Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Abstract: A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.