Patents by Inventor Won Sun Shin
Won Sun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7443039Abstract: An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.Type: GrantFiled: December 23, 2005Date of Patent: October 28, 2008Assignee: ST Assembly Test Services Ltd.Inventors: Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae-Yong Song, Won Sun Shin
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Patent number: 7306133Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.Type: GrantFiled: April 16, 2004Date of Patent: December 11, 2007Assignee: ST Assembly Test Services Ltd.Inventors: Yonggang Jin, Shelley Yong, Puay Gek Chua, Won Sun Shin
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Patent number: 7211900Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.Type: GrantFiled: May 13, 2005Date of Patent: May 1, 2007Assignee: Amkor Technology, Inc.Inventors: Won Sun Shin, Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio
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Patent number: 7190071Abstract: There is provided a semiconductor package and method for fabricating the same.Type: GrantFiled: February 24, 2004Date of Patent: March 13, 2007Assignee: Amkor Technology, Inc.Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
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Publication number: 20060197223Abstract: An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.Type: ApplicationFiled: December 23, 2005Publication date: September 7, 2006Applicant: ST ASSEMBLY TEST SERVICES LTD.Inventors: Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae-Yong Song, Won Sun Shin
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Patent number: 7005370Abstract: A method for manufacturing an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.Type: GrantFiled: May 13, 2004Date of Patent: February 28, 2006Assignee: ST Assembly Test Services Ltd.Inventors: Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae-Yong Song, Won Sun Shin
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Patent number: 6982488Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.Type: GrantFiled: June 20, 2003Date of Patent: January 3, 2006Assignee: Amkor Technology, Inc.Inventors: Won Sun Shin, Do Sung Chun, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio
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Patent number: 6940169Abstract: A torch bump is provided, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening through the first layer of dry film, the base aligns with an underlying contact pad. A second dry film is over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched. Reflow is applied to the deposited solder, creating the torch solder bump.Type: GrantFiled: March 1, 2004Date of Patent: September 6, 2005Assignee: Stats Chippac Ltd.Inventors: Yong Gang Jin, Won Sun Shin
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Publication number: 20040211817Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.Type: ApplicationFiled: April 16, 2004Publication date: October 28, 2004Applicant: ST ASSEMBLY TEST SERVICES LTD.Inventors: Yonggang Jin, Shelley Yong, Puay Gek Chua, Won Sun Shin
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Patent number: 6798049Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.Type: GrantFiled: August 24, 2000Date of Patent: September 28, 2004Assignee: Amkor Technology Inc.Inventors: Won Sun Shin, Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio
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Publication number: 20040178503Abstract: A new method and sequence is provided for the creation of solder bumps. The design of the invention implements a torch bump, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is laminated over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening created through the first layer of dry film, the created base aligns with an underlying contact pad. A second dry film is laminated over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched.Type: ApplicationFiled: March 1, 2004Publication date: September 16, 2004Applicant: ST Assembly Test Services Pte LtdInventors: Yong Gang Jin, Won Sun Shin
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Publication number: 20040164411Abstract: There is provided a semiconductor package and method for fabricating the same.Type: ApplicationFiled: February 24, 2004Publication date: August 26, 2004Applicant: Amkor Technology, Inc.Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
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Patent number: 6740577Abstract: A torch bump is provided, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening through the first layer of dry film, the base aligns with an underlying contact pad. A second dry film is over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched. Reflow is applied to the deposited solder, creating the torch solder.Type: GrantFiled: May 21, 2002Date of Patent: May 25, 2004Assignee: St Assembly Test Services Pte LTDInventors: Yong Gang Jin, Won Sun Shin
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Patent number: 6717248Abstract: There is provided a semiconductor package and method for fabricating the same.Type: GrantFiled: November 26, 2002Date of Patent: April 6, 2004Assignee: Amkor Technology, Inc.Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent D. DiCaprio
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Publication number: 20040007771Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.Type: ApplicationFiled: June 20, 2003Publication date: January 15, 2004Applicant: Amkor Technology, Inc.Inventors: Won Sun Shin, Do Sung Chun, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio
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Publication number: 20030219966Abstract: A new method and sequence is provided for the creation of solder bumps. The design of the invention implements a torch bump, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is laminated over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening created through the first layer of dry film, the created base aligns with an underlying contact pad. A second dry film is laminated over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched.Type: ApplicationFiled: May 21, 2002Publication date: November 27, 2003Applicant: St Assembly Test Services Pte LtdInventors: Yong Gang Jin, Won Sun Shin
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Publication number: 20030100142Abstract: There is provided a semiconductor package and method for fabricating the same.Type: ApplicationFiled: November 26, 2002Publication date: May 29, 2003Applicant: Amkor Technology, Inc.Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
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Patent number: 6515356Abstract: There is provided a semiconductor package and method for fabricating the same.Type: GrantFiled: May 5, 2000Date of Patent: February 4, 2003Assignee: Amkor Technology, Inc.Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
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Patent number: 6469258Abstract: A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges.Type: GrantFiled: August 23, 2000Date of Patent: October 22, 2002Assignees: Amkor Technology, Inc., Amkor Technology Korea, Inc.Inventors: Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee, Won Kyun Lee, Tae Hoan Jang, Jun Young Yang
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Patent number: RE40112Abstract: Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed.Type: GrantFiled: April 14, 2004Date of Patent: February 26, 2008Assignee: Amkor Technology, Inc.Inventors: Won Sun Shin, Do Sung Chun, Sang Ho Lee, Seon Goo Lee, Vincent DiCaprio