Patents by Inventor Wonsuk Chung

Wonsuk Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080226929
    Abstract: The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a an electrode. The etch stop may reduce undesirable over-etching of the sacrificial layer and the electrode. The etch stop layer may also serve as a barrier layer, buffer layer, and/or template layer. The etch stop layer may include silicon-rich silicon nitride.
    Type: Application
    Filed: May 28, 2008
    Publication date: September 18, 2008
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Wonsuk Chung, Steve Zee, Teruo Sasagawa
  • Patent number: 7405863
    Abstract: A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: July 29, 2008
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ming-Hau Tung, Wonsuk Chung
  • Publication number: 20080151352
    Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Wonsuk Chung, SuryaPrakash Ganti, Stephen Zee
  • Patent number: 7382515
    Abstract: The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a an electrode. The etch stop may reduce undesirable over-etching of the sacrificial layer and the electrode. The etch stop layer may also serve as a barrier layer, buffer layer, and or template layer. The etch stop layer may include silicon-rich silicon nitride.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: June 3, 2008
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Wonsuk Chung, Steve Zee, Teruo Sasagawa
  • Publication number: 20080043642
    Abstract: Disclosed is a method and a system for setup of a multimedia codec and a voice codec between a mobile phone system and a terminal, in providing a multimedia RBT service capable of operating a multimedia codec allowing high quality music playback during an RBT interval and operating a voice codec such as an Enhanced Variable Rate Codec (Hereinafter, referred to as EVRC) during voice communication when an originating terminal supports the multimedia codec capable of improving the music quality in addition to a dedicated voice codec such as the EVRC.
    Type: Application
    Filed: July 8, 2005
    Publication date: February 21, 2008
    Applicant: SK TELECOM CO., LTD.
    Inventors: Seongsoo Park, Donghabk Lee, Wonsuk Chung, Seongkeun Kim, Heehyeok Hahm, Sehyun Oh, Myungsung Lee
  • Publication number: 20080025491
    Abstract: Disclosed is a method for providing a multimedia Ring Back Tone service by using a caller-side switching center, which including the steps of: (a) receiving location information of a terminating terminal, information regarding whether the terminating terminal has joined the RBT service, and information (multimedia codec information) regarding a multimedia codec supported by the originating terminal from the HLR, when the originating terminal attempts a call connection to the terminating terminal; (b) transmitting an ISDN User Part (ISUP) call connection request message including the multimedia codec information to a sound source-providing server, when the terminating terminal has joined the RBT service; (c) requesting a caller-side Base Transceiver Station (BTS) and the originating terminal to set the multimedia codec, thereby activating a routing path for the RBT service; and (d) receiving a RBT sound source selected using the multimedia codec information from the sound source-providing server and transmitti
    Type: Application
    Filed: June 28, 2005
    Publication date: January 31, 2008
    Applicant: SK TELECOM CO., LTD.
    Inventors: Seongsoo Park, Sangshin Lee, Daesic Woo, Donghahk Lee, Wonsuk Chung, Joosik Lee, Myungsung Lee
  • Publication number: 20080026731
    Abstract: Disclosed is a method for providing a multimedia Ring Back Tone (RBT) service by using a receiver-side switching center, which comprising the steps of: (a) receiving an ISDN User Part (ISUP) call connection request message including information (multimedia codec information) regarding a multimedia codec from a caller-side switching center when the originating terminal attempts a call connection to a terminating terminal; (b) transmitting the ISUP call connection request message including the multimedia codec information to a sound source-providing server; (c) requesting the caller-side switching center to set the multimedia codec, thereby activating a routing path for the RBT service; and (d) receiving a RBT sound source selected using the multimedia codec information from the sound source-providing server and transmitting the RBT sound source to the caller-side switching center.
    Type: Application
    Filed: June 28, 2005
    Publication date: January 31, 2008
    Applicant: SK TELECOM CO., LTD.
    Inventors: Seongsoo Park, Sangshin Lee, Daesic Woo, Donghahk Lee, Wonsuk Chung, Joosik Lee, Myungsung Lee
  • Publication number: 20070279753
    Abstract: A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.
    Type: Application
    Filed: June 1, 2006
    Publication date: December 6, 2007
    Inventors: Ming-Hau Tung, Wonsuk Chung
  • Publication number: 20070264979
    Abstract: Disclosed is a method for registering an IP address in a Portable Internet network in interworking with a different type of network, which enables a communication service to be continued without change in an IP address of a personal subscriber station when the personal subscriber station moves to the Portable Internet network, the method including: (a) when the personal subscriber station accesses the Portable Internet network, receiving a registration request message from the personal subscriber station, the registration request message including both information on an IP assignment method by which an IP address has been assigned to the personal subscriber station in the different type of network, and information on an IP address assigned to the personal subscriber station; and (b) registering the IP address being used by the different type of network as the IP address of the personal subscriber station by using the IP address information.
    Type: Application
    Filed: April 25, 2006
    Publication date: November 15, 2007
    Applicant: SK Telecom Co., Ltd.
    Inventors: Seongsoo Park, Donghahk Lee, Wonsuk Chung
  • Publication number: 20070170540
    Abstract: The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a an electrode. The etch stop may reduce undesirable over-etching of the sacrificial layer and the electrode. The etch stop layer may also serve as a barrier layer, buffer layer, and or template layer. The etch stop layer may include silicon-rich silicon nitride.
    Type: Application
    Filed: January 18, 2006
    Publication date: July 26, 2007
    Inventors: Wonsuk Chung, Steve Zee, Teruo Sasagawa
  • Publication number: 20070047900
    Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.
    Type: Application
    Filed: July 21, 2006
    Publication date: March 1, 2007
    Inventors: Jeffrey Sampsell, Clarence Chui, Manish Kothari, Mark Miles, Teruo Sasagawa, Wonsuk Chung, Ming-Hau Tung
  • Publication number: 20030134122
    Abstract: A method of creating a highly conductive transparent layer on a substrate without subjecting the substrate to high temperatures is disclosed. Pulsed laser energy of a wavelength and energy fluence within a selected range is used to crystallize a selected amorphous material using a low number of pulses (optimally as few as one) to form highly electrically conductive thin films that are optically transparent at visible wavelengths. This method does not subject the substrate to sustained higher temperatures and accordingly is particularly suitable for making transparent conductive thin film structures on substrates such as plastic that do not tolerate sustained higher processing temperatures.
    Type: Application
    Filed: January 14, 2002
    Publication date: July 17, 2003
    Inventors: Paul Wickboldt, Dan Toet, Wonsuk Chung