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Raberg, Clemens Muehlenhoff, Juergen Zimmer
  • Patent number: 11506732
    Abstract: Embodiments relate to xMR sensors, including giant magnetoresistive (GMR), tunneling magnetoresistive (TMR) or anisotropic magnetoresistive (AMR), and the configuration of xMR strips within xMR sensors. In an embodiment, an xMR strip includes a plurality of differently sized and/or differently oriented serially connected portions. In another embodiment, an xMR strip includes a varying width or other characteristic. Such configurations can address discontinuities associated with conventional xMR sensors and improve xMR sensor performance.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: November 22, 2022
    Assignee: Infineon Technologies AG
    Inventors: Juergen Zimmer, Wolfgang Raberg
  • Publication number: 20220334148
    Abstract: A current sensor arrangement includes a first conductor configured to conduct a first portion of a primary current in a current flow direction; a second conductor configured to conduct a second portion of the primary current in the current flow direction; and a magnetic sensor. The first and second conductor are coupled in parallel. The first current produces a first magnetic field as it flows through the first conductor and the second current produces a second magnetic field as it flows through the second conductor. The first conductor and the second conductor are separated from each other in a first direction that is orthogonal to the current flow direction, thereby defining a gap. The magnetic sensor is arranged in the gap such that the first conductor is arranged over a first portion of the magnetic sensor and the second conductor is arranged under a second portion of the magnetic sensor.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 20, 2022
    Applicant: Infineon Technologies AG
    Inventors: Guenter SCHWARZBERGER, Sebastian MAERZ, Wolfgang RABERG
  • Patent number: 11467232
    Abstract: Example implementations are concerned with magnetoresistive sensors and with corresponding fabrication methods for magnetoresistive sensors. One example here relates to a magnetoresistive sensor having a layer stack. The layer stack comprises a reference layer having a reference magnetization, which is fixed and has a first magnetic orientation. The layer stack comprises a magnetically free layer. The magnetically free layer has a magnetically free magnetization. The magnetically free magnetization is variable in the presence of an external magnetic field. The magnetically free magnetization has a second magnetic orientation in a ground state. One of the first or the second magnetic orientation is oriented in-plane and the other is oriented out-of-plane. The layer stack comprises a metal multilayer. In this case, either the metal multilayer is arranged adjacent to the magnetically free layer, or the metal multilayer constitutes the magnetically free layer.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 11, 2022
    Assignee: Infineon Technologies AG
    Inventors: Clemens Muehlenhoff, Wolfgang Raberg, Dieter Suess
  • Patent number: 11467188
    Abstract: A current sensor arrangement includes a first conductor configured to conduct a first portion of a primary current in a current flow direction; a second conductor configured to conduct a second portion of the primary current in the current flow direction; and a magnetic sensor. The first and second conductor are coupled in parallel. The first current produces a first magnetic field as it flows through the first conductor and the second current produces a second magnetic field as it flows through the second conductor. The first conductor and the second conductor are separated from each other in a first direction that is orthogonal to the current flow direction, thereby defining a gap. The magnetic sensor is arranged in the gap such that the first conductor is arranged over a first portion of the magnetic sensor and the second conductor is arranged under a second portion of the magnetic sensor.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: October 11, 2022
    Inventors: Guenter Schwarzberger, Sebastian Maerz, Wolfgang Raberg