Abstract: The exemplary embodiment of the present disclosure relates to a camera module including a rear-opened front body, a rear body coupled to a rear side of the front body to form an inner space, a lens part coupled to the front body, an image sensor accommodated at the inner space to convert a light having passed the lens part to an electrical signal, a PCB (Printed Circuit Board) accommodated at the inner space and mounted with the image sensor, and a closed curve-shaped packing member interposed between the front body and the rear body, wherein the packing member includes a support part extensively formed from the packing member to an inner side, and the front body or the rear body includes a support part accommodation groove having a shape corresponding to that of the support part, whereby adhesionability during assembly of packing member can be maximized to thereby minimize an installation defect, a depressed or stamped phenomenon of a packing member that may occur during assembly process.

Abstract: A method of generating a code for a remote procedure call (RPC) includes obtaining a source code including information indicating a part where the RPC is to be performed, and generating a code for calling the RPC and a code for executing an RPC procedure, by analyzing the source code including information indicating the part where the RPC is to be performed.

Abstract: Disclosed herein is a method of preparing porous graphene from porous graphite, including 1) thermochemically reacting a highly crystalline carbide compound with a halogen element-containing gas to give a porous carbide-derived carbon; 2) treating the carbide-derived carbon with an acid, thus preparing a carbide-derived carbon oxide; and 3) reducing the carbide-derived carbon oxide. An anode mixture for a secondary battery including the graphene and an anode for a secondary battery including the anode mixture are also provided.

Abstract: A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.

Abstract: A curved display apparatus and a multi display system having the same are provided. The curved display apparatus includes a display panel, and a fixation member which fixes the display panel so that the display panel is curved with multiple curvatures.

Abstract: A curved display apparatus and a multi display system having the same are provided. The curved display apparatus includes a display panel, and a fixation member which fixes the display panel so that the display panel is curved with multiple curvatures.

Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.

Abstract: There is provided an electrode for a lithium secondary battery. The electrode include a current collector; nanoparticles distributed on a surface of the current collector, each of the nanoparticles including a transition metal or an oxide of the transition metal; and an active material layer disposed on a surface of the current collector having the nanoparticles distributed thereon. This electrode may be employed as a negative electrode for the lithium second battery, to improve a capacity of the lithium second battery.

Abstract: The present invention provides a fitting mechanism capable of distributing pressure applied on an outermost layer of plastic, and contributing to cooperation and complementary reaction between a fitting body and a ferrule body under severe temperature change. A fitting mechanism according to the present invention comprises a fitting body formed of metal, and a ferrule body formed of metal, wherein the fitting body is coupled to the ferrule body by fastening the third threaded portion of the ferrule body with the second threaded portion of the fitting body, and the fitting body slope surface is impinged onto the ferrule body slope surface forming a fluid tight contact and causing the ferrule body deformation portion to be deflected inwardly, tightened around and penetrate into outermost layer of plastic, and the outermost layer of plastic of the leading end of the multilayer composite pipe impinges onto coupling end portion.

Abstract: A liquid crystal composition includes at least one liquid crystal molecule having a positive dielectric anisotropy represented by Chemical Formula 1: In Chemical Formula 1, each of A and B is independently 1, 4-cyclohexylene or 1, 4-phenylene, C is cyclopentyl or cyclopentadienyl, each of Z1 and Z2 is independently a single bond, alkylene group, carbonyloxy, —CF2O—, —OCF2—, —CH2O—, or —OCH2—, each of L1 to L8 is independently —H, —F, —CF3, or may be difluoride (diF) when A or B is 1, 4-cyclohexylene, each of L9 to L12 is independently —H, —F, —CF3, or difluoride, each of m and n is 0 to 2, and R1 is an alkyl group or an alkoxy group, and the number of carbons of R1 is about 1 to about 10.

Abstract: Disclosed are a method of producing a metal composite powder by wire explosion in a liquid and a metal composite powder that is coated with a multi carbon layer. The production method includes a process of forming a first carbon layer on a surface of a metal wire consisting of a first metal, a process of forming a metal layer consisting of a second metal, which is different from the first metal, on a surface of the first carbon layer, and a process of forming a metal composite powder coated with a multi carbon layer by wire exploding the metal wire containing the first carbon layer and the metal layer formed on a surface thereof in a solution.

Abstract: The present invention relates to a technology enabling a normal access by controlling a read access through an arbiter in a circuit for controlling an access to memory to which clock signals are input through two ports, respectively for a read access to a single port memory. The present invention includes an arbiter that generates an internal clock signal through a state transition among a first state for generating a first clock signal, a second state for generating a second clock signal, a standby state and a neutral state when generating the internal clock signal for reading data from the memory on the basis of the first clock signal and the second clock signal, and a read end signal that is supplied from the memory.

Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.

Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.

Abstract: Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.

Abstract: The present invention provides a stack memory device and a method for operating same. The stack memory device, according to the present invention, is provided with: a first memory chip in which first type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each first type memory cell; and a second memory chip in which second type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each second type memory cell, wherein first pads are connected to the dump lines of the first type memory cells and second pads are connected to the dump lines of the second type memory cells, the first pads and the second pads having one-to-one correspondence.

Abstract: A semiconductor apparatus having a heat dissipating function and electronic equipment comprising the same includes a front surface on which semiconductor devices constituting a circuit a circuit are formed; and a rear surface including a convexo-concave surface. Thus, the heat dissipation effect of the semiconductor apparatus can be maximized even without attaching a heat dissipation plate thereto.

Abstract: A sensing block having a block body and a first connecting member of conductive material. The block body includes a terminal seat section and a cell lead coupling section provided on one or both sides of the terminal seat section. The first connecting member is positioned to correspond to the terminal seat section.

Abstract: An exemplary embodiment of the present invention includes a PCB (Printed Circuit Board) mounted with an image sensor, a plurality of coil units arranged at an upper surface of the PCB, a housing member arranged at the upper surface of the PCB and provided with a magnet at a position corresponding to that of the coil unit, and a ball guide unit arranged at a surface opposite to the PCB of the housing member.

Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.