Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present invention discloses a transmitting and receiving method capable of estimating an accurate time and a frequency synchronization using a sequence in a filter bank multiple transmission system.

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A packet transmission method and apparatus for use in a wireless communication system and, in particular, for transmitting packets in a filter bank-based multicarrier wireless communication system.

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present invention discloses a transmitting and receiving method capable of estimating an accurate time and a frequency synchronization using a sequence in a filter bank multiple transmission system. The present invention comprises: mapping sequences corresponding to filters, respectively; adopting an auxiliary sequence which helps a sequence for a synchronization to maintain a correlation attribute; drawing the auxiliary sequence which facilitates a time and frequency synchronization estimation and does not influence a data demodulation. According to the present invention, a time and frequency synchronization may be accurately estimated through a synchronization sequence and an auxiliary sequence which are generated by a filter bank multiple transmission method.

Abstract: An apparatus and method for performing uplink scheduling in a Multiple-Input Multiple-Output (MIMO) system are provided. The method includes selecting User Equipments (UEs) as members of at least one user set for simultaneous transmission from among UEs from which channel information is received, using the channel information, and generating a power control value for each of the at least one user set and transmitting the power control value to UEs of the user set. The at least one user set includes a second user set including UEs selected according to interference that the UEs cause to a first user set from among remaining UEs unselected for the first user set, the first user set including UEs selected in a descending order of reception power from among the UEs from which the channel information is received.

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A packet transmission method and apparatus for use in a wireless communication system and, in particular, for transmitting packets in a filter bank-based multicarrier wireless communication system.

Abstract: An apparatus and method for performing uplink scheduling in a Multiple-Input Multiple-Output (MIMO) system are provided. The method includes selecting User Equipments (UEs) as members of at least one user set for simultaneous transmission from among UEs from which channel information is received, using the channel information, and generating a power control value for each of the at least one user set and transmitting the power control value to UEs of the user set. The at least one user set includes a second user set including UEs selected according to interference that the UEs cause to a first user set from among remaining UEs unselected for the first user set, the first user set including UEs selected in a descending order of reception power from among the UEs from which the channel information is received.

Abstract: The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer.

Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

Abstract: Disclosed is a method for providing a multimedia Ring Back Tone (RBT) service by using a receiver-side switching center, which comprising the steps of: (a) receiving an ISDN User Part (ISUP) call connection request message including information (multimedia codec information) regarding a multimedia codec from a caller-side switching center when the originating terminal attempts a call connection to a terminating terminal; (b) transmitting the ISUP call connection request message including the multimedia codec information to a sound source-providing server; (c) requesting the caller-side switching center to set the multimedia codec, thereby activating a routing path for the RBT service; and (d) receiving a RBT sound source selected using the multimedia codec information from the sound source-providing server and transmitting the RBT sound source to the caller-side switching center.

Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.

Abstract: The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a an electrode. The etch stop may reduce undesirable over-etching of the sacrificial layer and the electrode. The etch stop layer may also serve as a barrier layer, buffer layer, and/or template layer. The etch stop layer may include silicon-rich silicon nitride.

Abstract: Disclosed is a method and a system for setup of a multimedia codec and a voice codec between a mobile phone system and a terminal, in providing a multimedia RBT service capable of operating a multimedia codec allowing high quality music playback during an RBT interval and operating a voice codec such as an Enhanced Variable Rate Codec (Hereinafter, referred to as EVRC) during voice communication when an originating terminal supports the multimedia codec capable of improving the music quality in addition to a dedicated voice codec such as the EVRC.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.

Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.

Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.

Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.

Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.