Abstract: There is provided a light source module including a light emitting device, and an optical device including a first surface disposed above the light emitting device and having a hollow recessed in a light emitting direction in a central portion through which an optical axis passes, and a second surface disposed to be opposite to the first surface and configured to refract light incident through the hollow to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge connected to the first surface.

Abstract: An optical device includes a first surface facing alight source, and including a recess portion formed in a central portion of the first surface through which an optical axis of light passes and a concave-convex pattern disposed around the recess portion, and a second surface which is disposed to oppose the first surface and at which the light incident through the recess portion is refracted and emitted externally. The recess portion may be recessed in a direction in which the light is emitted. The concave-convex pattern includes a plurality of convex portions and a plurality of concave portions alternatively and repetitively arranged in a direction outwardly from the recess portion toward an edge at which the first surface is connected to the second surface.

Abstract: There is provided a lens for a light emitter which includes: a bottom surface; an incident surface connected to the bottom surface at a central region of the bottom surface and disposed on or above a light source to allow light emitted from the light source to be made incident thereto and travel in an interior of the lens; and an output surface connected to the bottom surface at an edge of the bottom surface and configured to allow the light which has traveled in the interior of the lens to be emitted outwardly therefrom, wherein the central region of the bottom surface protrudes with respect to the other region of the bottom surface.

Abstract: A method of manufacturing a light-emitting device package may include steps of preparing a light-emitting device package; holding the light-emitting device package on an inspection table; reflecting, by a reflection member, leaking blue light emitted by the light-emitting device package; capturing, by using a photographing unit, the light emitted by the light-emitting device package and the leaking blue light and generating an optical image; detecting, by a controller, the blue light from the optical image; determining a presence or absence of a defect of the light-emitting device package according to the detected blue light; and displaying the presence or absence of the defect of the light-emitting device package on a display unit.

Abstract: A light emitting module includes a light emitting unit including a plurality of light sources, a reflection unit disposed on the light emitting unit and configured to reflect light emitted from the light emitting unit, and a lens unit disposed on an optical path of the light reflected by the reflection unit. The reflection unit includes a plurality of reflection holes corresponding to the plurality of light sources and having inner walls which are provided as reflective surfaces. A depth of a reflection hole distant from an optical axis of the lens unit is greater than a depth of a reflection hole adjacent to the optical axis of the lens unit.

Abstract: A are provided a light source module. The light source module including a light emitting device configured to emit light in a light emitting direction; and an optical device including a first surface disposed over the light emitting device and having a groove recessed in the light emitting direction in a central portion through which an optical axis of the optical device passes, and a second surface disposed opposite to the first surface and configured to refract light incident through the groove to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge of the optical device connected to the first surface.

Abstract: A method for inspecting a light source module for defects includes preparing a board on which a light emitting device and a lens covering the light emitting device are installed. A current is applied to the light emitting device to turn on the light emitting device. The lens is imaged with the light emitting device turned on. A central symmetry denoting a symmetry of light emission distribution from the center of the lens is calculated based on the obtained image, and the calculated central symmetry is compared with a reference value to determine whether unsymmetrical light emission distribution has occurred. Various other methods and apparatuses for inspecting light source modules are additionally provided.

Abstract: There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

Abstract: An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

Abstract: A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

Abstract: An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

Abstract: A light source unit including a light emitting device emitting light and an optical device including a first surface having an incident surface, through which light from the light emitting device is incident, and a second surface through the incident light is outwardly emitted, wherein the first surface has a recess recessed toward the second surface and forming the incident surface, and the second surface protrudes in a dome shape from an edge of the first surface, the second surface having a concave portion depressed toward a planar portion in a center of the first surface, and the incident surface includes the planar portion at a top portion of the recess and a curved portion, the planar portion and the curved portion forming an opening, the curved portion extending between the planar portion and a portion of the first surface outside the incident surface may be provided.

Abstract: A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

Abstract: An apparatus for measurement of a three-dimensional (3D) shape includes a lens unit transmitting slit beams to a plurality of measurement objects, a light source unit irradiating the plurality of slit beams to the lens unit at different angles, an imaging unit obtaining images of the plurality of measurement objects formed by the slit beams irradiated on the plurality of measurement objects, and a calculation processing unit generating information regarding a 3D shape of the plurality of measurement objects from the images obtained by the imaging unit.

Abstract: There is provided a slit valve unit including: a body disposed on an outer side of a process chamber and having an entrance connected to an opening of the process chamber; a slit valve provided in an internal space of the body and selectively opening and closing the entrance; a plurality of packing members provided along the circumference of the entrance on an inner side of the body and tightly attached to the slit valve when the slit valve shields the entrance; and a connection pipe having one end exposed between the plurality of packing members on the inner side of the body so as to be connected to an airtight space formed among the plurality of packing members, the body, and the slit valve, and the other end exposed to the outer side of the body, the connection pipe penetrating the body.

Abstract: Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Abstract: There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

Abstract: Methods of cutting silicon substrates having a light-emitting element package. The method includes preparing a silicon substrate on which a plurality of light-emitting element chips are mounted and a transparent material layer that covers the light-emitting element chips is formed; removing the transparent material layer between the light-emitting element chips along a predetermined cutting line by using a mechanical cutting method; forming a scribing line corresponding to the predetermined cutting line on the silicon substrate by using a laser processing method; and cutting the silicon substrate to form individual light-emitting element packages by applying a mechanical impact to the silicon substrate along the scribing line. The method may enhance productivity of a cutting process of light-emitting element packages, and may prevent damage or transformation of the transparent material layer.

Abstract: A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.

Abstract: A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.