Abstract: A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Abstract: A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Abstract: A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Abstract: A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Abstract: In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Abstract: A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Abstract: In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Abstract: A non-volatile memory device includes an upper semiconductor layer vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group.

Abstract: In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Abstract: A non-volatile memory device includes an upper semiconductor layer vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group.

Abstract: In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Abstract: Provided is a programming method of a nonvolatile memory device including a plurality of memory cells. The programming method of the nonvolatile memory device includes: programming a first set of memory cells of the plurality of memory cells to a target state based on a primary program voltage such that a threshold voltage distribution of the first set of memory cells is formed; grouping the first set of memory cells into a plurality of cell groups at least one cell group having a different threshold voltage distribution width from others, based on program speeds of the first set of memory cells; and reprogramming remaining cell groups other than a first cell group that is programmed to the target state among the plurality of cell groups, to the target state based on a plurality of secondary program voltages determined based on threshold voltage distribution widths of the plurality of cell groups.

Abstract: In a method of reading data in a nonvolatile memory device including a plurality of memory cells arranged at intersections of a plurality of word-lines and a plurality of bit-lines, a read request on a first word-line of the plurality of word-lines is received, a read operation is performed on a second word-line adjacent to the first word-line and a read operation is performed on the first word-line based on data read from memory cells of the second word-line. The read operation on the first word-line is performed by adjusting a level of recover read voltage applied to the first word-line during the read operation of the first word-line based on at least one of a program state of the data read from memory cells of the second word-line and an operating parameter of the nonvolatile memory device.

Abstract: Provided is a programming method of a nonvolatile memory device including a plurality of memory cells. The programming method of the nonvolatile memory device includes: programming a first set of memory cells of the plurality of memory cells to a target state based on a primary program voltage such that a threshold voltage distribution of the first set of memory cells is formed; grouping the first set of memory cells into a plurality of cell groups at least one cell group having a different threshold voltage distribution width from others, based on program speeds of the first set of memory cells; and reprogramming remaining cell groups other than a first cell group that is programmed to the target state among the plurality of cell groups, to the target state based on a plurality of secondary program voltages determined based on threshold voltage distribution widths of the plurality of cell groups.

Abstract: Provided is a programming method of a nonvolatile memory device including a plurality of memory cells. The programming method of the nonvolatile memory device includes: programming a first set of memory cells of the plurality of memory cells to a target state based on a primary program voltage such that a threshold voltage distribution of the first set of memory cells is formed; grouping the first set of memory cells into a plurality of cell groups at least one cell group having a different threshold voltage distribution width from others, based on program speeds of the first set of memory cells; and reprogramming remaining cell groups other than a first cell group that is programmed to the target state among the plurality of cell groups, to the target state based on a plurality of secondary program voltages determined based on threshold voltage distribution widths of the plurality of cell groups.

Abstract: In a method of reading data in a nonvolatile memory device including a plurality of memory cells arranged at intersections of a plurality of word-lines and a plurality of bit-lines, a read request on a first word-line of the plurality of word-lines is received, a read operation is performed on a second word-line adjacent to the first word-line and a read operation is performed on the first word-line based on data read from memory cells of the second word-line. The read operation on the first word-line is performed by adjusting a level of recover read voltage applied to the first word-line during the read operation of the first word-line based on at least one of a program state of the data read from memory cells of the second word-line and an operating parameter of the nonvolatile memory device.

Abstract: A row decoder of the semiconductor memory device includes a decoding and precharging unit that is connected between a high voltage node and a block word line, wherein the decoding and precharging unit precharges the block word line, and wherein the decoding and precharging unit includes one or more decoding transistors that decode an address and form a transmission path for transmitting a block selection voltage. The row decoder further includes a pass transistor block that transmits one or more row driving voltages to row lines in response to the block selection voltage, wherein the block selection voltage is boosted according to a switching operation of the pass transistor block.

Abstract: Provided is a programming method of a nonvolatile memory device including a plurality of memory cells. The programming method of the nonvolatile memory device includes: programming a first set of memory cells of the plurality of memory cells to a target state based on a primary program voltage such that a threshold voltage distribution of the first set of memory cells is formed; grouping the first set of memory cells into a plurality of cell groups at least one cell group having a different threshold voltage distribution width from others, based on program speeds of the first set of memory cells; and reprogramming remaining cell groups other than a first cell group that is programmed to the target state among the plurality of cell groups, to the target state based on a plurality of secondary program voltages determined based on threshold voltage distribution widths of the plurality of cell groups.

Abstract: A row decoder of the semiconductor memory device includes a decoding and precharging unit that is connected between a high voltage node and a block word line, wherein the decoding and precharging unit precharges the block word line, and wherein the decoding and precharging unit includes one or more decoding transistors that decode an address and form a transmission path for transmitting a block selection voltage. The row decoder further includes a pass transistor block that transmits one or more row driving voltages to row lines in response to the block selection voltage, wherein the block selection voltage is boosted according to a switching operation of the pass transistor block.

Abstract: A method of providing an operating voltage in a memory device includes applying a read voltage to a selected word line while applying a first pass voltage to at least one unselected word line among word lines adjacent to the selected word line; and while applying a second pass voltage to the remaining unselected word lines (other than the at least one unselected word line to which the first pass voltage is applied). The level of the first pass voltage is higher than the level of the second pass voltage. The level of the first pass voltage may be set based on the level of the read voltage.