Abstract: There are provided a transparent panel and a method of manufacturing the same. The transparent panel includes a transparent substrate; and a transparent electrode layer formed on the transparent substrate, wherein the transparent electrode layer includes a first area having non-electrical conductivity and a second area having electrical conductivity, and the first area includes a graphene oxide, and the second area includes a reduced graphene oxide. Accordingly, a sensing electrode may be formed without a step to thereby minimize a pattern exposure phenomenon, and the manufacturing process may be simplified.

Abstract: Disclosed is a touch panel 100, which includes a transparent substrate 110 that includes a base part 120 and a projection part 130 projected from the base part 120, a transparent electrode 140 that is formed on the base part 120, signal wirings 150 that are formed on the transparent substrate, having one end connected to the transparent electrode 140 and the other end extended to the projection part 130, and a controller 160 that is disposed on the projection part 130 and is directly connected to the other end of the signal wiring 150. The touch panel directly connects the signal wirings 150 to the controller 160 by adopting the projection part 130 to the transparent electrode 140, thereby making it possible to omit the flexible printing cable requiring manual work, and thus allows the roll to roll (R2R) process, thereby making it possible to automate the entire manufacturing process of the touch panel 100.

Abstract: There is provided an electrode paste composition, an electrode for an electronic device using the same, and a method of manufacturing the same. The electrode for an electronic device includes: a substrate; a thin film layer formed on the substrate, the thin film layer including reduced graphene oxide (rGO); and an oxide layer formed between the substrate and the thin film layer. The electrode for an electronic device may have excellent uniform resistivity and electrical conductivity since the electrode is formed by coating the substrate with a solution containing graphene oxide having superior dispersibility and reducing the graphene oxide.

Abstract: Disclosed herein is a resistive touch screen. The resistive touch screen includes a resistive touch panel configured to include a lower substrate formed with a lower electrode pattern in an active region through which images pass, an upper substrate formed with an upper electrode pattern to be opposite to the lower electrode pattern, and a spacer spacing the upper substrate from the lower substrate in order to contact the upper electrode pattern to the lower electrode pattern by external pressure; and a window bonded to the upper portion of the resistive touch panel by an optical clear adhesive, and including a covering film formed in the outer side region on the lower surface thereof and an elastic suppressing layer formed in the inner side region of the covering film.

Abstract: Disclosed herein are a capacitive touch screen and a method for manufacturing the same. The capacitive touch screen includes: a base member on which a plurality of electrode patterns are formed; conductive adhesive members formed at ends of the electrode patterns; a window disposed over the base member and having a plurality of electrode wirings formed in an outer region thereof, the plurality of electrode wirings being opposite to the electrode patterns; and auxiliary electrodes formed at one of the ends of the electrode wirings to conduct the electrode patterns with the electrode wirings by the conductive adhesive members.

Abstract: Disclosed herein is a touch screen device, including: a first transparent electrode formed on one surface of a first transparent substrate to sense a touched input; a second transparent electrode formed on one surface of a second transparent substrate formed to be opposite to the first transparent electrode to sense a touched input; a display formed on the other surface of the second transparent substrate; a first adhesive layer bonding the first transparent substrate to the second transparent substrate; and a second adhesive layer bonding a first connection part formed on an outer side of first transparent substrate to a second connection part formed on an outer side of the display. The touch screen device directly bonds the first transparent substrate to the display, thereby making it possible to provide a high definition image to a user and to reduce infiltration of moisture or the like.

Abstract: Disclosed herein is a display apparatus having a touch screen panel including: a housing of which first surface is open; a main circuit substrate that is built-in the housing; a display unit that is connected to the main circuit substrate and is disposed to face the opened first surface of the housing; and a touch screen panel that is connected to the main circuit substrate and is positioned on the upper portion of the display unit and includes an active region disposed on the first surface and inactive regions that are extended from the active region and are disposed at side surfaces of the housing or on a second surface opposite to the first surface.

Abstract: Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.

Abstract: A metal powder including a graphene layer irregularly formed on a surface of the metal powder, a method for preparing the same, and a multilayered ceramic capacitor including an inner electrode using the metal powder. By using the metal powder having the graphene irregularly formed on the surface thereof as the inner electrode material of the multilayered ceramic capacitor, and allowing the necking phenomenon to occur on only the surface where the graphene is not formed, the necking of the metal powder is delayed and the shrinkage of the inner electrode is controlled, so that reduction of the thickness of the inner electrode and disconnection/crack can be prevented.

Abstract: Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes.

Abstract: There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad.

Abstract: Disclosed herein is a resistive touch screen, including: a transparent film 100 that has a first transparent electrode 110 and is bent when the transparent film 100 is pressed; a dot spacer 200 that is formed on one surface of the first transparent electrode 110 and is configured to include a plurality of projection members 210; a transparent substrate 300 that has a second transparent electrode 310; and an adhesive layer 400 that adheres the edge of the transparent film 100 to the edge of the transparent substrate 300, wherein the side surfaces of the plurality of projection members 210 are closely adhered to each other but when the transparent film 100 is bent, the side surfaces of the plurality of projection members 210 are spaced from each other.

Abstract: A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Abstract: Disclosed herein is a touch panel. A touch panel according to a first preferred embodiment of the present invention includes: a base member; a transparent electrode formed in an active area of the base member; an insulator formed in a bezel area of the base member, and convexly protruded from the base member; and an electrode wiring formed on an exposed surface of the insulator. In addition, a touch panel according to a second preferred embodiment of the present invention includes: a base member having a groove portion formed such that an exposed surface thereof has a concave curved surface; a transparent electrode formed in an active area; and an electrode wire connected to one end or both ends of the transparent electrode and formed on the exposed surface of the groove portion.

Abstract: Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.

Abstract: A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board.

Abstract: A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

Abstract: Disclosed herein is a resistive type touch panel according to a preferred embodiment of the present invention. The resistive type touch panel includes a transparent substrate; a transparent electrode formed on one surface of the transparent substrate and made of a conductive polymer; and a plurality of conductive balls formed on the transparent electrode and having conductivity. According to the present invention, the conductive balls are included in the transparent electrode made of the conductive polymer to improve the conductivity of the transparent electrode and the conductive balls are formed on the transparent electrode at a predetermined interval, thereby making it possible to constantly maintain the thickness of the transparent electrode. Further, the conductive balls are formed on the transparent electrode to reduce the contact resistance value generated when the resistive type touch panel is touched, thereby making it possible to improve the reliability of the operation of the touch panel.

Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.