Abstract: An LED device including a support structure with at least one LED die mounted thereon, a recess formed in a part of the support structure from a side of the LED die, and a lens formed over the support structure to encapsulate the LED die and the recess, thereby forming a protrusion in the support structure is disclosed.

Abstract: A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

Abstract: An illumination device includes a light source generating initial light beams, a lens assembly disposed on an axis, and a reflector comprising a reflecting surface. The initial light beams include a first and second reference light beams traveling along a first and second positions, respectively. The first reference light beam passes through the lens assembly to form a first predetermined light beam traveling away from the light source. A first angle is substantially formed between the first position and the axis. The second reference light beam is reflected by the reflective surface to form a second predetermined light beam traveling away from the light source. A second angle is formed between the first and second positions. The first angle is less than or equal to the second angle. The initial light beams are guided by the lens assembly and the reflector to emit the light beams in a projecting mode.

Abstract: A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.

Abstract: A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

Abstract: A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.

Abstract: An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.

Abstract: A micro electromechanical differential actuator is comprised of a suspension arm structure and/or a bridge structure to make a two-degree-of-freedom and bi-directional motion. The actuator support base can make out-of-plane or in-plane vertical and horizontal motions. The invention is applicable in optical micro electromechanical devices such as optical switches, variable optical attenuators, optical tunable filters, modulators, tunable VCSEL's, grating modulators, micro displays, and RF switches.

Abstract: A micro electromechanical differential actuator is comprised of a suspension arm structure and/or a bridge structure to make a two-degree-of-freedom and bi-directional motion. The actuator support base can make out-of-plane or in-plane vertical and horizontal motions. The invention is applicable in optical micro electromechanical devices such as optical switches, variable optical attenuators, optical tunable filters, modulators, tunable VCSEL's, grating modulators, micro displays, and RF switches.