Patents by Inventor Won-Eui Hong

Won-Eui Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10224516
    Abstract: The present invention relates to method for depositing an organic material for an organic light emitting device and an organic light emitting device manufactured thereby. The method includes the steps of: applying a premix in which a host and a dopant are premixed, to a first donor substrate; heating the premix by applying an electric field to the first donor substrate; depositing the host and the dopant separated into different layers on a second donor substrate, with the host or the dopant having a relatively low vaporization temperature first deposited from the premix onto the second donor substrate and then the dopant or the host having a relatively high vaporization temperature deposited later onto the second donor substrate; heating the host and the dopant by applying an electric field to the second donor substrate; and depositing the host and the dopant that are uniformly mixed on a target substrate.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: March 5, 2019
    Assignee: Dawonsys Co., Ltd.
    Inventors: Sun Soon Park, Hae Ryong Lee, Sung Hoon Jee, Won Eui Hong, Tae Ho Cho, Doo Jung Park
  • Publication number: 20180183013
    Abstract: The present invention relates to method for depositing an organic material for an organic light emitting device and an organic light emitting device manufactured thereby. The method includes the steps of: applying a premix in which a host and a dopant are premixed, to a first donor substrate; heating the premix by applying an electric field to the first donor substrate; depositing the host and the dopant separated into different layers on a second donor substrate, with the host or the dopant having a relatively low vaporization temperature first deposited from the premix onto the second donor substrate and then the dopant or the host having a relatively high vaporization temperature deposited later onto the second donor substrate; heating the host and the dopant by applying an electric field to the second donor substrate; and depositing the host and the dopant that are uniformly mixed on a target substrate.
    Type: Application
    Filed: May 17, 2017
    Publication date: June 28, 2018
    Inventors: Sun Soon PARK, Hae Ryong LEE, Sung Hoon JEE, Won Eui HONG, Tae Ho CHO, Doo Jung PARK
  • Publication number: 20150060870
    Abstract: Disclosed are a supporting substrate for manufacturing a flexible information display device capable of easily separating the flexible information display device from the supporting substrate without deforming or damaging the flexible information display device, a manufacturing method thereof, and a flexible information display device manufactured thereby. The supporting substrate for manufacturing a flexible information display device includes: a coating layer formed therein with a plurality micro-protrusions formed on the supporting substrate; and a temporary bonding/debonding layer formed on the coating layer and including an adhesive material mechanically interlocked with and bonded to the supporting substrate through Van der Waals bonding force.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Inventors: Jae-Sang RO, KEUN SOO LEE, YONG SEOK KIM, Won-Eui HONG, Ingoo Jang, Seung-Yeol Yang, Jin Narn JEON, Kwang Joon KIM
  • Publication number: 20150060869
    Abstract: Disclosed are a supporting substrate for manufacturing a flexible information display device using a temporary bonding/debonding layer, a manufacturing method thereof, and a flexible information display device. A supporting substrate for manufacturing a flexible information display device, the supporting substrate comprising: a temporary bonding/debonding layer having a thickness in a range of 0.1 nm to 1000 nm and comprising an adhesive material bonded to the supporting substrate through Van der Waals bonding force. Provided is a method capable of economically manufacturing the display device having a high resolution while reviewing a cost competitive force by reducing a device investment cost and improving the yield rate in the flexible flat panel information display device.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Inventors: Jae-Sang RO, Keun Soo Lee, Yong Seok Kim, Won-Eui Hong, Ingoo Jang, Seung-Yeol Yang, Jin Name Jeon, Kwang Joon Kim
  • Patent number: 8951891
    Abstract: Provided are a deposition substrate of a deposition apparatus, a method of forming a layer using the same, and a method of manufacturing an organic light emitting diode (OLED) display device. The method of forming a layer using the deposition substrate includes preparing a substrate, forming a heating conductive layer for Joule heating on the substrate, forming a first insulating layer on the heating conductive layer for Joule heating and including a groove or hole, forming a deposition material layer on a top surface of the first insulating layer having the groove or hole, and applying an electric field to the heating conductive layer for Joule heating to perform Joule-heating on the deposition material layer. Thus, the method is suitable for manufacturing a large-sized device.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: February 10, 2015
    Assignee: Ensil Tech Corporation
    Inventors: Jae-Sang Ro, Won-Eui Hong
  • Publication number: 20140312765
    Abstract: A flat panel display apparatus includes a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing substrate, including a region that overlaps the sealing member, and including a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the sealing member; and a lead-in unit connected to the wiring unit to apply a voltage to the wiring unit, and formed to be electrically connectable to an external power source.
    Type: Application
    Filed: March 11, 2014
    Publication date: October 23, 2014
    Applicants: ENSIL TECH CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Oh-Seob KWON, Sung-Soo KOH, Jae-Sang RO, Seog-Young LEE, Won-Eui HONG
  • Patent number: 8847484
    Abstract: A mother substrate for forming flat panel display apparatuses and a method of manufacturing the same, the mother substrate including a substrate; a plurality of display units on the substrate, the display units being for forming a plurality of flat panel display apparatuses; a sealing substrate facing the display units; sealing members between the substrate and the sealing substrate, the sealing members surrounding each of the display units; a plurality of wiring units between the substrate and the sealing substrate, the wiring units overlapping the sealing members; a connecting unit including a conductive material, the connecting unit connecting adjacent wiring units in one direction and having a width that is greater than a width of each of the wiring units; and inlets connected to the plurality of wiring units and an external power source, the inlets being for applying a voltage to the plurality of wiring units.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: September 30, 2014
    Assignees: Samsung Display Co., Ltd., Ensil Tech Co., Ltd.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Byung-Uk Han, Jung-Jun Im, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Patent number: 8680767
    Abstract: A flat panel display apparatus includes a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing substrate, including a region that overlaps the sealing member, and including a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the sealing member; and a lead-in unit connected to the wiring unit to apply a voltage to the wiring unit, and formed to be electrically connectable to an external power source.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: March 25, 2014
    Assignees: Samsung Display Co., Ltd., Ensil Tech Co., Ltd.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20140050847
    Abstract: Provided are a deposition method of patterning a thin film on a substrate using momentary Joule heating in a vacuum environment, and a method thereof. The deposition device forms a deposition target layer on one surface of a source substrate as a pattern to be deposited. A deposition target layer forming unit forms a deposition target layer on the one surface of the source substrate to cover the conductive layer. A chamber in a vacuum state receives the source substrate on which the conductive layer and the deposition target layer are formed and the target substrate. A target substrate is disposed in the chamber to face the source substrate. A power supply applies power to the conductive layer to heat-generate the conductive layer. A configuration of the deposition device is very simple, and it is easy to uniformly form a deposition thickness.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 20, 2014
    Applicant: EnSilTech Corporation
    Inventors: Jae-Sang RO, Won-Eui Hong, Seog-Young Lee, Ingoo Jang
  • Patent number: 8603869
    Abstract: Provided are thin film transistor, a method of fabricating the same, a flat panel display device including the same, and a method of fabricating the flat panel display device, that are capable of applying an electric field to a gate line to form a channel region of a semiconductor layer of a thin film transistor using a polysilicon layer crystallized by a high temperature heat generated by Joule heating of a conductive layer. As a result, a process can be simplified using a gate line included in the thin film transistor as the conductive layer, and the channel region of the semiconductor layer can be formed of polysilicon having a uniform degree of crystallinity. The thin film transistor includes a straight gate line disposed in one direction, a semiconductor layer crossing the gate line, and source and drain electrodes connected to source and drain regions of the semiconductor layer.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: December 10, 2013
    Assignee: Ensiltech Corporation
    Inventors: Jae-Sang Ro, Won-Eui Hong
  • Publication number: 20130300283
    Abstract: Flat panel displays and methods of manufacturing the displays are disclosed. In one embodiment, the flat panel display includes: i) a substrate, ii) a display unit formed over the substrate, iii) an encapsulation substrate formed so as to face the display unit and iv) a sealing member formed between the substrate and the encapsulation substrate so as to substantially surround the display unit. The display may further include i) a wiring unit formed between the substrate and the encapsulation substrate so as to substantially overlap with the sealing member, wherein the wiring unit includes at least one via hole and ii) an inlet unit connected to the wiring unit and connectable to an external power source.
    Type: Application
    Filed: July 15, 2013
    Publication date: November 14, 2013
    Inventors: Jung-Jun Im, Oh-Seob Kwon, Byung-Uk Han, Sung-Soo Koh, Jae-Sang Ro, Won-Eui Hong, Seog-Young Lee
  • Patent number: 8564197
    Abstract: In a flat panel display apparatus and a method of manufacturing the same, the flat panel display apparatus includes a substrate, a display unit disposed on the substrate, a sealing substrate disposed facing the display unit, a sealing member disposed between the substrate and the sealing substrate so as to surround the display unit, a wiring unit disposed between the substrate and the sealing substrate so as to partially overlap the sealing member, and at least three inlet portion groups to which voltage is applied via an external power source. The inlet portion groups are connected to the wiring unit. Each inlet portion group includes a plurality of sub-inlet portions.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: October 22, 2013
    Assignees: Samsung Display Co., Ltd., Ensil Tech Co., Ltd.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20130267055
    Abstract: Provided are a deposition substrate of a deposition apparatus, a method of forming a layer using the same, and a method of manufacturing an organic light emitting diode (OLED) display device. The method of forming a layer using the deposition substrate includes preparing a substrate, forming a heating conductive layer for Joule heating on the substrate, forming a first insulating layer on the heating conductive layer for Joule heating and including a groove or hole, forming a deposition material layer on a top surface of the first insulating layer having the groove or hole, and applying an electric field to the heating conductive layer for Joule heating to perform Joule-heating on the deposition material layer. Thus, the method is suitable for manufacturing a large-sized device.
    Type: Application
    Filed: July 7, 2010
    Publication date: October 10, 2013
    Applicant: ENSILTECH CORPORATION
    Inventors: Jae-Sang Ro, Won-Eui Hong
  • Patent number: 8405293
    Abstract: A flat panel display apparatus includes a first substrate having a display region, a second substrate facing the first substrate and bonded to the first substrate, a groove portion in an edge of at least one of the first substrate and the second substrate, and a wiring portion and a bonding member arranged in the groove portion. The bonding member contacts the wiring portion. The wiring portion is configured to receive power and to supply heat to the bonding member. The bonding member is configured to bond the first substrate and the second substrate using the heat supplied from the wiring portion disposed in the groove portion.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: March 26, 2013
    Assignees: Samsung Display Co., Ltd., Ensil Tech Co., Ltd.
    Inventors: Byung-Uk Han, Oh-Seob Kwon, Sung-Soo Koh, Jung-Jun Im, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Patent number: 8400057
    Abstract: An organic electroluminescence apparatus comprises: a substrate having a pixel region and sealing regions; an organic electroluminescence device located in the pixel region of the substrate; and a sealing substrate having a pixel region and sealing regions corresponding to the pixel region and the sealing regions of the substrate. The sealing regions of the sealing substrate comprise conductive layers continuously connected to each other. In a method of manufacturing organic electroluminescence apparatus by sealing the substrate and the sealing substrate using a glass frit, manufacturing costs and process time can be greatly reduced.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: March 19, 2013
    Assignees: Samsung Display Co., Ltd., EnsilTech Corporation
    Inventors: Oh-Seob Kwon, Dong-Seop Park, Jung-Jun Im, Jae-Sang Ro, Won-Eui Hong, Seog-Young Lee
  • Publication number: 20130047920
    Abstract: There are provided a deposition device for forming an organic layer using Joule heating and a device for fabricating an electroluminescent display device using the deposition device that includes a cleansing device, an organic matter coating device, an electric field applying device and a loadlock chamber. The cleansing device cleanses a donor substrate. The organic matter coating device coats an organic matter on the donor substrate. The electric field applying device allows the organic matter to be transferred onto an element substrate. Here, the organic matter is heated by the Joule-heating generated by applying an electric field to the donor substrate having the organic matter formed thereon. The loadlock chamber loads or carries out the donor substrate into/from the electric field applying device. Accordingly, the present invention is advantageous in fabricating a large-scale element, and it is possible to increase a processing speed and to reduce device cost.
    Type: Application
    Filed: August 22, 2012
    Publication date: February 28, 2013
    Applicant: EnSilTech Corporation
    Inventors: Jae-Sang RO, Won-Eui Hong
  • Publication number: 20130033834
    Abstract: A flat panel display apparatus may include: a substrate; a display portion arranged on the substrate; an encapsulation substrate arranged to face the display portion; a sealing portion arranged between the substrate and the encapsulation substrate and surrounding the display portion; a wiring portion arranged between the substrate and the encapsulation substrate and having an area overlapping the sealing portion, and comprising a plurality of wiring members having different respective resistances; and a lead-in portion connected to the wiring portion and an external power source for applying a voltage to the wiring portion.
    Type: Application
    Filed: June 14, 2012
    Publication date: February 7, 2013
    Applicants: Ensil Tech Co., Ltd., Samsung Mobile Display Co., Ltd.
    Inventors: Oh-Seob Kwon, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20120224342
    Abstract: A flat panel display apparatus having improved encapsulating characteristics comprises: a substrate; a display unit on the substrate; a sealing substrate disposed facing the display unit; a sealing member between the substrate and the sealing substrate and surrounding the display unit; a wiring unit between the substrate and the sealing substrate and overlapping at least the sealing member, and including wiring members separated from each other; and an inlet unit electrically connected to a power source and the wiring unit for applying voltage to the wiring unit, and including an edge parallel with an outermost wiring member of the wiring unit. A mother substrate for the display apparatus comprises a substrate, a plurality of display units, a sealing substrate, a sealing member, wiring units, a connection unit, and an inlet unit. Methods of manufacturing the display apparatus and the mother substrate are also disclosed.
    Type: Application
    Filed: February 13, 2012
    Publication date: September 6, 2012
    Applicants: ENSIL TECH CO., LTD., SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Jeong-Moon Kim, Dong-Seop Park, Oh-Seob Kwon, Jae-Sang Ro, Won-Eui Hong, Seog-Young Lee
  • Publication number: 20120164819
    Abstract: An apparatus and method for fabricating a polycrystalline silicon (poly-Si) thin film are provided. The apparatus includes a chamber, a substrate stage installed at a lower portion in the chamber and on which a substrate including a conductive layer is located, a power application unit installed at an upper portion in the chamber and including an electrode terminal applying power to the conductive layer, and a conductive pad interposed between the electrode terminal and the conductive layer. Thus, it is possible to form a uniform electric field on the conductive layer, and to form a good quality of poly-Si thin film.
    Type: Application
    Filed: December 27, 2010
    Publication date: June 28, 2012
    Applicant: ENSILTECH CORPORATION
    Inventors: Jae-Sang RO, Won-Eui HONG
  • Publication number: 20120106044
    Abstract: In a flat panel display apparatus and a method of manufacturing the same, the flat panel display apparatus includes a substrate, a display unit disposed on the substrate, a sealing substrate disposed facing the display unit, a sealing member disposed between the substrate and the sealing substrate so as to surround the display unit, a wiring unit disposed between the substrate and the sealing substrate so as to partially overlap the sealing member, and at least three inlet portion groups to which voltage is applied via an external power source. The inlet portion groups are connected to the wiring unit. Each inlet portion group includes a plurality of sub-inlet portions.
    Type: Application
    Filed: September 20, 2011
    Publication date: May 3, 2012
    Applicants: ENSIL TECH CO., LTD., SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong