Abstract: A charge pump circuit includes a voltage input port, a voltage output port, a plurality of charge pump units cascaded between the voltage input port and the voltage output port, a clock signal source, and N clock delay elements. The clock signal source generates a main clock signal and the N clock delay elements generate clock signals received by the charge pump units by delaying the main clock signal. The main clock signal received by the first charge pump unit has a rising edge leading a rising edge of the last clock signal received by the last charge pump unit, and a falling edge lagging the rising edge of the last clock signal. Each of the charge pump units includes two sets of inverters with delay elements for generating two complementary clock signals.

Abstract: A semiconductor device includes a first dielectric layer, a second dielectric layer and a memory device. The second dielectric layer includes a first layer and a second layer. The memory device includes a first conductive structure under the first dielectric layer, a second conductive structure over the second dielectric layer, and a memory cell between the first and the second dielectric layers. The memory cell includes a bottom electrode via, a bottom electrode over the bottom electrode via, a top electrode over the bottom electrode, a top electrode via over the top electrode, and a MTJ between the top electrode and the bottom electrode. The second layer of the second dielectric layer surrounds sidewalls of the top electrode via entirely. The first layer of the second dielectric layer surrounds sidewalls of the bottom electrode entirely, sidewalls of the MTJ entirely, and sidewalls of the top electrode entirely.

Abstract: A substrate structure includes at least one detachable first substrate unit and a substrate body. The detachable first substrate unit includes a plurality of corners and a plurality of first engagement portions. Each of the first engagement portions is disposed at each of the corners of the detachable first substrate unit. The substrate body includes a plurality of second substrate units, at least one opening and a plurality of second engagement portions. The opening is substantially defined by a plurality of sidewalls of the second substrate units, and includes a plurality of corners. Each of the second engagement portions is disposed at each of the corners of the opening. The detachable first substrate unit is disposed in the opening, and the second engagement portions are engaged with the first engagement portions.

Abstract: A semiconductor device includes a first conductive wiring, at least one first dielectric layer, at least one second dielectric layer and a second conductive wiring. The at least one first dielectric layer is over the first conductive wiring. The at least one second dielectric layer is over the at least one first dielectric layer. The second conductive wiring is over the at least one second dielectric layer. The dielectric constant of the at least one second dielectric layer is higher than the dielectric constant of the at least one first dielectric layer.

Abstract: A spectrometer (100) and an optical input portion (32) thereof are disclosed. The optical input portion (32) comprises an assembly structure (322), and the assembly structure (322) is formed at a hole wall (321) of a through hole (3211) of the optical input portion (32). A light (L1) is incident into a dispersing element (2) of the spectrometer (100) along an optical path (13) after passing through the through hole (3211), and is dispersed by the dispersing element (2). The assembly structure (322) is used to be detachably assembled with an optical element (200). When the optical element (200) is assembled with the assembly structure (322), an optical axis of the optical element (200) is linked to the optical path (13). As a result, the light (L1) passing through the optical element (200) is incident to the dispersing element (2) along the optical axis and the optical path (13).

Abstract: An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.

Abstract: A four-phase charge pump circuit provided includes multiple boosting stages. Each boosting stage includes two branch charge pumps. Each branch charge pump includes a main pass transistor and a pre-charge transistor. Two ends of the main pass transistor serve as a first node and a second node of the branch charge pump respectively. A first end, a second end and a control end of the pre-charge transistor are coupled to a control end of the main pass transistor, a second node and a first node of the branch charge pump respectively. At least one boosting stage further includes two auxiliary start-up transistors. Two ends of each auxiliary start-up transistor are coupled to the control end of one main pass transistor and the second node of the branch charge pump respectively. A control end of each auxiliary start-up transistor is coupled to the control end of one main pass transistor.

Abstract: A four-phase charge pump circuit provided includes multiple boosting stages. Each boosting stage includes two branch charge pumps. Each branch charge pump includes a main pass transistor and a pre-charge transistor. Two ends of the main pass transistor serve as a first node and a second node of the branch charge pump respectively. A first end, a second end and a control end of the pre-charge transistor are coupled to a control end of the main pass transistor, a second node and a first node of the branch charge pump respectively. At least one boosting stage further includes two auxiliary start-up transistors. Two ends of each auxiliary start-up transistor are coupled to the control end of one main pass transistor and the second node of the branch charge pump respectively. A control end of each auxiliary start-up transistor is coupled to the control end of one main pass transistor.

Abstract: A charge pump circuit includes a voltage input port, a voltage output port, a plurality of charge pump units cascaded between the voltage input port and the voltage output port, a clock signal source, and N clock delay elements. The clock signal source generates a main clock signal and the N clock delay elements generate clock signals received by the charge pump units by delaying the main clock signal. The main clock signal received by the first charge pump unit has a rising edge leading a rising edge of the last clock signal received by the last charge pump unit, and a falling edge lagging the rising edge of the last clock signal. Each of the charge pump units includes two sets of inverters with delay elements for generating two complementary clock signals.

Abstract: A block, and a backlight module and a display device using the block are provided. The block includes a capsule enclosing a cavity therein and a phase change material received in the cavity. The capsule is at least partially made of an elastic material. The phase change material has a melting point lower than the elastic material. The backlight module includes an optical film, a frame at least partially surrounding a side of the optical film, and the block disposed between the side of the optical film and the frame. The display device includes a display panel, a frame having an accommodation area for accommodating the display panel, and the block disposed between the display panel and the frame.

Abstract: A charge pump circuit includes a voltage input port, a voltage output port, a plurality of charge pump units cascaded between the voltage input port and the voltage output port, a clock signal source, and N clock delay elements. The clock signal source generates a main clock signal and the N clock delay elements generate clock signals received by the charge pump units by delaying the main clock signal. The main clock signal received by the first charge pump unit has a rising edge leading a rising edge of the last clock signal received by the last charge pump unit, and a falling edge lagging the rising edge of the last clock signal. Each of the charge pump units includes two sets of inverters with delay elements for generating two complementary clock signals.

Abstract: An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.

Abstract: A semiconductor device includes a first conductive wiring, at least one first dielectric layer, at least one second dielectric layer and a second conductive wiring. The at least one first dielectric layer is over the first conductive wiring. The at least one second dielectric layer is over the at least one first dielectric layer. The second conductive wiring is over the at least one second dielectric layer. The dielectric constant of the at least one second dielectric layer is higher than the dielectric constant of the at least one first dielectric layer.

Abstract: Methods and devices for sharing services among multiple devices are provided. The methods and devices may involve multiple devices and a service-sharing platform that allows multiple different services available on the multiple devices to be shared among the multiple devices. One device may lack a service and request that service from one or more other devices that have the service. The methods and devices may further involve an iptables-based routing technique to connect or transmit data from one device to one or more other devices. The technique may comprise marking communications of one device based on a marking feature of iptables and creating a rule for the marked communications. The rule may instruct the marked communications to look up a routing table and to be routed to a default route of the routing table.

Abstract: A laminating device for composite material includes a laser device, a hot roller assembly which has a first hot roller and a second hot roller, a cool roller assembly which has a first cool roller and a second cool roller, an axial roller-driving unit and a spring force-adjusting unit. The laser device provides a laser beam onto laminating surfaces of two separate composite materials prior to the hot roller assembly. The axial roller-driving unit drives the first hot roller and the second hot roller, and the first cool roller and the second cool roller, to undergo relative movement in a first direction. The spring force-adjusting unit provides spring forcing to the first hot roller and the second hot roller, and the first cool roller and the second cool roller, to ensure further the lamination of the two composite materials.

Abstract: A charge pump circuit includes a first charge pump unit and a second charge pump unit. The first charge pump unit pumps an input voltage to output a first pumped voltage according to a first clock signal, a second clock signal and a third clock signal. The second charge pump unit pumps the first pumped voltage to output a second pumped voltage according to the first clock signal, a fourth clock signal and the third clock signal. The first clock signal and the third clock signal are non-overlapping clock signals. A falling edge of the second clock signal leads a rising edge of the first clock signal. A falling edge of the fourth clock signal leads a rising edge of the third clock signal.

Abstract: A feeding device and a variable squeezing mouth are provided. The feeding device includes a first roller, a second roller and a middle guiding structure. The second roller and the first roller have a first zone therebetween. At least a part of the middle guiding structure is positioned in the first zone. The middle guiding structure has a passage being aligned with and connected to the first zone. The variable squeezing mouth includes a main body, a collet and a nut. The collet includes a base and at least two arms. The arms form a filament outlet. While the nut or the collet is moved with respect to the main body, the at least two arms and the nut are pressed against each other, so that a distance between the at least two arms is changed, and the size of the filament outlet is changed.

Abstract: The present invention relates to a thermoforming mold for EVA, comprising an upper aluminum mold and a lower aluminum mold, both of which are hinged and each provided with a handle, wherein, the upper aluminum mold is provided with a raised pattern, and the lower aluminum mold is provided with a sunken cavity, characterized in that an upper passage passing through the inside of the pattern is provided inside the upper aluminum mold, a lower passage passing through the bottom of the cavity is provided inside the lower aluminum mold, the upper passage has a first opening in the inner surface of the upper aluminum mold, the lower passage has a second opening corresponding to and communicated with the first opening in the inner surface of the lower aluminum mold, and both sides of the lower passage are provided with a vapor/water inlet and a vapor/water outlet respectively.

Abstract: A driving circuit includes a first driver, a switching circuit and a second driver. The first driver receives an input signal and an inverted input signal, and generates a driving signal. The switching circuit receives the driving signal and a first mode signal. Moreover, an output signal is outputted from an output terminal. The second driver is connected with the output terminal.

Abstract: Systems and methods relating generally to data storage, and more particularly to systems and methods for encoding to modify the size of an information set.