Abstract: A method for forming fine patterns in a semiconductor device includes forming an etch stop layer and a sacrificial layer over an etch target layer, forming photoresist patterns over the sacrificial layer, etching the sacrificial layer by using the photoresist patterns as an etch barrier to form sacrificial patterns, forming spacers on both sidewalls of the sacrificial patterns, removing the sacrificial patterns, and etching the etch stop layer and the etch target layer by using the spacer as an etch barrier.

Abstract: A doping method for a semiconductor device includes forming a trench in a semiconductor substrate, forming a doped layer doped with a dopant over the undoped layer, and forming a doped region into which the dopant is diffused, wherein the doped region is a portion of the semiconductor substrate in contact with the doped layer.

Abstract: A semiconductor device including a conductive layer, a diffusion barrier layer formed over the conductive layer, including a refractory metal compound, and acquired after a surface treatment, and a metal silicide layer formed over the diffusion barrier layer. The adhesion between a diffusion barrier layer and a metal silicide layer may be improved by increasing the surface energy of the diffusion barrier layer through a surface treatment. Therefore, although the metal silicide layer is fused in a high-temperature process, it is possible to prevent a void from being caused at the interface between the diffusion barrier layer and the metal silicide layer. Moreover, it is possible to increase the adhesion between a conductive layer and the diffusion barrier layer by increasing the surface energy of the conductive layer through the surface treatment.

Abstract: A method for forming a fine pattern in a semiconductor device using a quadruple patterning includes forming a first partition layer over a first material layer which is formed over a substrate, performing a photo etch process on the first partition layer to form a first partition pattern, performing an oxidation process to form a first spacer sacrificial layer over a surface of the first partition pattern, forming a second spacer sacrificial layer over the substrate structure, forming a second partition layer filling gaps between the first partition pattern, removing the second spacer sacrificial layer, performing an oxidation process to form a third spacer sacrificial layer over a surface of the second partition layer and define a second partition pattern, forming a third partition pattern filling gaps between the first partition pattern and the second partition pattern, and removing the first and third spacer sacrificial layers.

Abstract: A method for forming a micro-pattern in a semiconductor device includes forming a hard mask layer and a sacrificial layer over an etch target layer, forming a plurality of openings having a hole shape in the sacrificial layer, forming spacers over inner sidewalls of the openings to form first hole patterns inside the openings, etching the sacrificial layer outside of the sidewalls of the openings using the spacers in a manner that the sacrificial layer in a first area remains partially and the sacrificial layer in a second area is removed to form second hole patterns, wherein the first area is smaller than the second area, and etching the hard mask layer using the remaining sacrificial layer and the spacers including the first and second hole patterns.

Abstract: A method for forming a semiconductor device includes forming an etch target layer over a substrate, forming a first etch stop layer over the etch target layer, forming a second etch stop layer over the first etch stop layer, forming a first sacrificial layer over the second etch stop layer, forming first sacrificial patterns by selectively etching the first sacrificial layer, forming second sacrificial layer over the second etch stop layer and the first sacrificial patterns, etching the second sacrificial layer and the second etch stop layer until the first sacrificial patterns are exposed and the second sacrificial layer remain only on sidewalls of the first sacrificial patterns, removing the exposed first sacrificial patterns, etching the exposed second etch stop layer mask to define a plurality of first structures, etching the first etch stop layer, and etching the etch target layer.

Abstract: A method for forming micropatterns in a semiconductor device includes forming a first etch stop layer over a etch target layer, forming a second etch stop layer over the first etch stop layer, forming a first sacrificial layer over the second etch stop layer, etching portions of the first sacrificial layer and second etch stop layer to form first sacrificial patterns, forming an insulation layer along an upper surface of the first etch stop layer, forming a second sacrificial layer over the insulation layer to cover the insulation layer, planarizing the second sacrificial layer and the insulation layer to expose the first sacrificial patterns, removing the first sacrificial patterns and the second sacrificial layer, etching the second etch stop layer and insulation layer to thereby form second sacrificial patterns, etching the first etch stop layer, and etching the etch target layer.

Abstract: Disclosed is a boiler which is easily convertible from a normal type oil boiler to a condensing type oil boiler or vice versa thereby reducing manufacturing costs for the boiler. A size and a weight of the boiler are reduced by vertically installing a latent heat exchanger in an outer housing of the boiler together with a combustion chamber and a main heat exchanger. The boiler includes a combustion chamber, a heat exchange section, and an outer housing. Coupling holes are formed in the outer housing, a circulation chamber is formed at a lower portion of the outer housing, a burner is provided at an upper portion of the combustion chamber so as to generate heat in a downward direction thereof, the combustion chamber is vertically installed in one of the coupling holes, and a lower portion of the combustion chamber is communicated with the circulation chamber. The heat exchange section includes first and second heat exchangers and is vertically installed in the outer housing adjacent to the combustion chamber.

Abstract: A method for forming a fine pattern in a semiconductor device includes forming a first polymer layer over an etch target layer, the first polymer layer including a carbon-rich polymer layer, forming a second polymer layer over the first polymer layer, the second polymer layer including a silicon-rich polymer layer, patterning the second polymer layer, oxidizing surfaces of the patterned second polymer layer, etching the first polymer layer using the patterned second polymer layer comprising the oxidized surfaces, and etching the etch target layer using the patterned second polymer layer comprising the oxidized surfaces and the etched first polymer layer.

Abstract: A method of fabricating a semiconductor device, the method includes forming gate patterns on a substrate, recessing the substrate between the gate patterns, thereby forming a first resulting structure including recesses, forming a gate spacer layer on an entire surface of the first resulting structure including the gate patterns, etching the gate spacer layer at a bottom of the recess, and forming a plug on the recess, thereby forming a second resulting structure including the plug.

Abstract: A method for forming fine patterns in a semiconductor device includes forming an etch stop layer and a sacrificial layer over an etch target layer, forming photoresist patterns over the sacrificial layer, etching the sacrificial layer by using the photoresist patterns as an etch barrier to form sacrificial patterns, forming spacers on both sidewalls of the sacrificial patterns, removing the sacrificial patterns, and etching the etch stop layer and the etch target layer by using the spacer as an etch barrier.

Abstract: An apparatus for locking a trunk of a vehicle includes a trunk lid, a driving unit for locking disposed on the trunk lid, a driven unit for locking disposed on the trunk lid, a connecting rod connecting the driven unit to the driving unit, and a support unit supporting the connecting rod to the trunk lid. The support unit includes a guider disposed on the trunk lid and a moving member disposed on the connecting rod and movably disposed on the guider. The driving unit includes a rotatable first lever attached to one end of the connecting rod. The driven unit includes a rotatable second lever attached to another end of the connecting rod.

Abstract: A method for forming a fine pattern in a semiconductor device includes forming a first polymer layer over an etch target layer, the first polymer layer including a carbon-rich polymer layer, forming a second polymer layer over the first polymer layer, the second polymer layer including a silicon-rich polymer layer, patterning the second polymer layer, oxidizing surfaces of the patterned second polymer layer, etching the first polymer layer using the patterned second polymer layer comprising the oxidized surfaces, and etching the etch target layer using the patterned second polymer layer comprising the oxidized surfaces and the etched first polymer layer.

Abstract: Disclosed is an anti-fatigue and nutritious tonic agent containing powder of wild ginseng, optionally in admixture with a herb medicine, or water extract of the powder, which has remarkably enhanced anti-fatigue, and nutrition and tonic effects as compared with agents containing cultivated ginseng.

Abstract: Disclosed is an anti-fatigue and nutritious tonic agent containing powder of wild ginseng, optionally in admixture with a herb medicine, or water extract of the powder, which has remarkably enhanced anti-fatigue, and nutrition and tonic effects as compared with agents containing cultivated ginseng.

Abstract: Disclosed is a UV blocking and slimming cosmetic composition containing laminaria water extract, octylmethoxycinnamate and oxybenzone.

Abstract: Disclosed is a UV blocking and slimming cosmetic composition containing laminaria water extract, octylmethoxycinnamate and oxybenzone.

Abstract: The present invention is related to a novel Pt(IV) complex represented by the following Chemical Formula 3 used as an anti-cancer agent and preparation method thereof. wherein, X is Cl2, and R1 and R2 are independently —OH, —Cl, —OCOCH3, —OCOCF3, —OCO(CH2)nCH3 or —OCO(CH2)nCF3 (n is an integer of 1 to 4).