Abstract: There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.

Abstract: A light-emitting device inspecting apparatus for inspecting characteristics of a light-emitting device including one or more light-emission cells that emit light, the light-emitting device inspecting apparatus including a probing unit having a table on which the light-emitting device is mounted and probes that supply a current to the light-emitting device; an image obtaining unit for obtaining an image of the light-emitting device; and a determination unit for determining open/short defects of the light-emitting device by detecting light-emission of the one or more light-emission cells from brightness information of the image.

Abstract: A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

Abstract: An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

Abstract: A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

Abstract: An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

Abstract: There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit. There is further provided an LED testing method using the LED testing apparatus.

Abstract: A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.

Abstract: A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface. The first and second lead frames are formed at the package body to be exposed to the bottom of the concave portion. The light emitting diode chip is mounted on the bottom of the concave portion to be electrically connected to each of the first and second lead frames. The resin covering portion is formed in the concave portion to enclose the light emitting diode chip.