Abstract: In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

Abstract: Disclosed are a displaying substrate and a liquid crystal display device having the same. A pad portion formed on the displaying substrate has a plurality of via holes for exposing a pad metal layer. A width of the via hole is smaller than a diameter of a conductive particle. Where the width of the via hole is larger than the diameter of the conductive particle, a depth of the via hole is smaller than the diameter of the conductive particle. Thus, a driving failure which may occur in the pad portion is prevented while maintaining a deformation ratio of the conductive particle at about 20˜60%, thereby enhancing a connecting force between the pad portion and a circuit substrate.

Abstract: Disclosed are a displaying substrate and a liquid crystal display device having the same. A pad portion formed on the displaying substrate has a plurality of via holes for exposing a pad metal layer. A width of the via hole is smaller than a diameter of a conductive particle. Where the width of the via hole is larger than the diameter of the conductive particle, a depth of the via hole is smaller than the diameter of the conductive particle. Thus, a driving failure which may occur in the pad portion is prevented while maintaining a deformation ratio of the conductive particle at about 20˜60%, thereby enhancing a connecting force between the pad portion and a circuit substrate.