Abstract: A stereoscopic display device including a barrier panel is provided. When a viewing distance of a viewer is out of the proper range, the stereoscopic display device may shift the blocking regions and the transmitting regions of the barrier panel. The stereoscopic display device may maintain the ratio of channels located within a barrier blocking region and a barrier transmitting region of the barrier panel by using the channels disposed within trigger regions of the barrier panel. Thus, the stereoscopic display device may provide a stereoscopic image of good quality to the viewer located at a region being out of the proper range.

Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.

Abstract: A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

Abstract: A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

Abstract: A stereoscopic display device having a barrier panel is provided. The barrier panel may include channel electrodes across an active area. Each of the channel electrodes may include an end portion connected to corresponding link line. Each of the channel electrodes may be connected to the link line same as (n+1)th channel electrode from the channel electrode. The barrier panel may further include connecting lines to connect between opposite end portions of the channel electrode which are connected to the same link line. Thus, in the stereoscopic display device, the number of the wires extending along an edge of the active area may be reduced.

Abstract: A stereoscopic display device having a barrier panel is provided. The barrier panel may include lower channels, a channel insulating layer and upper channels, which are sequentially stacked on a barrier panel. The lower channels may be disposed between the upper channels. Each of the lower channels may include a first sub-channel, a second sub-channel and a lower insulating layer. The lower insulating layer may be spaced away from the first sub-channel. The second sub-channel may be connected to an end region of the first sub-channel facing the upper channels. The second sub-channel may be extended along a side wall of the lower insulating layer facing the first sub-channel. Thus, in the stereoscopic display device according to the embodiment of the present disclosure, a distance between the lower channels may be minimized.

Abstract: A stereoscopic display device has a barrier panel. The barrier panel of the stereoscopic display device may include sequentially stacked first channel electrodes, second channel electrodes, and third channel electrodes. Each of the third channel electrodes may be disposed between the second channel electrodes. A distance between the third channel electrodes may be the same as a horizontal width of each third channel electrode. Each of the first channel electrodes may include a first region overlapping with an end portion of the second channel electrode, and a second region overlapping with an end portion of the third channel electrode facing the end portion of the second channel electrodes overlapping with the first region of adjacent first channel electrode. Thus, in the stereoscopic display device, the number of stacked layers of the channel electrodes may be minimized, a proper viewing range for a stereoscopic image may be smoothly moved.

Abstract: A stereoscopic display device having a barrier panel is provided. The barrier panel can include channel electrodes to form transmitting regions and blocking regions in an active area, and link lines to provide a signal to the channel electrodes. The stereoscopic display device can include a display driver driving a display panel; a barrier panel on the display panel, the barrier panel including channel electrodes across an active area, and link lines disposed outside the active area; and a barrier driver controlling the channel electrodes through the link lines, wherein the number of the link lines in which each channel electrode crosses, is constant. Thus, in the stereoscopic display device, a dark spot due to a load deviation of the channel electrodes can be prevented.

Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

Abstract: A stereoscopic display device including a barrier panel is provided. When a viewing distance of a viewer is out of the proper range, the stereoscopic display device may shift the blocking regions and the transmitting regions of the barrier panel. The stereoscopic display device may maintain the ratio of channels located within a barrier blocking region and a barrier transmitting region of the barrier panel by using the channels disposed within trigger regions of the barrier panel. Thus, the stereoscopic display device may provide a stereoscopic image of good quality to the viewer located at a region being out of the proper range.

Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.

Abstract: A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

Abstract: A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.

Abstract: A test carrier includes an insert body, a first latch assembly including one or more first latches pivotally attached to the insert body, and a second latch assembly including one or more second latches pivotally attached to the insert body. The second latch assembly is configured to engage with an external connection terminal array of an electronic component during testing thereof. A method of testing a semiconductor device and a system for testing a semiconductor device are also provided.

Abstract: A test carrier includes an insert body, a first latch assembly including one or more first latches pivotally attached to the insert body, and a second latch assembly including one or more second latches pivotally attached to the insert body. The second latch assembly is configured to engage with an external connection terminal array of an electronic component during testing thereof. A method of testing a semiconductor device and a system for testing a semiconductor device are also provided.

Abstract: Provided herein are systems and methods that provide community based voting and/or actionable multi-media messaging in a social network. In an embodiment, actionable multi-media messaging is provided, in which the user receives a message comprising an actionable item that the user can act on. The actionable item can be, e.g., to purchase an item, to vote on a ballot, or other actions that can be taken by the user. In another embodiment, community based voting is provided, in which a user receives a message comprising a voting ballot. In this embodiment, the user can vote on the ballot, and publish his/her vote to his/her social network, e.g., to express his/her likes and dislikes. The user can also forward the ballot to other users in his/her social network, and view how other individual users in his/her the social network have voted.

Abstract: A method for cleaning a socket used to test semiconductor packages using laser beam is provided. The method may include irradiating laser beam onto a socket have a plurality of contact pins to remove contaminated materials on the contact pins.