Abstract: The present invention relates to a method for the production of layers of solid material, in particular for use as wafers. The method may include the following steps: providing a workpiece for the separation of the layers of solid material with the workpiece optionally having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material having the carrier unit optionally having a receiving layer for holding the layer of solid material, attaching the receiving layer to the exposed surface of the workpiece forming a composite structure, producing a break initiation point by means of pre-defined local stress induction in the peripheral region, including at the edge, of the workpiece, and separating the layer of solid material from the workpiece starting from the break initiation point.

Abstract: Providing a solid body to be split into a number of layers of solid material, introducing or generating defects in the solid body in order to determine a first detachment plane (8) along which a first layer of solid material is separated from the solid body, providing a receiving layer for holding the layer of solid material on the solid body, applying heat to the receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the first layer of solid material from the solid body, then providing a second receiving layer for holding another layer of solid material on the solid body reduced by the first layer of solid material, introducing or generating defects in the solid body in order to determine a second detachment plane (9) along which a second layer of solid material is separated from the solid body, applying heat to the second receiving layer in order to generate, in

Abstract: The overall yield of a splitting method for division of a solid-state starting material into at least two solid-state pieces is increased by use of a polymer hybrid material comprising one or more fillers in a polymer matrix. A corresponding splitting method comprises the steps of providing the solid-state starting material with at least one exposed surface, applying a polymer hybrid material comprising fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, and subjecting the composite structure to a stress field such that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces.

Abstract: The present invention relates to a method for the production of layers of solid material, in particular for use as wafers. The method may include the following steps: providing a workpiece for the separation of the layers of solid material with the workpiece optionally having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material having the carrier unit optionally having a receiving layer for holding the layer of solid material, attaching the receiving layer to the exposed surface of the workpiece forming a composite structure, producing a break initiation point by means of pre-defined local stress induction in the peripheral region, including at the edge, of the workpiece, and separating the layer of solid material from the workpiece starting from the break initiation point.

Abstract: A method for producing layers of solid material is contemplated.

Abstract: The invention relates to a method for producing a multi-layer assembly.

Abstract: The overall yield of a splitting method for division of a solid-state starting material into at least two solid-state pieces is increased by use of a polymer hybrid material comprising one or more fillers in a polymer matrix. A corresponding splitting method comprises the steps of providing the solid-state starting material with at least one exposed surface, applying a polymer hybrid material comprising fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, and subjecting the composite structure to a stress field such that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces.

Abstract: The invention relates to a method of producing at least one layer of solid material.

Abstract: The present invention relates to a method for producing a multi-component wafer, in particular a MEMS wafer.

Abstract: The invention relates to a method for producing at least one solid layer and comprises at least the steps of: providing a carrier substrate (4) having a sacrificial layer (8) arranged thereon or arranging a sacrificial layer (8) on the provided carrier substrate (4), producing a useful layer (6) by way of chemical or physical gas phase deposition on the sacrificial layer (8) to form a multi-layer arrangement (2), removing the useful layer (6) as a result of a material weakening produced between the useful layer (6) and the carrier substrate (4), said material weakening being brought about by modifications (12) to the sacrificial layer (8) which were produced means of laser beams (10).

Abstract: The invention relates to a method of producing at least one layer of solid material (1).

Abstract: The present invention relates to a method for the production of layers of solid material. The method according to the invention comprises at the very least the steps of providing a solid body (2) for the separation of at least one layer of solid material (4), generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer (10) disposed on the solid body (2) in order to generate, in particular mechanically, stresses in the solid body (2), due to the stresses a crack propagating in the solid body (2) along the detachment plane (8), which crack separates the layer of solid material (4) from the solid body (2).

Abstract: The invention relates to a method for producing layers of solid material.

Abstract: The present invention relates to a method for the production of layers of solid material (5), in particular for use as wafers. The method preferably comprises the following steps: providing a workpiece (4) for the separation of the layers of solid material (5), the workpiece (4) having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material (5), the carrier unit having a receiving layer (2) for holding the layer of solid material (5), attaching the receiving layer (2) to the exposed surface of the workpiece (4), thus forming a composite structure, producing a break initiation point (44) by means of pre-defined local stress induction in the peripheral region, in particular at the edge, of the workpiece (4), and separating the layer of solid material (5) from the workpiece (4) starting from the break initiation point (44).

Abstract: The invention relates to a method and a system for calibrating a transmitting system (1) for transmitting data from a medium access control device (2) via a digital interface (IF1) to a physical layer (PHY) and an antenna (3) to a transmission line (4), wherein the physical layer (PHY) comprises a base band controller (5) and a data processing pipeline (6) comprising a plurality of functional blocks (FB1 to FB13), comprising the following steps: setting a calibration control register (R), thereupon, setting the transmitting system (1) to a calibration mode, wherein the transmitting system (1) generates a predetermined number of single test tones (T) and transmits the test tones (T) sequentially, and after transmission of the test tones (T), detecting the returned test tones (T) and measuring their levels, especially their power levels and the spectrum behavior of the transmission line (4).

Abstract: The invention relates to a system for transmitting data from a medium access control device (2) via a digital interface (IF1) to a physical layer (PHY) and to an antenna (5), the physical layer (PHY) comprising a base band (4) with a base band controller (7) and a data processing pipeline (3) comprising a plurality of functional blocks (FB1 to FB 13), wherein a burst timing control block of one of all functional blocks (FB1 to FB 13) of the data processing pipeline (3) detects an end of a packet of payload data and, thereupon, sets a halt signal (STALL) for those functional blocks (FB1 to FB 13) preceding the burst timing control block (FB1 to FB 13) in the data processing pipeline (3) and starts a timer (T1) for counting a duration of a minimum inter-frame space (MIFS), wherein the burst timing control block (FB1 to FB 13) resets the halt signal (STALL) after expiration of the timer (T1). It also relates to a corresponding method.

Abstract: A processor arrangement having a strip structure for parallel data processing is configured so that local data from the individual processing units or strips is brought together in a rapid manner. Input data, intermediate data and/or output data from various processing units are linked together in an operation which is at least partially combinatory. The data linking operation is not clock controlled. The linking of the local data from various strips in this manner reduces delays in parallel data processing in the processor arrangement. The combinatory data linking operation can provide an overall data linking outcome within an individual clock cycle.

Abstract: Methods are provided for effecting functional control of program flow and/or data flow in digital signal processors and in processors which have closed and separated modules for effecting the program and data flow control or which operate in parallel arithmetic-logic units. The methods enhance the functionality of the signal processor to such an extent that the units of the processor, without time delays, are adapted, with regard to their energy consumption, to the latest demands of signal processing. The methods provide additional possibilities for saving energy which are enabled by algorithm-related shutdown of functional units. An external hardware-related signal input into the processor or a software-related state output from the program flow in the processor may be used to trigger an interruption in the clock pulse supply for the respective functional units for the period of time during which these functional units are not used.

Abstract: A processor bus has several data processing units, each connected to a line system which acts as a bus having bus segments connected in a separable manner through connection units. Functional units arranged on the bus carry out the information thereof. The functional units may carry out exchanges independently of each other. Conversely, functional units in different groups may carry out information exchanges simultaneously. The connection units define combinatory connections of the signal lines, with physical connections between the connection units provided by the bus segments. The connection units can carry out information exchanges with as many connected functional units as desired. The information path from a functional unit to selected functional units can be multiplexed or switched by toggling simultaneous connections to several functional units or by bridging non-participating functional units.

Abstract: The invention relates to a communication system (1), comprising a digital interface (2) for transmitting data between a medium access control subsystem (3) and a physical layer (4), furthermore comprising at least a vendor specific register (10.3) integrated into the physical layer (4) and accessible by said medium access control subsystem (3) for controlling the physical layer (4), and furthermore comprising at least a system register (9) integrated into the physical layer (4), wherein:—the system register (9) is accessible by the medium access control subsystem (3) via the vendor specific register (10.3).