Abstract: A semiconductor device can include a semiconductor substrate having a memory cell region and a pad region that is adjacent to the memory cell region, the pad region can include a first pad region, a second pad region between the memory cell region and the first pad region, and a buffer region that is between the first and second pad regions. A separation source structure can include a first portion and a second portion that are parallel to each other in a plan view of the semiconductor device. A first source structure and a second source structure can be disposed between the first and second portions of the separation source structure, where the first and second source structures can have end portions that oppose each other, the first source structure being disposed in the first pad region, and the second source structure being disposed in the second pad region.

Abstract: A semiconductor device includes a plurality of line patterns formed apart from one another on a substrate, the plurality of line patterns having a first width and extending parallel to one another in a first direction. A first line pattern of the plurality of line patterns may include a wider portion having a second width in a second direction perpendicular to the first direction that is greater than the first width. One or more second line patterns may be located adjacent to the first line pattern and include a conformal portion conformally formed about the wider portion of the first line pattern. One or more third line patterns may be located adjacent to the second line pattern and include an end portion near the conformal portion of the one or more second line pattern.

Abstract: A semiconductor device can include a semiconductor substrate having a memory cell region and a pad region that is adjacent to the memory cell region, the pad region can include a first pad region, a second pad region between the memory cell region and the first pad region, and a buffer region that is between the first and second pad regions. A separation source structure can include a first portion and a second portion that are parallel to each other in a plan view of the semiconductor device. A first source structure and a second source structure can be disposed between the first and second portions of the separation source structure, where the first and second source structures can have end portions that oppose each other, the first source structure being disposed in the first pad region, and the second source structure being disposed in the second pad region.

Abstract: Semiconductor devices are provided. A semiconductor device includes first and second stacks of electrodes. Moreover, the semiconductor device includes first and second connection lines that connect the first and second stacks of electrodes. In some embodiments, the first connection lines have a first length and the second connection lines have a second length that is longer than the first length of the first connection lines. In some embodiments, the first connection lines connect inner portions of the first stack of electrodes to inner portions of the second stack of electrodes. In some embodiments, the second connection lines connect outer portions of the first stack of electrodes to outer portions of the second stack of electrodes.

Abstract: Semiconductor devices are provided. A semiconductor device includes first and second stacks of electrodes. Moreover, the semiconductor device includes first and second connection lines that connect the first and second stacks of electrodes. In some embodiments, the first connection lines have a first length and the second connection lines have a second length that is longer than the first length of the first connection lines. In some embodiments, the first connection lines connect inner portions of the first stack of electrodes to inner portions of the second stack of electrodes. In some embodiments, the second connection lines connect outer portions of the first stack of electrodes to outer portions of the second stack of electrodes.

Abstract: A semiconductor device includes a plurality of line patterns formed apart from one another on a substrate, the plurality of line patterns having a first width and extending parallel to one another in a first direction. A first line pattern of the plurality of line patterns may include a wider portion having a second width in a second direction perpendicular to the first direction that is greater than the first width. One or more second line patterns may be located adjacent to the first line pattern and include a conformal portion conformally formed about the wider portion of the first line pattern. One or more third line patterns may be located adjacent to the second line pattern and include an end portion near the conformal portion of the one or more second line pattern.

Abstract: A semiconductor device includes a plurality of line patterns formed apart from one another on a substrate, the plurality of line patterns having a first width and extending parallel to one another in a first direction. A first line pattern of the plurality of line patterns may include a wider portion having a second width in a second direction perpendicular to the first direction that is greater than the first width. One or more second line patterns may be located adjacent to the first line pattern and include a conformal portion conformally formed about the wider portion of the first line pattern. One or more third line patterns may be located adjacent to the second line pattern and include an end portion near the conformal portion of the one or more second line pattern.

Abstract: Semiconductor devices are provided. A semiconductor device includes first and second stacks of electrodes. Moreover, the semiconductor device includes first and second connection lines that connect the first and second stacks of electrodes. In some embodiments, the first connection lines have a first length and the second connection lines have a second length that is longer than the first length of the first connection lines. In some embodiments, the first connection lines connect inner portions of the first stack of electrodes to inner portions of the second stack of electrodes. In some embodiments, the second connection lines connect outer portions of the first stack of electrodes to outer portions of the second stack of electrodes.

Abstract: A semiconductor device includes a plurality of line patterns formed apart from one another on a substrate, the plurality of line patterns having a first width and extending parallel to one another in a first direction. A first line pattern of the plurality of line patterns may include a wider portion having a second width in a second direction perpendicular to the first direction that is greater than the first width. One or more second line patterns may be located adjacent to the first line pattern and include a conformal portion conformally formed about the wider portion of the first line pattern. One or more third line patterns may be located adjacent to the second line pattern and include an end portion near the conformal portion of the one or more second line pattern.

Abstract: Provided are a method and system for extracting intended torque for a wearable robot. The method makes use of an angle or angular velocity of rotation of a motor driving a joint and an angle or angular velocity of rotation of a link connected to the joint, and includes a friction outputting process of outputting an estimated value of friction torque from the angle of rotation of the motor, a motor torque calculating process of calculating motor torque from the angular velocity of rotation of the motor, a link rotation calculating process of calculating the angular velocity of rotation of the link, and an intended torque calculating process of substituting the motor torque and the angular velocity of rotation of the link into a disturbance observer, and calculating an estimated value of the intended torque applied by a wearer.

Abstract: A method of controlling two arms of a robot including: a finding-out step of finding out position differences in axial directions of an end of one arm and an end of the other arm; a generating step of generating a virtual force at the end of the other arm based on the position differences that have been found out; and a converting step of converting the generated virtual force into a driving torque for joints of the other arm, using a Jacobian matrix.

Abstract: An apparatus for a variable supporting foot of a robot includes a guide groove formed in a foot module of the robot and having an open end. A support plate is disposed in the guide groove and can slide out of the open end of the guide groove. A power conversion unit has one end connected to the support plate. A power generation member is connected to the other end of the power conversion unit, and has a portion at a lower end thereof that extends lower than a lower surface of the foot module. The power generation member generates a driving force as the foot module approaches the ground. The driving force is converted into a rotational motion and is transmitted to the support plate by the power conversion unit to cause the support plate to slide out of the guide groove of the foot module.

Abstract: A method of controlling the gait of a wearable robot using foot sensors of the robot. Whether or not the robot is walking is determined. When the robot is walking, whether the robot is supported on both feet or one foot using the foot sensors is determined. When the robot is walking and is supported on both feet, posture-maintaining control is carried out. When the robot is walking and is supported on one foot, support control is carried out over a supporting leg based on gravity compensation and load compensation. When the robot is walking and is supported on one foot, an imaginary repulsive force by which a swinging leg swings is generated.

Abstract: Disclosed herein is a method of obtaining the intended manipulation torque of a user for a wearable robot. The method allows the wearable robot, the motion of each joint of which is operated by a motor and which is capable of measuring a variation in current in the motor of each joint and calculating a torque at each joint, to simply and rapidly extract the intended manipulation torque of the user using both an acceleration value (e.g., measured by an acceleration sensor installed on a gripper), and the current variation of the motor, in a state in which the wearable robot does not know the weight of a weight object to be lifted with the gripper. Accordingly, the wearable robot may be suitably controlled at a comparatively lower cost.

Abstract: Disclosed herein is a method and system for controlling the lifting operation of a wearable robot. A final force that must be applied by the robot to an object upon conducting a lifting operation is derived based on a difference between a weight force applied by the object to the robot and an apply force applied by a wearing user to the robot. A target position to which the robot lifts the object is set. A spring-damper virtual force model is applied to an end of the robot and to joints of the robot, the final force is converted into final torques required by the joints of the robot by being incorporated into the virtual force model, and then the joints of the robot are operated based on the final torques. The final force is fixed once the robot has lifted the object to the target position.

Abstract: A method of improving sensitivity of a robot which includes: a calculation step, an induction step and a conversion step. The calculation step calculates angular velocities of joints of a robot. The induction step determines induced accelerations at the end of the robot by converting the angular velocities of the joints into a velocity at the end of the robot, using a Jacobian matrix, and by differentiating the velocity. The conversion step determines forces at a middle portion of the robot by multiplying the induced accelerations at the middle portion of the robot by a weight of the robot, multiplies the forces by an enhancement ratio, and then converts results of the multiplication into necessary torque at the joints, using a Jacobian matrix.

Abstract: Disclosed herein is a system and method of controlling one or more ankles of a walking robot. In the above system and method, an input torque u to be applied to an ankle of a robot is obtained by compensating a target torque ?d with an acting torque ?c measured using a sensor and applied by a support surface and then an actual torque ? applied by the ankle of a foot is instead fed back into the control system. Therefore, proper balance of the walking robot is ensured.

Abstract: A method for extracting intended torque for a wearable robot includes a motor torque calculating step, a link rotation calculating step and an intended torque calculating step. In the motor torque calculating step, motor torque is calculated from the angular velocity of rotation of the motor. In the link rotation calculating step, the angular velocity of rotation of the link is calculated. In the intended torque calculating step, the motor torque and the angular velocity of rotation of the link are substituted into a disturbance observer, and an estimated value of the intended torque applied by a wearer is calculated.

Abstract: A method includes determining whether a robot is walking and a direction in which the robot is walking; measuring an amount of time taken for a sole of a foot of the robot to step on the ground; calculating an imaginary reaction force applied to the sole using a trigonometric function having, as a period, the measured amount of time taken for the sole to step on the ground; and applying the calculated imaginary reaction force to a Jacobian transposed matrix and converting the imaginary reaction force into a drive torque for a lower extremity joint of the robot.

Abstract: A method includes: forming an imaginary wall at a position spaced apart and outward from feet of the robot when the robot is in a double-leg-support state; kinetically calculating a variation in a distance between a body of the robot and the imaginary wall and a variation in a speed of the body of the robot relative to the imaginary wall using an angle of a joint and lengths of links of the robot; applying the variation in the distance and the variation in the speed to an imaginary spring-damper model formed between the body of the robot and the imaginary wall, and calculating an imaginary reaction force required by the body of the robot; and converting the calculated reaction force into a drive torque required by the body of the robot using a Jacobian transposed matrix.